SURESH V

SURESH V. GARIMELLA

EDUCATION

Ph.D., Mechanical Engineering, University of California at Berkeley, 1989

M.S., Mechanical Engineering, The Ohio State University, Columbus, 1986

Bachelor of Technology, Mechanical Engineering, Indian Institute of Technology, Madras, 1985

PROFESSIONAL EXPERIENCE

Jul 19 - Present

President, University of Vermont

Professor, Department of Mechanical Engineering, UVM

Distinguished Professor Emeritus of Mechanical Engineering, Purdue University

Executive Vice President for Research and Partnerships Emeritus, Purdue University

May 19 -

Present Member, Sandia National Laboratories Chief Research Officer External Advisory Board

Nov 18 - Present Member, National Science Board

Jun 14 - Jun 19 Executive Vice President for Research and Partnerships, Purdue University

May 13 - Jun 14 Chief Global Affairs Officer, Purdue University

Aug 11 - May 13 Associate Vice President for Engagement, Purdue University

Aug 11 - Jul 15 Senior Fellow, Energy & Climate Partnership of the Americas (ECPA), US State Department

Aug 10 - Jul 19 Jefferson Science Fellow, US Department of State

Dec 09 - Jun 19 R. Eugene and Susie E. Goodson Distinguished Professor, Purdue University

Jun 06 - Jun 19 R. Eugene and Susie E. Goodson Chair Professor, Purdue University

Jul 08 - Jun 13 Fellow, Center of Smart Interfaces, Technical University of Darmstadt, Germany

Jun 06 - May 09 Honorary Guest Professor, Xi’an JiaoTong University, Xi’an, China

Aug 02 - Jun 19 Professor, School of Mechanical Engineering, Purdue University

Jun 02 - Jul 04 Chair, Heat Transfer Area, School of Mechanical Engineering, Purdue University

Aug 99 - Jun 19 Director, Cooling Technologies Research Center, a National Science Foundation

Industry/University Cooperative Research Center

Aug 99 - Jul 02 Associate Professor, School of Mechanical Engineering, Purdue University

Aug 94 - Jul 99 Cray-Research Associate Professor of Mechanical Engineering, UW-Milwaukee

Jun 95 - Jan 96 Honorary Visiting Fellow, The University of New South Wales, Sydney, Australia

Aug 92 - Jul 94 Cray-Research Assistant Professor of Mechanical Engineering, UW-Milwaukee

Aug 90 - Jul 92 Assistant Professor of Mechanical Engineering, UW-Milwaukee

Jan 90 - Jul 90 Instructor in Mechanical Engineering, University of California at Berkeley

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HONORS & AWARDS

Member, National Science Board (NSB), appointed by the President of the United States for a six-year term to

advise the President and Congress on science policy and oversee the National Science Foundation, 2018;

Chair, Committee on Strategy; Member, Committee on Science and Engineering Policy, Science and Security

Working Group, and Committee on Nominations; NSB liaison to President’s Council of Advisors on Science

and Technology. Seminal reports: Vision 2030; The Skilled Technical Workforce; and

The State of U.S.

Science & Engineering

Member, Vermont Academy of Science and Engineering, elected 2019

Member, Sandia National Laboratories Chief Research Officer External Advisory Board (CEAB), since 2019

Fellow, National Academy of Inventors, elected 2017, for having “demonstrated a highly prolific spirit of

innovation in creating or facilitating outstanding inventions that have made a tangible impact on quality of

life, economic development, and the welfare of society”

2016 ITHERM Achievement Award, IEEE Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems (ITherm), presented biennially in recognition of significant contributions

made in thermal and thermomechanical management of electronics, June 2016

Charles Russ Richards Memorial Award, Pi Tau Sigma and American Society of Mechanical Engineers, 2014

Anniversary Medal, Heat Transfer Division, American Society of Mechanical Engineers, June 2013

Dick Ramey Above and Beyond Award, 2012, Indiana Association of School Principals, presented annually to an

individual or institution for contributions to the success of academic competitions through their passion for

extra-curricular activities benefiting Indiana’s students

Fellow, American Association for the Advancement of Science (AAAS), 2011

Invited Plenary Session Panelist, Foundations for Sustainable Partnerships in Teaching and Research, U.S.-India

Higher Education Summit hosted by U.S. Secretary of State Hillary Clinton and Indian Minister of Human

Resource Development Kapil Sibal, Washington, D.C., October 13, 2011

Senior Fellow, Energy and Climate Partnership of the Americas (ECPA), U.S. Department of State, 2011-2015.

Senior Fellows help to advance regional cooperation in sustainable energy generation, access, and

resilience, bringing their academic, finance, technology, policy, and government experience.

Alexander Schwarzkopf Prize for Technology Innovation, National Science Foundation Industry University

Cooperative Research Center (IUCRC) Association, 2011

Heat Transfer Memorial Award, American Society of Mechanical Engineers, 2010

Jefferson Science Fellow, U.S. Department of State, August 2010 to July 2016

Distinguished Alumnus Award of IIT Madras, Indian Institute of Technology, Madras, 2010

Allan Kraus Thermal Management Medal, American Society of Mechanical Engineers, 2009

The Harvey Rosten Award for Excellence, presented at SemiTHERM 2010, Santa Clara, California

Gustus L. Larson Memorial Award, Pi Tau Sigma and American Society of Mechanical Engineers, 2004

Fellow, American Society of Mechanical Engineers, 2002

K16 Clock Award, ASME Heat Transfer Division K-16 Committee, 2006

Fellow, Center of Smart Interfaces, Technical University of Darmstadt, Germany, since July 2008

Honorary Guest Professor, Xi’an JiaoTong University, Xi’an, China, 2006 to 2009

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Member, Scientific Council, International Centre for Heat and Mass Transfer (ICHMT), 2009 to present

Invited Participant, 2006 U.S. Frontiers of Engineering Symposium of the National Academy of Engineering,

September 21-23, Ford Research and Innovation Center, Dearborn, Michigan

Invited Speaker at the National Academy of Engineering Mechanical Engineering Section, October 4, 2004

Indiana 21

Century Research & Technology Fund Award, 2008

National Collegiate Inventors and Innovators Alliance (NCIIA) award, Lemelson Foundation, 2003

Research Initiation Award, National Science Foundation, 1992

Society of Automotive Engineers' Outstanding Faculty Advisor Award, 1994

Society of Automotive Engineers' Ralph R. Teetor Educational Award, 1992

Listed in Who's Who in Science and Engineering (1992); Who's Who in the World (1994)

Member, Sigma Xi

Major Internal Awards

2017 Leadership in Open Access Award, Purdue University, for leadership by example in the open access

movement (Garimella’s works posted on Purdue e-Pubs have been downloaded well over 250,000 times)

2012 Provost’s Award for Outstanding Graduate Mentor, Purdue University

Faculty Award of Excellence for Mentoring, Purdue University College of Engineering, 2011

R. Eugene and Susie E. Goodson Distinguished Professorship, Purdue University, December 2009

Distance Teaching Award, Division of Engineering Professional Education, Purdue University, 2009

Ruth and Joel Spira Award, School of Mechanical Engineering, 2009

R. Eugene and Susie E. Goodson Chair Professorship of Mechanical Engineering, Purdue University, June 2006

Cray-Research Professorship, University of Wisconsin-Milwaukee, 1992 - 1999

Outstanding Teaching Award (university-wide), University of Wisconsin-Milwaukee, 1997

Graduate School/UWM Foundation Research Award (university-wide), UW-Milwaukee, 1995

Outstanding Teaching Award, College of Engineering and Applied Science, UW-Milwaukee, 1992

HONORARY & PROFESSIONAL MEMBERSHIPS, EDITORSHIPS

Member, National Science Board (2018-present)

Member, Sandia National Laboratories Chief Research Officer External Advisory Board (2019-present)

Member, Executive Committee, Council on Competitiveness (2021-present)

Member, National Academies’ Study Committee on International Talent Programs in the Changing Global

Environment (2023-present)

Board Member, Vermont Business Roundtable (2020-present)

Honorary Board Member, Vermont Council on World Affairs (2021-present)

Member, US-Colombia Business Council (2017-2019)

Member, Indiana-India Business Council (2018-2019)

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Board Member, BioCrossroads (2017-2019)

Member, Scientific Advisory Board, Indiana Biosciences Research Institute (2016-2019)

Board Member, Regenstrief Foundation, (2015-2019)

Board Member, Purdue Research Foundation (2014-2019)

Board of Directors, Modine Manufacturing Inc. (2011-present)

Executive Committee Member, CONEXUS Indiana (2011-2013)

Member, Indiana Automotive Council (2011-2013)

Member, Indiana Aerospace and Defense Council (2011-2013)

Board Member, Energy Systems Network (2011-2013)

Task Force Member, “Immigration and US Economic Competitiveness: A View from the Midwest,” Chicago

Council on Global Affairs (Call to Action report

)

Board Member, Greater Lafayette Commerce (2011-2015)

Member, Economic and Community Development Council, Greater Lafayette Commerce (2011-2015)

Member, Board of Directors, Engagement Scholarship Consortium (2011-2013)

Editorial Board, Advances in Applied Energy (2020-present)

Editorial Board, Applied Energy (2008-present)

Editorial Advisory Board, Energy Conversion and Management (2013-present)

Editorial Advisory Board, Nanoscale and Microscale Thermophysical Engineering (2014-present)

Editorial Board, International Journal of Micro-Nano Scale Transport (2009-present)

Editor, Experimental Heat Transfer (2005-present)

Associate Editor, ASME Thermal Science and Engineering Applications (2008-2011)

Associate Editor, ASME Journal of Heat Transfer (2004-07)

Editor, Heat Transfer-Recent Contents (1995-98)

Editor, Experimental Thermal and Fluid Science (1993-2002)

Member, U.S.-Russia Bilateral Presidential Commission Science & Technology Working Group (2011)

Member, International Electronics Manufacturing Initiative (iNEMI) Thermal Management Technical Working

Group (2002-2005)

Chair, ASME Heat Transfer Division Membership Development and Recognition Committee (2005-07)

Chair, NASA Multiphase Flow and Heat Transfer Peer Review Panel, February 2004

Chair, NASA Multiphase Flow and Heat Transfer Peer Review Panel, March 2003

Member, Institute-wide Evaluation Committee, Indian Institute of Technology, Hyderabad, 2014

Member, Evaluation Committee, Department of Mechanical and Process Engineering, Swiss Federal Institute

of Technology (ETH) Zurich, 2013

Member, Review Committee, Department of Mechanical Engineering, IIT Madras, 2013

Member, Visiting Committee, Mechanical Engineering Department, National University of Singapore, 2013

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SELECTED UNIVERSITY SERVICE

Co-Chair, Purdue University Hazards Management Oversight Committee (2014-19)

Chair, Purdue University Contract Review Board (2014-19)

Chair, Purdue University Global Council Committee on Global Engagement (2011-2013)

Member, College of Engineering Pre-eminent Team Selection Committee (2013-14)

Team Co-Captain, Faculty of 2020 professional development, College of Engineering Strategic Plan (2009)

Member, Dean’s Faculty Advisory Committee (2006-09)

Member, Engineering Named Professorship Committee (2006-09)

Member, Academic Personnel Grievance Committee, Schools of Engineering, Purdue University (2005-07)

Member/Chair, multiple search committees including Multi-Physics Transport (Chair), Herrick Chair

Professorship, Computational Heat Transfer/Fluids, Heat Transfer, and others

Member, Mechanical Engineering Advisory Committee (2002-04)

Member, Academic Planning and Space Committee, School of Mechanical Engineering, Purdue University

(2001-2007)

Member, Graduate Committee, School of Mechanical Engineering, Purdue University (1999-02)

Chair, Curriculum Committee, UWM College of Engineering and Applied Science (1996-98); Member (1995-99)

Faculty Advisor, Society of Automotive Engineers' Student Chapter, UW-Milwaukee (1990-97)

Faculty Mentor, National Institutes of Health Minority High School Research Apprenticeship Program

SELECTED TECHNICAL SERVICE

Guest Editor, Microelectronics Journal Special Issue on Thermal Challenges in Next Generation Electronic

Systems (39, 2008, with A. Fleischer); Heat Transfer Engineering Special Issue (28, 2008, with S. Revankar);

IEEE Transactions on Components and Packaging Technologies Special Issue on Thermal Challenges in Next

Generation Electronic Systems (25, 2002, with Y. Joshi); Microelectronics Journal Special Issue on Thermal

Challenges in Next Generation Electronic Systems (34, 2003, with Y. Joshi)

Workshop Organizer and Chair, Thermal Management in Telecommunication Systems and Data Centers, Santa

Clara, CA, November 2015; Santa Clara, CA, April 2012; Dallas, TX, October 2010

Coordinator, Washington Energy Seminar, U.S. Department of Energy, March 2011

Conference Organizer and Chair (with A. Fleischer), Thermal Challenges in Next Generation Electronic Systems:

Thermes 2007, Engineering Conferences International, Santa Fe, NM, January 2007; Thermes 2002 (with Y.

Joshi), January 2002

Conference Co-Chair, ASME/ISHMT Heat and Mass Transfer Conference, Guwahati, India, January 2006

Conference Co-Chair, Next-GenerationThermal Management Materials and Systems Conference, Dallas, TX,

October 2002

Workshop Co-Organizer and Co-Chair, Thermal Management in Electronic Equipment, Bangalore, India,

January 2004

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Reviewer for

ACS Nano, various AIAA, ASME and IEEE Journals, Applied Energy, Applied Mechanics Reviews, Applied Physics

Letters, Chemical Engineering Science, Colloids and Surfaces, Computational Mechanics, Desalination and Water

Treatment, Energy and Fuels, Experiments in Fluids, Experimental Heat Transfer, Experimental Thermal and Fluid

Science, Industrial & Engineering Chemistry Research, International Journal of Heat and Mass Transfer, International

Journal of Numerical Methods in Engineering, International Journal of Refrigeration, Journal of Applied Physics,

Journal of Colloid and Interface Science, Journal of Computational Physics, Journal of Fluids and Structures, Journal

of Micromechanics and Microengineering, Journal of Physical Chemistry, Langmuir, Microfluidics and Nanofluidics,

Nanoletters, Nanoscale, Nanoscale and Microscale Thermophysical Engineering, Numerical Heat Transfer, Procs

National Academy of Sciences, Physics of Fluids, Progress in Energy and Combustion Science, Renewable Energy,

Review of Scientific Instruments, Science, Scientific Reports, Sensors and Actuators, Solar Energy, and others

Grant proposals reviewer for the National Science Foundation, NASA, Department of Energy, National

Research Council, Israel Science Foundation, Science Foundation Ireland, Australian Research Council, Institute

for the Promotion of Innovation by Science and Technology in Flanders (Belgium), CONICYT (Chile), and many

others

CLASSROOM TEACHING

At Purdue:

Heat and Mass Transfer (ME 315)

Heat and Mass Transfer Laboratory (ME315L)

Intermediate Heat Transfer (ME 505); taught online through Continuing Engineering Education

Convection of Heat and Mass (ME 605)

Heat Transfer in Electronic Systems

(ME 597G); taught online via videostreaming through Continuing

Engineering Education and through National Technological University (ME535-M)

Seminar in Global Policy Issues (cross-listed in nine departments, ECON, AGEC, NUCL, IT, ME, POL, CNIT, …)

At University of Wisconsin-Milwaukee:

Introduction to Heat Transfer (ME 311, for non-majors)

Introduction to Fluid Mechanics (ME 320)

Basic Heat Transfer (ME 321)

Mechanical Engineering Experimentation (ME 337)

Senior Design Project (ME 390)

Thermal Concerns in Computer Design

(ME 490)

Conduction Heat Transfer (ME 711)

Convective Heat and Mass Transfer (ME 712)

Radiation Heat Transfer (ME 713)

Solidification Heat Transfer

(ME 890)

Heat Transfer in Materials Processing

(ME 890)

New course developed

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RESEARCH PROGRAM & CONTRIBUTIONS

Research Interests: Micro- and nano-scale transport phenomena, thermal management and energy efficiency

in electronics systems, renewable/sustainable energy systems technology and policy, and materials processing

Awards for Research Publications

Most Cited Articles (since 2010), Int J Heat Mass Transfer for “Characterization of Evaporation and Boiling from

Sintered Powder Wicks fed by Capillary Action,” by JA Weibel, MT North, and SV Garimella (53:4204-4215,

2010)

Top 10 Most Cited Articles, Heat Transfer Engineering (2003-2008) for “Experimental Investigation of the

Thermal Performance of Piezoelectric Fans,” by T Açıkalın, SM Wait, SV Garimella and A Raman (25:4-14,

2004)

Top 10 Most Cited Articles, Heat Transfer Engineering (2003-2008) for “Single-Phase Flow and Heat Transport

and Pumping Considerations in Microchannel Heat Sinks,” by SV Garimella and V Singhal (25:15-25, 2004)

Most Cited Articles, Int J Heat Mass Transfer (2005-2008) for “Investigation of Heat Transfer in Rectangular

Microchannels,” by PS Lee, SV Garimella and D Liu (48:1688-1704, 2005)

Highlights of 2008 selection by editorial board of J Micromechanics Microengineering for “Electrical Actuation

of Dielectric Droplets,” N Kumari, V Bahadur, and SV Garimella (18:085018, 2008)

2019 Best Paper Award (Components: Characterization & Modeling Category) for “Evaluation of Additively

Manufactured Microchannel Heat Sinks,” by IL Collins, JA Weibel, L Pan, and SV Garimella, IEEE Transactions

on Components, Packaging and Manufacturing Technology (9:446-457, 2019)

Nasser Grayeli Best Poster Award for “Impact of Flow Boiling Instabilities on Heat Transfer Coefficient and

Critical Heat Flux in a Microchannel,” by MD Clark, JA Weibel, and SV Garimella, at the ASME International

Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

(InterPACK), Oct 27-29, 2020

Nasser Grayeli Best Poster Award for “The Critical Role of Dynamic Surface Wettability on Bubble Dynamics

and Boiling Performance,” by TP Allred, JA Weibel, SV Garimella, at the ASME International Technical

Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

(InterPACK), Anaheim, CA, Oct 7-9, 2019

Best Poster Award in Component-Level Thermal Management Track for “Identification of the Dominant Heat

Transfer Mechanisms during Confined Two-Phase Jet Impingement,” by MD Clark, JA Weibel, and SV

Garimella, at the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Systems (ITherm), San Diego, CA, May 29-Jun 1, 2018

Best Poster Award in Emerging Technologies Track for “Experimental Characterization of a Microchannel Heat

Sink made by Additive Manufacturing,” by IL Collins, JA Weibel, L Pan, and SV Garimella, at ITherm, San

Diego, CA, May 29-Jun 1, 2018

Best Poster Award for “Calibration and Sensitivity of a Fixed-Bed Adsorption Model for Atmosphere

Revitalization in Space,” by KN Son, JA Weibel, and SV Garimella, at ICES, Charleston, SC, July 16-21, 2017

Best Poster Award in Thermal Management 1: Component Level Track for “An Area-Scalable Two-Layer

Evaporator Wick Concept for High-Heat-Flux Vapor Chambers,” by S Sudhakar, JA Weibel, and SV Garimella,

at ITherm, Orlando, FL, May 30-Jun 2, 2017

Best Poster Award in Thermal Management 2: System Level Track for “A Time-Stepping Analytical Model for

3D Transient Vapor Chamber Transport,” by G Patankar, JA Weibel, and SV Garimella, at ITherm, Orlando,

FL, May 30-Jun 2, 2017

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Outstanding Poster Award in Emerging Technologies & Fundamentals Track for “Rapid-Bubble-Growth

Instability at the Onset of Microchannel Flow Boiling,” by TA Kingston, AE Moskalenko, JA Weibel, and SV

Garimella, at ITherm, Orlando, FL, May 30-Jun 2, 2017

Best Paper Award Runner-Up, Best Student Paper (PK Mulay Memorial Scholarship), and Best Student Paper in

the area of Two-Phase Thermal Management Technology and/or Application for “Experimental study on

flow boiling in a compact hierarchical manifold microchannel heat sink array,” by KP Drummond, JA Weibel,

and SV Garimella, at the SEMI-THERM 33rd Annual Symposium, San Jose, CA, March 13-17, 2017

Best Paper Award in Emerging Technologies Track for “Evaporative Intrachip Hotspot Cooling with a

Hierarchical Manifold Microchannel Heat Sink Array,” by KP Drummond, JA Weibel, SV Garimella, D Back, D

B. Janes, MD Sinanis, and D Peroulis, at ITherm, Las Vegas, NV, May 31-Jun 3, 2016

Outstanding Paper Award for “A Method for Thermal Performance Characterization of Ultra-Thin Vapor

Chambers Cooled by Natural Convection,” by G Patankar, S Mancin, JA Weibel, MA MacDonald, and SV

Garimella, at the International Technical Conference and Exhibition on Packaging and Integration of

Electronic and Photonic Microsystems (InterPACK) and ICNMM, San Francisco, CA, July 6-9, 2015

Best Poster Award for “Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid

Microchannel Slug Flow,” by TA Kingston, JA Weibel, and SV Garimella, at InterPACK and ICNMM, San

Francisco, CA, July 6-9, 2015

Outstanding Paper Award in Thermal for “Effects of Non-Uniform Heating on Two-Phase Flow through

Microchannels,” by SN Ritchey, JA Weibel, and SV Garimella, at InterPACK, Burlingame, CA, July 16-18, 2013

First Prize for Best Poster in Advanced Packaging and Materials track for “Single-Step Fabrication and

Characterization of Ultrahydrophobic Surfaces with Hierarchical Roughness,” by S Dash, N Kumari, M

Dicuangco, and SV Garimella, at InterPACK, Portland, OR, July 6-8, 2011

First Prize for Best Poster in Thermal Management track for “An Experimentally Validated Model for Transport

in Thin, High Thermal Conductivity, Low CTE Heat Spreaders,” by R Ranjan, JY Murthy, SV Garimella and D

Altman, at InterPACK, Portland, OR, July 6-8, 2011

Best Poster Prize for “Numerical Study of Evaporation Heat Transfer from the Liquid-Vapor Interface in Wick

Microstructures,” by R Ranjan, JY Murthy and SV Garimella, ASME International Mechanical Engineering

Congress and Exposition, Lake Buena Vista, FL, November 13-19, 2009

Best Poster Prize for “Numerical Analysis of Mist-Cooled High Power Components in Cabinets,” by N Kumari, V

Bahadur, M Hodes, T Salamon, A Lyons, P Kolodner and SV Garimella, at InterPACK, San Francisco, July 19-

23, 2009

Best Poster Prize for “Forces acting on Sessile Droplet on Inclined Surfaces,” by SR Annapragada, JY Murthy

and SV Garimella, at InterPACK, San Francisco, July 19-23, 2009

Best Paper Award in Heat Transfer, for “Permeability and Thermal Transport in Compressed Open-Celled

Foams,” by SR Annapragada, JY Murthy and SV Garimella, at the 2008 ASME Summer Heat Transfer

Conference, Jacksonville, FL, August 10-14, 2008

Best Poster Prize for “Infrared Micro-Particle Image Velocimetry in a Silicon Microchannel Heat Sink,” by BJ

Jones and SV Garimella, International Heat Transfer Conference, Sydney, Australia, August 13-18, 2006

Best Paper Award for “Piezoelectric Fans for the Thermal Management of Electronics,” by SM Wait, T Açıkalın,

SV Garimella and A Raman, at the Sixth ISHMT/ASME Heat and Mass Transfer Conference, Kalpakkam, India,

January 5-7, 2004

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Patents

1. Absorbance-Based Colorimetric Device System (with A Chandramohan, JA Weibel), US Patent No.

11,536,665, issued 12/27/2022.

2. Boiling Processes and Systems therefor having Hydrophobic Boiling Surfaces (with TP Allred, JA

Weibel), US Patent No. 11,137,220, issued 10/5/2021.

3. Apparatus and Method for Increasing Boiling Heat Transfer Therein (with TY Kim), US Patent No.

10,309,733 B2, issued 6/4/2019.

4. Methods and Apparatuses for Impedance-Based Gas Detection for Microfluidic Systems (with P

Valiorgue, JA Weibel), US Patent No. 9,925,319 B2, issued 3/27/2018.

5. Modular Jet Impingement Cooling Apparatuses with Exchangeable Jet Plates (with MJ Rau, EM Dede,

SN Joshi, MP Gaikwad), US Patent No. 9,484,283, issued 11/1/2016.

6. Vehicles, Power Electronics Modules and Cooling Apparatuses with Single-Phase and Two-Phase

Surface Enhancement Features (with MJ Rau, EM Dede, SN Joshi), US Patent No. 8,786,078 B1, issued

7/22/2014.

7. Cooling Apparatuses and Power Electronics Modules with Single-Phase and Two-Phase Surface

Enhancement Features (with MJ Rau, EM Dede, SN Joshi), US Patent No. 8,643,173 B1, issued

2/4/2014.

8. Controlled Flow of a Thin Liquid Film by Electrowetting (with HK Dhavaleswarapu, N Kumari), US

Patent No. 8,632,670, issued 1/21/2014.

9. Microfluidic Pumping Based on Dielectrophoresis (with D Liu), US Patent No. 8,470,151, issued

6/25/2013.

10. Method of Bonding Carbon Nanotubes (with TS Fisher, S Aradhya), US Patent No. 8,419,885, issued

4/16/2013.

11. Microfluidic Pumping Based on Dielectrophoresis (with D Liu), US Patent No. 8,308,926, issued

11/13/2012.

12. Method of Bonding Carbon Nanotubes (with TS Fisher, S Aradhya), US Patent No. 8,262,835, issued

9/11/2012.

13. Micropump for Electronics Cooling (with V Singhal), US Patent No. 7,802,970, issued 9/28/2010.

14. Various Methods, Apparatuses, and Systems that use Ionic Wind to Affect Heat Transfer (with TS

Fisher, DB Go, RK Mongia), US Patent No. 7,545,640, issued 6/9/2009.

15. Microchannel Heat Sink (with P-S Lee), US Patent No. 7,277,284, issued 10/2/2007.

16. Piezoelectric Device with Feedback Sensor (with A Raman), US Patent No. 6,713,942, issued 3/30/2004.

Research Grants

Dr. Garimella has secured extramural research funding of over $US 32M for his research programs. This

funding has come from the US National Science Foundation, NASA, US Army, DARPA, ONR, Members of the

NSF Cooling Technologies Research Center, Semiconductor Research Corporation, State of Indiana 21

Century Research and Technology Fund, Hoosier Energy, Electric Power Research Institute (EPRI), Australian

Research Council, State of Wisconsin Department of Development, Cray Research, John Fluke Manufacturing

Co., Pycon Inc., and TSI Systems.

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The Cooling Technologies Research Center that he directed is a graduated NSF Industry/University

Cooperative Research Center, which he founded as an industry consortium in 1999. Annual membership funds

support longer-term, pre-competitive research programs in cutting-edge technologies of interest to industry.

Over 20 faculty members from different disciplines and schools and many graduate students and post-docs

participate in Center efforts. From 2002 to 2017, the NSF IUCRC program supported this effort, for a total

direct funding for the Center to date of over $10M. Member companies include 3M, Aavid Thermalloy, Air

Force Research Labs (WPAFB), Alcatel-Lucent (Bell Labs), Alcoa, Apple, Aptiv, Boeing, Cisco Systems, Delphi

Electronics & Safety, Denso, Dow Silicones Corp., DuPont, Eaton, Ford Motor Co., General Electric, General

Motors, Google, Graftech, HTRI, Honeywell, Huawei Technologies, IBM, Intel, John Deere, Johnson Matthey

Electronics, LG Electronics, Laird Technologies, Malico, Midea Holding Group, Modine Manufacturing, MuRata,

Nanoconduction, Nokia, Northrop Grumman, Parker Hannifin, Philips, Qualcomm, Raytheon, RedBull

Advanced Technologies, Rockwell Automation, Rockwell Collins, Rogers Corp, Saint Gobain, Samsung

Electronics, Sandia National Labs, Schlumberger, Seagate, Sharp Laboratories, Sony Computer Entertainment,

Sony Corp, Saint Gobain, Sterling PCU, Sun Microsystems, Tenneco, Texas Instruments, Toyota Motor

Company, and Wolverine Tube.

Long-term research in active and passive microscale liquid cooling of automotive and military electronics was

supported with grants from DARPA ($1.6M, ICECool Fundamentals 2013-16, co-PIs Janes, Peroulis and Weibel;

$2.5M, Thermal Ground Plane 2008-11, co-PIs Fisher and Murthy, Partners – Raytheon, Thermacore) and the

Indiana 21

Century Research & Technology Fund ($4M, 2004-2009, partners – Delphi Electronics & Safety,

NAVSEA Crane, Thorrn Microtechnologies, CTS Microelectronics, Dupont Photomasks, Tristate).

Dr. Garimella’s research thrusts in renewable and sustainable energy systems, including waste heat recovery

from fossil fuel power plants and large IT installations, have been supported by Hoosier Energy, EPRI, and

Sandia National Labs. Dr. Garimella was a co-investigator in the Solar Energy Research Institute for India and

the United States (SERIIUS), co-led by the Indian Institute of Science, Bangalore, and the National Renewable

Energy Laboratory, and jointly supported by DOE and the Indian Ministry of Science and Technology with

$50M in funding.

DISSERTATION & THESIS SUPERVISION

Ph.D. Students

1. Lei Z. Schlitz, “Simulation of Gas Dynamics and Electromagnetic Processes in High-Current Arc

Plasmas,” Spring 1998.

2. Bechir Moussa, “Heat and Mass Transport in the Solidification of Metal Matrix Composites,” August

2000.

3. James E. Simpson (UWM Graduate Fellow), “Front Tracking in the Numerical Simulation of Binary

Alloy Solidification,” August 2000.

4. Chin-Yuan Li (PRF Fellow), “A New Approach to Front Tracking on a Fixed Grid in Solidification

Problems,” May 2002.

5. Daniel J. Schlitz (PRF Fellow), “Microscale Ion Driven Air Flow” (co-advisor T Fisher), February 2004.

6. Unnikrishnan Vadakkan, “Transient Three-Dimensional Modeling of Flat Heat Pipes with Discrete Heat

Sources” (co-advisor J Murthy), May 2004.

7. Vishal Singhal (PRF Fellow), “A Novel Micropump for Integrated Microchannel Cooling Systems,”

January 2005.

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8. Suwat Trutassanawin, “A Miniature-Scale Refrigeration System for Electronics Cooling” (co-advisor

with E Groll), May 2006.

9. Wei Zhang, “Sub-ContinuumIon Transport in Air and Phonon Transport in Nanostructures” (co-advisor

with T Fisher), June 2006.

10. Dong Liu, “Thermal Transport in Microchannels,” August 2006.

11. Shankar Krishnan, “Transport Phenomena Associated with Phase Change In Homogeneous and

Inhomogeneous Systems” (co-advisor J Murthy), August 2006.

12. Poh-Seng Lee (Bilsland Dissertation Fellow), “Heat Transport in Silicon Microchannel Arrays,” May

2007.

13. Tolga Acikalin, “Thermal and Fluidic Characterization of Piezoelectric Fans,” August 2007.

14. Pramod Chamarthy, “Non-Intrusive Temperature Measurement Using Microscale Visualization

Techniques” (co-advisor with S Wereley), December 2007.

15. Abhijit Sathe, “Miniature-Scale Diaphragm Compressor for Electronics Cooling” (co-advisor with E

Groll), August 2008.

16. Mark Kimber (Winkelman Fellow), “Thermal and Fluidic Characterization of Piezoelectrically Driven

Cantilevers,” August 2008.

17. Vaibhav Bahadur (Andrews Fellow, Adelberg Fellow), “Electrical Actuation of Liquid Droplets on

Smooth and Artificially Microstructured Surfaces,” August 2008.

18. Stefan S. Bertsch, “Refrigerant Flow Boiling in Microchannel Evaporators” (co-advisor with E Groll),

August 2008.

19. David B. Go, “Ion Generation and Ionic Wind Heat Transfer at Millimeter and Micrometer Scales” (co-

advisor with T Fisher), August 2008.

20. Brian D. Iverson (Ingersoll Rand Fellow, Winkelman Fellow), “Traveling-Wave Electrohydrodynamic

Micropumping Induced in a Temperature Gradient,” December 2008.

21. Hemanth K. Dhavaleswarapu, “Microscale Transport in Evaporating Thin Liquid Films” (co-advisor J

Murthy), May 2010.

22. Tannaz Harirchian, “Two-Phase Flow and Heat Transfer in Microchannels,” May 2010.

23. Niru Kumari, “Liquid Droplet Actuation and Control on Smooth and Superhydrophobic Surfaces using

Electric Fields,” May 2010.

24. Benjamin J. Jones (National Defense Science and Engineering Graduate Fellow, Bilsland Fellow),

“Fundamental Studies of Thermal Transport and Liquid-Vapor Phase Change using Microscale

Diagnostic Techniques,” August 2010.

25. Ravi S. Annapragada, “Investigation of Actuated Droplet Motion on Smooth and Superhydrophobic

Surfaces” (co-advisor J Murthy), August 2011.

26. John P. McHale, “Characterization of Nucleate Pool Boiling from Smooth and Rough Surfaces,” August

2011.

27. Ram Ranjan (Andrews Fellow), “Two-Phase Heat and Mass Transfer in Capillary Porous Media” (co-

advisor J Murthy), December 2011.

28. Christopher P. Migliaccio (ASEE SMART Fellow, Ross Fellow), “Evaporative Transport in Thin Liquid

Films and Electrically Actuated Droplets,” May 2012.

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29. Justin A. Weibel (Lozar Fellow, Ingersoll Rand Fellow), “Characterization of Fluid-Thermal Transport

and Boiling in Micro/Nano-Engineered Porous Structures,” May 2012.

30. Craig Bradshaw (ASHRAE Fellow, Lambert Teaching Fellow), “A Miniature-Scale Linear Compressor for

Electronics Cooling” (co-advisor with E. Groll), May 2012.

31. Scott M. Flueckiger, “Multiscale Simulation of Thermocline Energy Storage for Concentrating Solar

Power,” August 2013.

32. Karthik K. Bodla (Ross Fellow), “Direct Simulation of Transport Through Stochastic Porous Media” (co-

advisor J Murthy), December 2013.

33. Susan N. Ritchey (Ingersoll Rand Fellow, Lambert Fellow), “Non-Intrusive Two-Phase Flow Regime

Identification and Transport Characterization in Microchannels Subject to Uniform and Non-Uniform

Heat Input,” December 2014.

34. Susmita Dash (Ross Fellow, Bilsland Fellow), “Droplet Behavior on Superhydrophobic Surfaces:

Interfaces, Interactions, and Transport,” December 2014.

35. Stephen H. Taylor (Winkelman Fellow), “Capacitance-Based Characterization of Inhomogeneities in

Thin Layers” August 2015.

36. Richard A. Simmons, “A Techno-Economic Investigation of Advanced Vehicle Technologies and their

Impacts on Fuel Economy, Emissions and the Future Fleet,” (co-advisor W Tyner) December 2015.

37. Matthew J. Rau (Winkelman Fellow, Arrasmith Fellow), “Turbulent Liquid-Vapor Flow Interactions

and Heat Transfer in Confined Jet Impingement Boiling,” May 2016.

38. Suchismita Sarangi, “Characterization of Pool Boiling Heat Transfer from Porous-Coating-Enhanced

Surfaces,” May 2016.

39. Ravi Patel (Winkelman Fellow, Arrasmith Fellow, Adelberg Fellow), “Characterization of the Liquid

Film in Slug- and Annular-Regime Microchannel Flows,” May 2017.

40. Kevin P. Drummond (Cordier Fellow), “Characterization of Manifold Microchannel Heat Sinks during

Two-Phase Operation,” (co-advisor J Weibel) May 2018.

41. Harshad Inamdar (Lambert Fellow), “Performance of Finned Heat Exchangers after Air-Side Fouling

and Cleaning,” (co-advisor with E Groll) August 2018.

42. Karen Nielson Son (NASA Space Technology Research Fellow, Purdue Doctoral Fellow), “Improved

Prediction of Adsorption-Based Life Support for Deep Space Exploration,” December 2018.

43. Gaurav Patankar, “Characterization, Modeling and Design of Ultra-Thin Vapor Chamber Heat

Spreaders under Steady-State and Transient Conditions,” (co-advisor J Weibel) May 2019.

44. Carolina Mira Hernández (Colciencias Jose de Caldas/Fulbright Fellow), “Characterization of Two-

Phase Flow Morphology Evolution during Boiling via High-Speed Visualization,” (co-advisor J Weibel)

May 2019.

45. Aditya Chandramohan (Cordier Fellow), “Thermofluidic Transport in Evaporating Droplets:

Measurement and Application,” (co-advisor J Weibel) May 2019.

46. Todd A. Kingston (Winkelman Fellow), “Time-Resolved Characterization of Thermal and Flow

Dynamics during Microchannel Flow Boiling,” (co-advisor J Weibel), May 2019.

47. Aakriti Jain (Andrews Fellow), “Characterization of Flow Freezing in Small Channels for Ice Valve

Applications” (co-advisor J Weibel), December 2019.

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48. Taylor P. Allred (National Defense Science and Engineering Graduate Fellow, Perry Fellow), “Effects

of Dynamic Surface Wettability on Pool Boiling Behavior,” (co-advisor with J Weibel), December 2019.

49. Srivathsan Sudhakar (Bilsland Fellow), “Boiling in Capillary-Fed Porous Evaporators Subject to High

Heat Fluxes” (co-advisor J Weibel), August 2021.

50. Matthew Clark “The Impact of Flow Boiling Instabilities on Heat Transfer in Microchannel Heat Sinks”

(Kohr Fellow, co-advisor with J Weibel), August 2022.

51. Rishav Roy, “Evaporation-induced Salt Precipitation in Porous Media and the Governing Solute

Transport” (Ross Fellow, co-advisor with J Weibel), August 2022.

52. Kalind Baraya, “Characterization and Mechanistic Prediction of Heat Pipe Performance under

Transient Operation and Dryout Conditions” (Ross Fellow, co-advisor with J Weibel), August 2023.

53. Manohar Bongarala, “Determination of the Mechanism for the Boiling Crisis using Through-Substrate

Visual and Infrared Measurements” (Ross Fellow, co-advisor with J Weibel), December 2023.

M.S. Students

1. D. J. Schlitz, “Localized Enhancement of Heat Transfer from an Array of Heat Sources in Forced

Convection,” Fall 1992.

2. S. Gudapati, “Influence of Geometry on Convective Heat Transfer from Discrete Heat Sources,” Spring

1993.

3. L. Zhang, “Morphological Interface Stability in Alloy Systems during Unidirectional Solidification,”

Spring 1993.

4. J. P. McNulty, “Interface Tracking and the Formation and Suppression of Channels in Alloy

Solidification,” Spring 1994.

5. R. A. Rice, “Submerged and Confined Axisymmetric Liquid Jet Impingement Heat Transfer,” Spring

1995.

6. G. K. Morris, “Prediction of Heat Transfer and Flow Fields in Submerged and Confined Axisymmetric

Impinging Jets,” Spring 1996.

7. J. A. Fitzgerald (NSF Graduate Research Fellow), “An Experimental Investigation of the Flow Field in a

Confined and Submerged Impinging Jet,” Summer 1997.

8. V. P. Schroeder, “Heat Transfer from a Discrete Heat Source in Confined Air Jet Impingement with

Single and Multiple Orifices,” Fall 1997.

9. H. A. El-Sheikh, “Enhancement of Air Jet Impingement Heat Transfer using Pin Fin Heat Sinks,” Spring

1999.

10. L. A. Brignoni, “Heat Transfer from Enhanced Surfaces in Air Jet Impingement and Suction,” Spring

1999.

11. C-Y. Li, “Fluid Property Effects in Confined and Submerged Jet Impingement,” Summer 1999.

12. J. E. Simpson (UWM Graduate Fellow), “Interface Propagation in the Solidification of Metal Matrix

Composites,” Summer 1999.

13. W. F. Mohs, “Investigation of Thermal Contact Conductance in Electronics Cooling Applications,”

Summer 1999.

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14. V. Singhal, “Prediction of Thermal Contact Conductance by Integrated Thermal and Surface

Deformation Analysis,” Fall 2001.

15. P. J. Litke, “Experimental Determination of Thermal Contact Conductance,” Spring 2002.

16. S. Krishnan, “Analysis of Phase Change Energy Storage Systems for Pulsed Power Dissipation,” Summer

2002.

17. R. E. Fields (Ingersoll Rand Fellow/Arrasmith Fellow), “An Experimental Characterization of Heat and

Mass Transport in Flat Heat Pipes,” Summer 2002.

18. T. Acikalin, “Miniature Piezoelectric Fans for Thermal Management of Electronics” (co-advisor A

Raman), Spring 2003.

19. S. Basak, “Dynamic Response Optimization of Piezoelectrically Excited Thin Resonant Beams” (co-

advisor with A Raman), Summer 2003.

20. A. F. Black, “Surface Characterization and Thermal Constriction Resistance Modeling for Predicting

Thermal Contact Conductance,” Fall 2003.

21. S. M. Wait (SRC Fellow/Arrasmith Fellow), “Ultrasonic Piezoelectric Fans for Microelectronics

Cooling” (co-advisor A Raman), Summer 2004.

22. M. S. Peterson, “Experimental Investigation of Enhanced Ion Generation in Atmospheric Air” (co-

advisor with T Fisher), Summer 2004.

23. B. D. Iverson (Ingersoll Rand Fellow), “Heat and Mass Transport in Heat Pipe Wick Structures,” Fall

2004.

24. C. T. Merrill (NSF Graduate Research Fellow), “Prediction of Thermal Contact Resistance across Joints

with Metallic Coatings,” Fall 2005.

25. R. S. Annapragada, “Thermo-Mechanical Modeling and Property Prediction in the Casting of

Particulate Materials,” Summer 2006.

26. T. W. Davis, “Experimental Characterization of the Transport Properties of Heat Pipe Wicks,” Summer

2006.

27. J. P. McHale, “Laminar Flow and Forced Convective Heat Transfer in a Trapezoidal Microchannel,” Fall

2006.

28. S. V. Aradhya, “Electrothermally Bonded Carbon Nanotube Arrays For Enhanced Interfacial

Conductance” (co-advisor with T Fisher), Summer 2008.

29. B. T. Holcomb, “Measurement and Prediction of Flow Boiling of Water in Silicon Microchannels,”

Summer 2009.

30. G. Powell, “Controlled Synthesis of CNT-based Nanostructures for Enhanced Boiling and Wicking” (co-

advisor with T Fisher), Summer 2009.

31. N. Bajaj, “Topological Design Optimization of Nested Channels for Squeeze Flow of Thermal Interface

Materials” (co-advisor with G Subbarayan), December 2010.

32. R. Leffler, “Power Plant Waste Heat Rejection and Utilization Options” (co-advisor with E Groll), May

2011.

33. D. A. West (NSF Graduate Research Fellow, Winkelman Fellow), “Single-Phase and Two-Phase Heat

Transfer During Confined Impingement of Single Jets and Jet Arrays,” May 2012.

34. A. Krishna, “Organic Rankine Cycle with Solution Circuit for Low-Grade Heat Recovery” (co-advisor

with E Groll), August 2012.

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35. M. Dicuangco (Arrasmith Fellow), “Particle Deposition on Superhydrophobic Surfaces by Sessile

Droplet Evaporation” (co-advisor J Weibel), May 2014.

36. Y. Yadavalli, “Transport in Ultra-thin Heat Pipes for Low Power Applications” (co-advisor J Weibel),

December 2014.

37. J. Castillo Chacon (Fulbright/Colciencias Jose de Caldas Fellow), “Dropwise Condensation Dynamics in

Humid Air” (co-advisor J Weibel), December 2014.

38. I. L. Collins (Lozar Fellow), “Evaluation of Additive Manufacturing Technology for Microchannel Heat

Sinks” (co-advisor with J Weibel), May 2018.

39. H. Lai, “Characterization of Thin Liquid Films on Surfaces with Small Scale Roughness by Optical

Interferometry” (co-advisor with J Weibel), Aug 2019.

40. Sara Lyons, “Characterization of the Effects of Internal Channel Roughness on Fluid Flow and Heat

Transfer in Additively Manufactured Microchannel Heat Sinks” (Andrews Fellow, co-advisor with J

Weibel), August 2022.

Undergraduate Students

Over 65 undergraduate students including those listed below have worked as part of Dr. Garimella’s research

group, some through the NSF REU program and an undergraduate research experience component in his NSF

Center offering CTRC Undergraduate Research Fellowships to encourage students in discovery-based learning.

Many of these students have subsequently enrolled in graduate programs.

Andrey Moskalenko (2016), Dayana Stefany Vega (2016), Rajakumar Ganne (2016), Soumya Bandyopadhyay

(2016), Yu Han (2016), Ashish Daga (2015), Ruixuan Ren (2014), Taylor Allred (2014), Srivathsan Sudhakar

(2014), Nitesh Bajaj (2013), Letian Wang (2013), Ankita Deshmukh (2013), S G Krishnan (2013), Abilasha

Nandakumar (2012-13), Gaurav Patankar (2012), Nico Weigand (2012), Michael Frank (2011-12), Mercy

Dicuangco (2011), Marie Alt (2011), Abhijeet Patel (2010), Sonal Vaid (2008), Ravi Patel (2008), Sai

Chodavarapu (2008), Bryson Sullivan (2008), Raul Maturana (2008), Ronan Lonergan (2008), Jon Shelton

(2008), Adithya Bhat (2008), Josh Christian (2008), Ben Ali (2007), Lizmar Principe (2007), Brad Holocomb

(2007), Carlos Kemeny (2006), Sujaatha Dwadasi (2006), Himani Shah (2006), Michael Keen (2006), Nikhil Bajaj

(2004), Vishnu Dwadasi (2004), Maria Burnett (2003-2004), Indra Tjahjono (2002-2003), Girum Berhane

(2003), Renee Wenstrup (2003), Ben Jones (2003), Ken Leer (2002), Patrick Wong (2001), Kiran Vedula (2001),

Michael Meyer (2001), K. M. Wong (2001), Gbenga Showole (2000), Dan Taylor (2000), Erik Olsen (2000), Paul

Litke (2000), Greg Glidden (1999), Danielle Wade (1999), Brian Storniolo (1998), Nate Kohnle (1998), M. M.

Tegelman (1998), Mike Guslick (1997-1998), Jim Briggs (1998), Scott Nelson (1997), Vitaliy Rayz (1997), Katie

Schuchardt (1996), Todd Brunner (1996), Jim Oehmcke (1995), Boris Nenaydykh (1994), Garron Morris (1993),

Dave Hlavac (1993), Ken Cascio 1993), Kevin Adams (1992), Roy Rice (1992), and Kirk Blomdahl (1991)

Post-doctoral Researchers / Visiting Professors & Scholars

1. Prof. C. V. Madhusudana, School of Mechanical and Manufacturing Engineering, University of New

South Wales, Sydney, Australia; Visiting Professor, July to December 2000.

2. Prof. C. B. Sobhan, Regional Engineering College, Calicut, India; Visiting Professor, March 1999 to May

2000.

3. Dr. James E. Simpson, Post-doctoral Research Associate, August to November 2000.

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4. Prof. Moogeun Kim, School of Mechanical and Automotive Engineering, Inje University, South Korea;

Visiting Professor, February 2001 to February 2002.

5. Philipp Buermann, Research Scientist, Technical University of Dresden, August to September 2001

(co-supervised with A Raman).

6. Dr. Madhusudan Iyengar, Post-doctoral Research Associate, April to October 2003.

7. Prof. Sung Jin Kim, Korean Advanced Institute of Science and Technology (KAIST), South Korea;

Visiting Professor, August 2003 to August 2004.

8. Kyu Hyung Do, Korean Advanced Institute of Science and Technology (KAIST), South Korea; Visiting

Scholar, August 2003 to August 2004.

9. Dr. Dawei Sun, Post-doctoral Research Associate, September 2003 to September 2006.

10. Dr. Tailian Chen, Post-doctoral Research Associate, May 2004 to June 2006.

11. Dr. Lorenzo Cremaschi, Post-doctoral Research Associate, August 2004 to July 2006 (co-supervised

with E Groll).

12. Dr. Hao Wang, Post-doctoral Research Associate, September 2004 to May 2007 (co-supervised with J

Murthy).

13. Tine Stevens, Katholieke Universiteit Leuven; Visiting Scholar, September to October 2005.

14. Dr. Dong Liu, Post-doctoral Research Associate, August 2006 to July 2007.

15. Dr. Moeketsi Mpholo, Senior Lecturer, University of Lesotho; Visiting Scholar, August to December

2007.

16. Dr. Placidus Amama, Post-Doctoral Research Associate, September to December 2007 (co-

supervised with T Fisher).

17. Dr. Fabien Volle, Post-doctoral Research Associate, October 2007 to August 2009.

18. Dr. Anuradha Bulusu, Post-doctoral Research Associate, January 2008 to March 2009 (co-supervised

with T Fisher).

19. Dr. Zhen Yang, Post-doctoral Research Associate, January 2008 to February 2010.

20. Enrico Da Riva, University of Padova, Italy; Visiting Scholar, July to December 2008.

21. Dr. Amaresh Dalal, Post-doctoral Research Associate, September 2008 to December 2009 (co-

supervised with J Murthy).

22. Dr. Brian Iverson, Post-doctoral Research Associate, January to August 2009.

23. Dr. Sidharth Paranjape, Post-doctoral Research Associate, July 2009 to May 2012.

24. Dr. Tim Persoons, Katholieke Universiteit Leuven; Visiting Scholar, August 2009.

25. Tom Saenen, Katholieke Universiteit Leuven; Visiting Scholar, August 2009.

26. Xuelei Nie, Chinese Academy of Sciences; Visiting Scholar, September 2009 to August 2010.

27. Dr. Tae Young Kim, Post-doctoral Research Associate, March 2010 to February 2012.

28. Joan Lopez Mas, Universitat Politecnica de Catalunya, Spain; Visiting Scholar, May to July 2010.

29. Dr. Tannaz Harirchian, Post-doctoral Research Associate, May to December 2010.

30. Dr. Berhane Hagos Gebreslassie, Post-doctoral Research Associate, July 2010 to November 2011.

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31. Dr. Tim Persoons (Marie Curie/IRCSET Fellow), Visiting Scholar, September 2010 to December 2011.

32. Oisin Fergal Lyons (Fulbright Fellow), Visiting Scholar, September 2011 to July 2012.

33. Prof. Fangjun Hong, Shanghai Jiao Tong University, China; Visiting Professor, September 2011 to

August 2012.

34. Peng Guan, Tsinghua University, Visiting Scholar, September 2011 to September 2012.

35. Dr. Orkan Kurtulus, Post-doctoral Research Associate, January 2012 to December 2013 (co-

supervised with E Groll).

36. Jochen Dietl, Technical University of Darmstadt, Visiting Scholar, July to September 2012.

37. Andrea Diani, University of Padua, Visiting Scholar, July to October 2012.

38. Dr. Pierre Valiorgue, Post-doctoral Research Associate, October 2012 to August 2013.

39. Dr. Zhenhai Pan, Post-doctoral Research Associate, October 2012 to July 2016.

40. Andres Heldstab, Institute for Energy System Buchs Switzerland, April to July 2013.

41. Dr. Simoné Mancin, University of Padua, Visiting Scholar, May to August 2013.

42. Dr. Hsien-Chin Su, National Taiwan University, Visiting Scholar, July 2013 to June 2014.

43. Prof. Martine Baelmans, Catholic University of Leuven, Belgium; Visiting Professor, November 2013,

April 2014.

44. Dr. Xuemei Chen, Post-doctoral Research Associate, December 2013 to July 2018.

45. Dr. Dongseob Kim, Post-doctoral Research Associate, January 2014 to January 2015.

46. Prof. Yonghua Huang, Shanghai Jiao Tong University, China; Visiting Professor, July 2014 to June

2015.

47. Prof. V. Kumaresan, Anna University, India; Visiting Professor, August 2014 to January 2015.

48. Dr. Tijs Van Oevelen, Post-doctoral Research Associate, March 2015 to February 2017.

49. Dr. Han Hu, Post-doctoral Research Associate, September 2016 to July 2019.

50. Dr. Monojit Chakraborty, Post-doctoral Research Associate, October 2016 to October 2018.

51. Dr. Ankur Miglani, Post-doctoral Research Associate, January 2017 to November 2019.

Group Alumni in Faculty Positions

1. Dr. Todd Kingston, Department of Mechanical Engineering, Iowa State University, Ames, IA.

2. Dr. Ankur Miglani, Department of Mechanical Engineering, Indian Institute of Technology Indore, India.

3. Dr. Han Hu, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR.

4. Dr. Monojit Chakraborty, Department of Chemical Engineering, Indian Institute of Technology

Kharagpur, India.

5. Dr. Susmita Dash, Department of Mechanical Engineering, Indian Institute of Science, Bangalore, India.

6. Dr. Niki Ritchey, Department of Mechanical Engineering, Texas A&M University, College Station, TX.

7. Dr. Tae Young Kim, Department of Mechanical System Engineering, Chonbuk National University,

Korea.

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8. Dr. Xuemei Chen, Department of Energy and Power Engineering, Nanjing University of Science and

Technology, Nanjing, China.

9. Dr. Matthew Rau, Department of Mechanical Engineering, Pennsylvania State University, University

Park, PA.

10. Dr. Zhenhai Pan, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China.

11. Dr. Craig Bradshaw, Department of Mechanical and Aerospace Engineering, Oklahoma State

University, Stillwater, OK.

12. Dr. Shankar Krishnan, Department of Mechanical Engineering, Indian Institute of Technology, Bombay,

India.

13. Dr. Vaibhav Bahadur, Department of Mechanical Engineering, University of Texas at Austin, Austin, TX.

14. Dr. Pierre Valiorgue, Département de Mécanique, Laboratoire de Mécanique des Fluides et

d'Acoustique, Université Claude Bernard Lyon 1, Lyons, France.

15. Dr. Brian Iverson, Department of Mechanical Engineering, Brigham Young University, Provo, UT.

16. Dr. Justin Weibel, School of Mechanical Engineering, Purdue University, West Lafayette, IN.

17. Dr. Tim Persoons, Department of Mechanical Engineering, University of Dublin, Trinity College, Dublin,

Ireland.

18. Dr. Zhen Yang, Department of Mechanical Engineering, Tsinghua University, Beijing, China.

19. Dr. Amaresh Dalal, Department of Mechanical Engineering, Indian Institute of Technology, Guwahati,

India.

20. Dr. Fabien Volle, Laboratoire d'Ingéniérie des Matériaux et des Hautes Pressions, University of Paris,

Paris, France.

21. Dr. David Go, Department of Aerospace and Mechanical Engineering, University of Notre Dame, South

Bend, IN.

22. Dr. Mark Kimber, Department of Nuclear Engineering, Texas A&M University, College Station, TX.

23. Dr. Stefan Bertsch, NTB Interstaatliche Hochschule für Technik Buchs (Technical University of Buchs),

Switzerland.

24. Dr. Dong Liu, Deparment of Mechanical Engineering, University of Houston, Houston, TX.

25. Dr. Hao Wang, Department of Energy and Resources Engineering, Peking University, Beijing, China.

26. Dr. Poh-Seng Lee, Department of Mechanical Engineering, National University of Singapore,

Singapore.

27. Dr. Tailian Chen, Department of Mechanical Engineering, Gonzaga University, Spokane, WA.

28. Dr. Lorenzo Cremaschi, Department of Mechanical Engineering, Auburn University, Stillwater, OK.

29. Dr. Suwat Trutassanawin, Mechanical Engineering Department, Mahidol University, Bangkok,

Thailand.

Suresh V. Garimella, July 2024

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LIST OF PUBLICATIONS

Google Scholar citations 35,597, h-index 105, i10-index 393 (July 21, 2024)

Books / Book Chapters

1. T.A. Kingston, J.A. Weibel, and S.V. Garimella, “Recent Experimental and Modeling Advances in Two-

Phase Embedded Microfluidic Cooling, Embedded Cooling of Electronic Devices, WSPC Series in

Advanced Integration and Packaging: Volume 8, ISBN: 978-198-12-7793-1, 2024.

2. D. Ginley, R. Aswathi, S. R. Atchuta, B. Basu, S. Basu, J. M. Christian, A. Dan, N. Dani, R. N. Das, P. Dutta,

S. M. Flueckiger, S. V. Garimella, Y. Goswami, C. K. Ho, S. Kedare, S. D. Khivsara, P. Kumar, C. D.

Madhusoodana, B. Mallikarjun, C. Mira-Hernández, M. Orosz, J.D. Ortega, D. R. Parida, M. S. Prasad, K.

Ramesh, S. Advaith, S. K. Saha, S. Sakthivel, S. Sharma, P. Singh, S. Singh, O. Srikanth, V. Srinivasan, J. A.

Weibel, T. Wendelin, Multiscale concentrated solar power

, Solar Energy Research Institute for India and

the United States (SERIIUS): Lessons and Results from a Binational Consortium, Springer International

Publishing, Chapter 3, pp. 87-132, 2020.

3. M. J. Rau and S. V. Garimella, “Two-Phase Jet Impingement: Liquid-Vapor Interactions and Heat Transfer

Mapping for Multiscale Surface Enhancement Design,” in Encyclopedia of Two-Phase Heat Transfer and

Flow III, World Scientific Publishers, Chapter 6

, pp. 221-278, 2018.

4. R. A. Simmons, P. F. Secor and S. V. Garimella, “Adapting Policies for a New Energy Future,” Handbook of

Clean Energy Systems (J. Yan ed.), Vol. 6, John Wiley and Sons, pp. 3139-3164, 2015.

5. R. A. Simmons and S. V. Garimella, “Electric, Hybrid and Advanced Vehicles: Finding a Lane on the Road

Ahead,” Handbook of Clean Energy Systems (J. Yan, ed.), Vol. 4, John Wiley and Sons, pp. 2279-2300,

2015.

6. S. V. Garimella and T. Harirchian, Microchannel Heat Sinks for Electronics Cooling, Vol. 1 in the

Encyclopedia of Thermal Packaging, World Scientific, Singapore, 2013 (248 pp.,

ISBN 978-981-4313-80-3).

7. K. K. Bodla, J. Y. Murthy and S. V. Garimella, “Optimization under Uncertainty for Electronics Cooling

Designs” WSPC Series in Advanced Integration and Packaging, Vol. 3: Cooling of Microelectronic and

Nanoelectronic Equipment: Advances and Emerging Research, Chapter 11, 2014.

8. G. A. Powell, A. Bulusu, J. A. Weibel, S. S. Kim, S. V. Garimella and T. S. Fisher, “Hydrophilic CNT-Sintered

Copper Composite Wick for Enhanced Cooling” WSPC Series in Advanced Integration and Packaging, Vol.

3: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research, Chapter

12, 2014.

9. D. Liu and S. V. Garimella, “Cooling Techniques for Electronic Devices,” Chapter in Heat and Mass

Transfer (6.170), Encyclopedia of Life Support Systems, UNESCO-EOLSS Joint Committee.

10. D. Liu and S. V. Garimella, “Electromechanical Actuation of Nanofluids,” in Nanoparticles: Synthesis,

Characterization and Applications, R. S. Chaughule (ed.), American Scientific Publishers, 2009.

11. S. Krishnan, S. V. Garimella and J. Y. Murthy, “Thermal Characterization of Open-Celled Metal Foams by

Direct Simulation,” in Cellular and Porous Materials: Thermal Properties Simulation and Prediction,

Ochsner, Murch and de Lemos (Eds), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, 2009.

12. S. Krishnan, S. V. Garimella and J. Y. Murthy, “Metal Foams as Passive Control of Thermal Systems,” in

Emerging Topics in Heat and Mass Transfer in Porous Media - from Bioengineering and Microelectronics

to Nanotechnology, P. Vadasz (Ed.), Springer, 2008.

13. P. Chamarthy, S. T. Wereley, and S. V. Garimella, “μPIV based Diffusometry,” in Encyclopedia of Micro

and Nano-Fluidics, 2007.

Suresh V. Garimella, July 2024

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14. S. V. Garimella and J. E. Simpson, “Numerical Treatment of Moving Interfaces in Phase-Change

Processes,” in Fluid Dynamics at Interfaces, W. Shyy and R. Narayanan (eds.), Cambridge University

Press, pp. 278-293, 1999.

15. S. V. Garimella, Flow Visualization Methods and Their Application in Electronic Systems, Chapter 10,

Thermal Measurements in Electronics Cooling (K. Azar, ed.) CRC Press, 1997,

ISBN 0-8493-3279-6.

16. S. V. Garimella, Enhanced Air Cooling of Electronic Equipment, Chapter 6, Air Cooling Technology for

Electronic Equipment (S. J. Kim and S. W. Lee eds.) CRC Press, 1996,

ISBN 0-8493-9447-3.

Refereed Journal Publications

1. M. Bongarala, J. A. Weibel, S. V. Garimella, “A Method to Partition Boiling Heat Transfer Mechanisms

using Synchronous Through-Substrate High-Speed Visual and Infrared Measurements,” International

Journal of Heat and Mass Transfer Vol. 226, p. 125516, 2024.

2. C Mira-Hernandez, J. A. Weibel, S. V. Garimella, “Critical Heat Flux Degradation due to Flow Disturbances

and Pressure Oscillations under Confined and Submerged Two-Phase Water Jet Impingement,”

International Journal of Heat and Mass Transfer Vol. 228, p. 125577, 2024.

3. K. Baraya, J. A. Weibel, S. V. Garimella, “Transient Recovery from Heat Pipe Dryout by Power Throttling,”

International Journal of Heat and Mass Transfer Vol. 221, p. 125104, 2024.

4. H. V. Inamdar, E. A. Groll, J. A. Weibel, and S. V. Garimella, “Air-Side Fouling of Finned Heat Exchangers:

Part 1, Review and Proposed Test Protocol,” International Journal of Refrigeration Vol. 151, pp. 77-86,

2023.

5. H. V. Inamdar, E. A. Groll, J. A. Weibel, and S. V. Garimella, “Air-Side Fouling of Finned Heat Exchangers:

Part 2, Experimental Demonstration and Assessment of Test Protocol,” International Journal of

Refrigeration Vol. 151, pp. 63-67, 2023.

6. M. D. Clark, Md E. Rahman, J. A. Weibel, and S. V. Garimella, “Effect of Thermal Capacitance on

Microchannel Heat Sink Response to Pressure Drop Oscillations,” International Journal of Heat and Mass

Transfer Vol. 214, p. 124369, 2023.

7. R. Roy, J. A. Weibel, and S. V. Garimella, “An Exclusion Distance Controls the Efflorescence Pattern

Distribution on Porous Media during Salt Solution Evaporation,” International Journal of Heat and Mass

Transfer Vol. 209, p. 124104, 2023.

8. K. Baraya, J. A. Weibel, and S. V. Garimella, “Wetting Hysteresis as the Mechanism of Heat Pipe Post-

dryout Thermal Hysteresis and Recovery,” International Journal of Heat and Mass Transfer Vol. 204, p.

123875, 2023.

9. M. D. Clark, J. A. Weibel, and S. V. Garimella, “Impact of Pressure Drop Oscillations and Parallel Channel

Instabilities on Microchannel Flow Boiling and Critical Heat Flux,” International Journal of Multiphase

Flow Vol. 161, p. 104380, 2023.

10. M. Bongarala, H. Hu, J. A. Weibel, and S. V. Garimella, “Microlayer Evaporation Governs Heat Transfer

Enhancement during Pool Boiling from Microstructured Surfaces,” Applied Physics Letters Vol. 120, p.

221602, 2022.

11. S. K. Lyons, A. Chandramohan, J. A. Weibel, and S. V. Garimella, “Simultaneous Measurement of

Temperature and Strain in Electronic Packages using Multi-Frame Super-Resolution Infrared

Thermography and Digital Image Correlation,” Journal of Electronics Packaging Vol. 144, p. 041019,

2022.

12. R. Roy, J. A. Weibel, and S. V. Garimella, “Predicting the Formation of Efflorescence and Subflorescence

caused by Salt Solution Evaporation from Porous Media,” International Journal of Heat and Mass

Transfer Vol. 189, p. 122645, 2022.

13. T. P. Allred, J. A. Weibel, and S. V. Garimella, “The Effect of Dynamic Wetting Behavior on Boiling Heat

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Transfer Mechanisms during Bubble Growth and Departure,” International Journal of Heat and Mass

Transfer Vol. 184, p. 122276, 2022.

14. M. Bongarala, H. Hu, J. A. Weibel, and S. V. Garimella, “A Figure of Merit to Characterize the Efficacy of

Evaporation from Porous Microstructured Surfaces,” International Journal of Heat and Mass Transfer

Vol. 182, p. 121964, 2022.

15. S. K. Lyons, A. Chandramohan, J. A. Weibel, and S. V. Garimella, “Simultaneous Measurement of

Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared

Thermography and Digital Image Correlation,” ASME Journal of Electronic Packaging Vol. 144, 041019,

2021.

16. A. Miglani, A. Soto, J. A. Weibel, and S. V. Garimella, “The Effect of Uneven Heating on the Flow

Distribution between Parallel Microchannels undergoing Boiling,” ASME Journal of Electronics Packaging

Vol. 143, 041107, 2021.

17. T. A. Kingston, B. D. Olson, J. A. Weibel, and S. V. Garimella, “Transient Flow Boiling and Maldistribution

Characteristics in Heated Parallel Channels induced by Flow Regime Oscillations,” IEEE Transactions on

Components Packaging and Manufacturing Technology Vol. 11, pp. 1615-1624, 2021.

18. M. D. Clark, J. A. Weibel, and S. V. Garimella, “Impact of Pressure Drop Oscillations on Surface

Temperature and Critical Heat Flux during Flow Boiling in a Microchannel,” IEEE Transactions on

Components Packaging and Manufacturing Technology Vol. 11, pp. 1634-1644, 2021.

19. A. Bar-Cohen, M. Asheghi, T. Chainer, S. V. Garimella, K. Goodson, C. Gorle, R. Mandel, J. Maurer, M.

Ohadi, J. W. Palko, P. Parida, Y. Peles, J. Plawsky, M. Schultz, J. A. Weibel, and Y. Joshi, “The ICECool

Fundamentals Effort on Evaporative Cooling of Microelectronics,” IEEE Transactions on Components

Packaging and Manufacturing Technology Vol. 11, pp. 1546-1564, 2021.

20. S. Sudhakar, J. A. Weibel, and S. V. Garimella, “A Semi-Empirical Model for Thermal Resistance and

Dryout during Boiling in Thin Porous Evaporators fed by Capillary Action, International Journal of Heat

and Mass Transfer Vol. 181, 121887, 2021.

21. T. P. Allred, J. A. Weibel, and S. V. Garimella, “The Role of Dynamic Wetting Behavior during Bubble

Growth and Departure from a Solid Surface,” International Journal of Heat and Mass Transfer Vol. 172,

121167, 2021.

22. A. Miglani, J. A. Weibel, and S. V. Garimella, “An Experimental Investigation of the Effect of Thermal

Coupling between Parallel Microchannels Undergoing Boiling on the Ledinegg Instability-Induced Flow

Maldistribution,” International Journal of Multiphase Flow Vol. 139, 103536, 2021.

23. A. Miglani, J. A. Weibel, and S. V. Garimella, “Measurement of Flow Maldistribution Induced by the

Ledinegg Instability during Boiling in Thermally Isolated Parallel Microchannels,” International Journal of

Multiphase Flow Vol. 139, 103644, 2021.

24. K. Baraya, J. A. Weibel, and S. V. Garimella, “Effective Anisotropic Properties-based Representation of

Vapor Chambers,” IEEE Transactions on Components Packaging and Manufacturing Technology Vol. 11,

pp. 51-56, 2021.

25. R. Roy, R. L. Seiler, J. A. Weibel, and S.V. Garimella, “Droplets on Soft Surfaces Exhibit a Reluctance to

Coalesce due to an Intervening Wetting Ridge,” Advanced Materials Interfaces Vol. 7, 2000731, 2020

(image from paper featured on inside back cover).

26. A. Jain, A. Miglani, J. A. Weibel, and S. V. Garimella, “The Effect of Channel Diameter on Flow Freezing in

Microchannels,” International Journal of Heat and Mass Transfer Vol. 157, 119718, 2020.

27. T. A. Kingston, J. A. Weibel, and S. V. Garimella, “Time-Resolved Characterization of Microchannel Flow

Boiling During Transient Heating: Part 1 – Dynamic Response to a Single Heat Flux Pulse,” International

Journal of Heat and Mass Transfer Vol. 154, 119643, 2020.

28. T. A. Kingston, J. A. Weibel, and S. V. Garimella, “Time-Resolved Characterization of Microchannel Flow

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Boiling During Transient Heating: Part 2 – Dynamic Response to Time-Periodic Heat Flux Pulses,”

International Journal of Heat and Mass Transfer Vol. 154, 119686, 2020.

29. K. P. Drummond, J. A. Weibel, and S. V. Garimella, “Two-Phase Flow Morphology and Local Wall

Temperatures in High-Aspect-Ratio Manifold Microchannels,” International Journal of Heat and Mass

Transfer Vol. 153, 119551, 2020.

30. Z. Pan, J. A. Weibel, and S.V. Garimella, “Transport Mechanisms during Water Droplet Evaporation on

Heated Substrates,” International Journal of Heat and Mass Transfer Vol. 152, 119524, 2020.

31. H. Hu, J. A. Weibel, and S. V. Garimella, “Role of Nanoscale roughness in the Heat Transfer

Characteristics of Thin Film Evaporation, International Journal of Heat and Mass Transfer Vol. 150,

119306, 2020.

32. G. Patankar, J. A. Weibel, and S. V. Garimella, “On the Transient Thermal Response of Thin Vapor

Chamber Heat Spreaders: Optimized Design and Fluid Selection,” International Journal of Heat and Mass

Transfer Vol. 148, 119106, 2020.

33. S. Sudhakar, J. A. Weibel, F. Zhou, E. M. Dede, and S. V. Garimella, “The Role of Vapor Venting and Liquid

Feeding on the Dryout Limit of Two-Layer Evaporator Wicks,” International Journal of Heat and Mass

Transfer Vol. 148, 119063, 2020.

34. K. Baraya, J. A. Weibel, and S. V. Garimella, “Heat Pipe Dryout and Temperature Hysteresis in Response

to Transient Heat Pulses Exceeding the Capillary Limit,” International Journal of Heat and Mass Transfer

Vol. 148, 119135, 2020.

35. A. Chandramohan, M. Chakraborty, J. A. Weibel, and S. V. Garimella, “Evaporation-Driven Micromixing

in Sessile Droplets for Miniaturized Absorbance-based Colorimetry,” ACS Omega Vol. 4, pp. 22385-

22391, 2019.

36. C. Mira- Hernández, J. A. Weibel, and S. V. Garimella, “Visualizing Near-Wall Two-Phase Flow

Morphology During Confined and Submerged Jet Impingement Boiling to the Point of Critical Heat Flux,”

International Journal of Heat and Mass Transfer Vol. 142, p. 118407, 2019.

37. M. Chakraborty, J. A. Weibel, J. A. Schaber, and S. V. Garimella, “The Wetting State of Water on a Rose

Petal,” Advanced Materials and Interfaces Vol. 6, p. 1900652, 2019.

38. D. Back, K. P. Drummond, M. D. Sinanis, J. A. Weibel, S. V. Garimella, D. Peroulis, and D. B. Janes,

“Design, Fabrication, and Characterization of a Compact Hierarchical Manifold Microchannel Heat Sink

Array for Two-Phase Cooling,” IEEE Transactions on Components Packaging and Manufacturing

Technology Vol. 9, pp. 1291-1300, 2019.

39. H. Hu, J. A. Weibel, and S. V. Garimella, “A Coupled Wicking and Evaporation Model for Prediction of

Pool Boiling Critical Heat Flux on Structured Surfaces,” International Journal of Heat and Mass Transfer

Vol. 136, pp. 373-382, 2019.

40. K. Baraya, J. A. Weibel, and S. V. Garimella, “Simultaneous Wick and Fluid Selection for the Design of

Minimized-Thermal-Resistance Vapor Chambers under Different Operating Conditions,” International

Journal of Heat and Mass Transfer Vol. 136, pp. 842-850, 2019.

41. C. Mira-Hernández, J. A. Weibel, P. P. Vlachos, and S. V. Garimella, “Three-Dimensional Liquid-Vapor

Interface Reconstruction from High-Speed Stereo Images during Pool Boiling,” International Journal of

Heat and Mass Transfer Vol. 136, pp. 265-275, 2019.

42. G. Patankar, J. A. Weibel, and S. V. Garimella, “On the Transient Thermal Response of Thin Vapor

Chamber Heat Spreaders: Governing Mechanisms and Performance Relative to Metal Spreaders,”

International Journal of Heat and Mass Transfer Vol. 136, pp. 995-1005, 2019.

43. S. Sudhakar, J. A. Weibel, F. Zhou, E.M. Dede, and S. V. Garimella, “Area-Scalable High-Heat-Flux

Dissipation at Low Thermal Resistance using a Capillary-Fed Two-Layer Evaporator Wick,” International

Journal of Heat and Mass Transfer Vol. 135, pp. 1346-1356, 2019.

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44. S. Sudhakar, J. A. Weibel, and S. V. Garimella, “Experimental Investigation of Boiling Regimes In a

Capillary-Fed Two-Layer Evaporator Wick,” International Journal of Heat and Mass Transfer Vol. 136, pp.

265-275, 2019.

45. K. N. Son, J. A. Weibel, J. C. Knox, and S. V. Garimella, “Limitations of the Axially Dispersed Plug-Flow

Model in Predicting Breakthrough in Confined Geometries,” Industrial & Engineering Chemistry Research

Vol. 58, pp 3853–3866, 2019.

46. T. P. Allred, J. A. Weibel, and S. V. Garimella, “The Petal Effect of Parahydrophobic Surfaces offers Low

Receding Contact Angles that Promote Effective Boiling,” International Journal of Heat and Mass

Transfer Vol. 135, pp. 403-412, 2019.

47. I. L. Collins, J. A. Weibel, L. Pan, and S. V. Garimella, “Evaluation of Additively Manufactured

Microchannel Heat Sinks,” IEEE Transactions on Components Packaging and Manufacturing Technology

Vol.

9, pp. 446-457, 2019 (2019 Best Paper Award).

48. S. Sudhakar, J. A. Weibel, and S. V. Garimella, “Design of an Area-Scalable Two-Layer Evaporator Wick

for High-Heat-Flux Vapor Chambers,” IEEE Transactions on Components Packaging and Manufacturing

Technology Vol. 9, pp. 458-472, 2019.

49. I. L. Collins, J. A. Weibel, L. Pan, and S. V. Garimella, “A Permeable-Membrane Microchannel Heat Sink

Made by Additive Manufacturing,” International Journal of Heat and Mass Transfer Vol. 131, pp. 1174-

1183, 2019.

50. T. A. Kingston, J. A. Weibel, and S. V. Garimella, “Ledinegg Instability-Induced Temperature Excursion

Between Thermally Isolated, Heated Parallel Microchannels,” International Journal of Heat and Mass

Transfer Vol. 132, pp. 550-556, 2019.

51. M. D. Clark, J. A. Weibel, and S. V. Garimella, “Identification of Nucleate Boiling as the Dominant Heat

Transfer Mechanism during Confined Two-Phase Jet Impingement,” International Journal of Heat and

Mass Transfer Vol. 128, pp. 1095-1101, 2019.

52. A. Jain, A. Miglani, Y. Huang, J. A. Weibel, and S. V. Garimella, “Ice Formation Modes during Flow

Freezing in a Small Cylindrical Channel,” International Journal of Heat and Mass Transfer Vol. 128, pp.

836-848, 2019.

53. K. N. Son, J. A. Weibel, J. C. Knox, and S. V. Garimella, “Calibration and Uncertainty Analysis of a Fixed-

Bed Adsorption Model for CO2 Separation” Adsorption Vol. 24 (8), pp 781–802, 2018.

54. R. Roy, J. A. Weibel, and S. V. Garimella, “Reentrant Cavities Enhance Resilience to the Cassie-to-Wenzel

State Transition on Superhydrophobic Surfaces during Electrowetting,” Langmuir Vol. 34 (43), pp 12787–

12793, 2018.

55. A. Chandramohan, S. K. Lyons, J. A. Weibel, and S. V. Garimella, “Error Reduction in Infrared

Thermography by Multiframe Super-Resolution,” ASME Journal of Electronics Packaging Vol. 140,

041008, 2018.

56. M. Chakraborty, J. A. Weibel, and S. V. Garimella, “Tears of an Evaporating Methanol Meniscus on a

Silicon Substrate,” Applied Physics Letters Vol. 113, 083703, 2018 (chosen as Editor’s Pick).

57. T. A. Kingston, J. A. Weibel, and S. V. Garimella, “High-Frequency Thermal-Fluidic Characterization of

Dynamic Microchannel Flow Boiling Instabilities: Part 1 - Rapid-Bubble-Growth Instability at the Onset of

Boiling,” International Journal of Multiphase Flow Vol. 106, pp. 179-188, 2018.

58. T. A. Kingston, J. A. Weibel, and S. V. Garimella, “High-Frequency Thermal-Fluidic Characterization of

Dynamic Microchannel Flow Boiling Instabilities: Part 2 - Impact of Operating Conditions on Instability

Type and Severity,” International Journal of Multiphase Flow Vol. 106, pp. 189-201, 2018.

59. K. P. Drummond, D. Back, M. D. Sinanis, D. B. Janes, and D. Peroulis, J. A. Weibel, and S. V. Garimella,

“Characterization of Hierarchical Manifold Microchannel Heat Sink Arrays under Simultaneous

Suresh V. Garimella, July 2024

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Background and Hotspot Heating Conditions,” International Journal of Heat and Mass Transfer Vol.

126A, pp. 1289-1301, 2018.

60. K. N. Son, J. C. Knox, G. E. Cmarik, J. A. Weibel, and S. V. Garimella, “Measurement and Prediction of

Heat of Adsorption and Equilibrium Concentration of CO

on Zeolite 13X,” Journal of Chemical and

Engineering Data Vol. 63 (5), pp. 1663–1674, 2018.

61. T. P. Allred, J. A. Weibel, and S. V. Garimella, “Enabling Highly Effective Boiling from Superhydrophobic

Surfaces,” Physical Review Letters Vol. 120, 174501, 2018 (featured on issue cover).

62. C. Mira-Hernández, M. D. Clark, J. A. Weibel, and S. V. Garimella, “Development and Validation of a

Semi-Empirical Model for Two-Phase Heat Transfer from Arrays of Impinging Jets,” International Journal

of Heat and Mass Transfer Vol. 124, pp. 782–793, 2018.

63. T. Van Oevelen, J. A. Weibel, and S. V. Garimella, “The Effect of Lateral Thermal Coupling Between

Parallel Microchannels on Two-Phase Flow Distribution,” International Journal of Heat and Mass

Transfer Vol. 124, pp. 769–781, 2018.

64. K. P. Drummond, D. Back, M. D. Sinanis, D. B. Janes, and D. Peroulis, J. A. Weibel, and S. V. Garimella, “A

Hierarchical Manifold Microchannel Heat Sink Array for High-Heat-Flux Two-Phase Cooling of

Electronics,” International Journal of Heat and Mass Transfer Vol. 117, pp. 319-330, 2018.

65. G. Patankar, J. A. Weibel, and S. V. Garimella, “A Validated Time-Stepping Analytical Model for 3D

Transient Vapor Chamber Transport,” International Journal of Heat and Mass Transfer Vol. 119, pp. 867–

879, 2018.

66. X. Chen, S. Ku, J. A. Weibel, E. Ximenes, X. Liu, M. Ladisch, and S. V. Garimella, “Enhanced Antimicrobial

Efficacy of Bimetallic Porous CuO Microspheres Decorated with Ag Nanoparticles”, ACS Applied

Materials and Interfaces Vol. 9, pp. 39165-39173, 2017.

67. H. Hu, M. Chakraborty, T. P. Allred, J. A. Weibel, and S. V. Garimella, “Multiscale Modeling of the Three-

Dimensional Meniscus Shape of a Wetting Liquid Film on Micro-/Nano-Structured Surfaces,” Langmuir

Vol. 33, pp. 12028–12037, 2017.

68. K. N. Son, J. A. Weibel, and S. V. Garimella, “Design of Multifunctional Lattice-Frame Materials for

Compact Heat Exchangers,” International Journal of Heat and Mass Transfer Vol. 115 Part A, pp. 619-

629, 2017.

69. R. S. Patel, J. A. Weibel, and S. V. Garimella, “Characterization of Liquid Film Thickness in Slug-Regime

Microchannel Flow,” International Journal of Heat and Mass Transfer Vol. 115 Part A, pp. 1137-1143,

2017.

70. T. P. Allred, J.A. Weibel, and S. V. Garimella, “A Wettability Metric for Characterization of Capillary Flow

on Textured Superhydrophilic Surfaces,” Langmuir Vol. 33, pp. 7847-7853, 2017.

71. S. V. Garimella, T. Persoons, J. A. Weibel, V. Gektin, “Electronics Thermal Management in Information

and Communications Technologies: Challenges and Future Directions,” IEEE Transactions on

Components Packaging and Manufacturing Technology Vol. 7, pp. 1191-1205, 2017.

72. R. S. Patel, J. A. Weibel, and S. V. Garimella, “Mechanistic Modeling of the Liquid Film Shape and Heat

Transfer Coefficient in Annular-Regime Microchannel Flow Boiling,” International Journal of Heat and

Mass Transfer Vol. 114, pp. 841-851, 2017.

73. X. Chen, J. A. Weibel, and S. V. Garimella, “Characterization of Coalescence-Induced Droplet Jumping

Height on Hierarchical Superhydrophobic Surfaces,” ACS Omega Vol. 2, pp. 2883-2890, 2017.

74. T. Guo, M. J. Rau, P. P. Vlachos and S. V. Garimella, “Axisymmetric Wall Jet Development in Confined Jet

Impingement,” Physics of Fluids Vol. 29, 025102, 2017.

75. A. Chandramohan, J.A. Weibel, and S.V. Garimella, “Spatiotemporal Infrared Measurement of Interface

Temperatures During Water Droplet Evaporation on a Nonwetting Substrate,” Applied Physics Letters

Vol. 110, p. 041605, 2017.

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76. T. Van Oevelen, J. A. Weibel, and S. V. Garimella, “Predicting Two-Phase Flow Distribution and Stability

in Systems with Many Parallel Heated Channels, International Journal of Heat and Mass Transfer Vol.

107, pp. 557-571, 2017.

77. S. H. Taylor and S. V. Garimella, “Design of Electrode Arrays for 3D Capacitance Tomography in Planar

Domains,” International Journal of Heat and Mass Transfer Vol. 106, pp. 1251-1260, 2017.

78. T. A. Kingston, J. A. Weibel, and S. V. Garimella, “An Experimental Method for Controlled Generation and

Characterization of Microchannel Slug Flow Boiling,” International Journal of Heat and Mass Transfer

Vol. 106, pp. 619-628, 2017.

79. G. Patankar, J. A. Weibel, and S. V. Garimella, “Working-Fluid Selection for Minimized Thermal

Resistance in Ultra-Thin Vapor Chambers,” International Journal of Heat and Mass Transfer Vol. 106, pp.

648-654, 2017.

80. Z. Pan, J. A. Weibel, and S. V. Garimella, “Numerical Simulation of Evaporating Two-Phase Flow in a High-

Aspect-Ratio Microchannel with Bends, Journal of Heat Transfer Vol. 139(2), p. 020901, 2017.

81. S. Sarangi, J. A. Weibel, and S. V. Garimella, “Quantitative Evaluation of the Dependence of Pool Boiling

Heat Transfer Enhancement on Sintered-Particle Coating Characteristics,” Journal of Heat Transfer Vol.

139(2), 021502 (13 pp), 2016.

82. G. Patankar, J. A. Weibel, and S. V. Garimella, “Patterning the Condenser-Side Wick in Ultra-Thin vVapor

Chamber Heat Spreaders to Improve Skin Temperature Uniformity of Mobile Devices,” International

Journal of Heat and Mass Transfer Vol. 101, pp 927-936, 2016.

83. S. Hatte, C. Mira-Hernández, S. Advaith, A. Tinaikara, U.K. Chetia, K. V. Manu, K. Chattopadhyay, J. A.

Weibel, S. V. Garimella, V. Srinivasan, and S. Basu, “Short and Long-Term Sensitivity of Lab-Scale

Thermocline Based Thermal Storage to Flow Disturbances,” Applied Thermal Engineering Vol. 109, Part

B, pp. 936-948, 2016.

84. K. P. Buno, X. Chen, J. A. Weibel, S. N. Thiede, S. V. Garimella, M. C. Yoder, and S. L. Voytik-Harbin, “In-

vitro Multi-Tissue Interface Model Supports Rapid Vasculogenesis and Mechanistic Study of

Vascularization Across Tissue Compartments,” ACS Applied Materials & Interfaces Vol. 8, pp. 21848-

21860, 2016.

85. H. Inamdar, E. A. Groll, J. A. Weibel, and S. V. Garimella, “Prediction of Air-Side Particulate Fouling of

HVAC&R Heat Exchangers,” Applied Thermal Engineering Vol. 104, pp. 720-733, 2016.

86. A. Chandramohan, S. Dash, J. A. Weibel, X. Chen, and S. V. Garimella, “Marangoni Convection in

Evaporating Organic Liquid Droplets on a Nonwetting Substrate,” Langmuir Vol. 32, pp. 4729-4735,

2016.

87. C. Mira-Hernández, J. A. Weibel, E. A. Groll, and S. V. Garimella, “Compressed-Liquid Energy Storage

with an Adsorption-based Vapor Accumulator for Solar-Driven Vapor Compression Systems in

Residential Cooling,” International Journal of Refrigeration Vol. 64, pp. 176-186, 2016.

88. M. J. Rau, P. P. Vlachos, and S. V. Garimella, “A Tomographic-PIV Investigation of Vapor-Induced Flow

Structures in Confined Jet Impingement Boiling,” International Journal of Multiphase Flow Vol. 84, pp.

86-97, 2016.

89. M. J. Rau, T. Guo, P. P. Vlachos, and S. V. Garimella, “Stereo-PIV Measurements of Vapor-Induced Flow

Modifications in Confined Jet Impingement Boiling,” International Journal of Multiphase Flow Vol. 84,

pp. 19-33, 2016.

90. X. Chen, J. A. Weibel, and S. V. Garimella, “Continuous Oil-Water Separation using Polydimethylsiloxane

(PDMS)-Functionalized Melamine Sponge,” Industrial & Engineering Chemistry Research Vol. 55, pp.

3596-3602, 2016.

91. S. H. Taylor and S. V. Garimella, “Capacitive Sensing of Local Bond Layer Thickness and Coverage in

Thermal Interface Materials,” International Journal of Heat and Mass Transfer Vol. 97, pp. 26-31, 2016.

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92. G. Patankar, S. Mancin, J. A. Weibel, M. A. MacDonald, and S. V. Garimella, “A Method for Thermal

Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection,” ASME

Journal of Electronic Packaging Vol. 138, p. 011003, 2016.

93. X. Chen, R. S. Patel, J. A. Weibel, and S. V. Garimella, “Coalescence-Induced Jumping of Multiple

Condensate Droplets on Hierarchical Superhydrophobic Surfaces,” Scientific Reports Vol. 6, p. 18649,

2016.

94. Z. Pan, J. A. Weibel, and S. V. Garimella, “A Saturated-Interface-Volume Phase Change Model for

Simulating Flow Boiling,” International Journal of Heat and Mass Transfer Vol. 93, pp. 945-956, 2016.

95. X. Chen, J. A. Weibel, and S. V. Garimella, “Water and Ethanol Droplet Wetting Transition during

Evaporation on Omniphobic Surfaces,” Scientific Reports Vol. 5 A, p. 17110, 2015.

96. S. H. Taylor and S. V. Garimella, “An Explicit Conditioning Method for Image Reconstruction in Electrical

Capacitance Tomography,” Flow Measurement and Instrumentation Vol. 46 Part A, pp. 155-162, 2015.

97. R. A. Simmons, G. M. Shaver, W. E. Tyner and S. V. Garimella, “A Benefit-Cost Assessment of New

Vehicle Technologies and Fuel Economy in the U.S. Market,” Applied Energy Vol. 157, pp. 940-952, 2015.

98. Y. Yadavalli, J. A. Weibel, and S. V. Garimella, “Performance-Governing Transport Mechanisms for Heat

Pipes at Ultra-thin Form Factors,” IEEE Transactions on Components Packaging and Manufacturing

Technology Vol. 5, pp. 1618-1627, 2015.

99. S. H Taylor and S. V. Garimella, “Shape-Energy Evolutionary Reconstruction Algorithm for Electrical

Capacitance Tomography in a High-Aspect-Ratio Domain,” Sensors and Actuators A: Physical Vol. 233,

pp. 349-359, 2015.

100. X. Chen, J. A. Weibel, and S. V. Garimella, “Hierarchical Superhydrophobic Copper for Sustained

Dropwise Condensation,” ASME Journal of Heat Transfer Vol. 137, 080904, 2015.

101. A. Diani, K. K. Bodla, L. Rossetto and S. V. Garimella, “Numerical Investigation of Pressure Drop and Heat

Transfer through Reconstructed Metal Foams and Comparison against Experiments,” International

Journal of Heat and Mass Transfer Vol. 88, pp. 508-515, 2015.

102. M. J. Rau, S. V. Garimella, E. M. Dede, and S. N. Joshi, “Boiling Heat Transfer from an Array of Round Jets

with Hybrid Surface Enhancements,” ASME Journal of Heat Transfer Vol. 137, 071501 (9 pp), 2015.

103. R. P. Patel, J. A. Weibel, and S. V. Garimella, “An Optical Approach for Quantitative Characterization of

Slug Bubble Interface Profiles in a Two-Phase Microchannel Flow,” International Journal of Heat and

Mass Transfer Vol. 86, pp 31-38, 2015.

104. C. Mira-Hernández, S. M. Flueckiger and S. V. Garimella, “Comparative Analysis of Single- and Dual-

Media Thermocline Tanks for Thermal Energy Storage in Concentrating Solar Power Plants,” ASME

Journal of Solar Energy Engineering Vol. 137, 031012 (10 pp), 2015.

105. X. Chen, J. A. Weibel and S. V. Garimella, “Exploiting Microscale Roughness on Hierarchical

Superhydrophobic Copper Surfaces for Enhanced Dropwise Condensation, Advanced Materials

Interfaces Vol. 2, 1400480 (6 pp), 2015 (Image from paper featured on issue cover).

106. S. H. Taylor and S. V. Garimella, “Near-Field Focusing Sensor for Characterization of Void Content in Thin

Dielectric Layers,” Measurement Science and Technology Vol. 26, 015601 (11 pp), 2015.

107. J. E. Castillo, J.A. Weibel, and S.V. Garimella, “The Effect of Relative Humidity on Dropwise Condensation

Dynamics,” International Journal of Heat and Mass Transfer Vol. 80, pp. 759-766, 2015.

108. Z. Pan, J. A. Weibel and S. V. Garimella, “Spurious Current Suppression in VOF-CSF Simulation of Slug

Flow through Small Channels,” Numerical Heat Transfer A Vol. 67, pp. 1-12, 2015.

109. S. Sarangi, J. A. Weibel and S. V. Garimella, “Effect of Particle Size on Surface-Coating Enhancement of

Pool Boiling Heat Transfer,” International Journal of Heat and Mass Transfer Vol. 81, pp. 103-113, 2015.

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110. S. Dash, A. Chandramohan, J. A. Weibel and S. V. Garimella, “Buoyancy-Induced On-the-Spot Mixing in

Droplets Evaporating on Non-Wetting Surfaces,” Physics Review E Vol. 90, 062407 (8 pp), 2014.

111. S. N. Ritchey, J. A. Weibel, and S. V. Garimella, “Effects of Non-Uniform Heating on the Location and

Magnitude of Critical Heat Flux in a Microchannel Heat Sink,” International Journal of Micro-Nano Scale

Transport Vol. 5(3), pp. 95-108, 2014.

112. S. H. Taylor and S. V. Garimella,

“Void Detection in Dielectric Films using a Floating Network of

Substrate-Embedded Electrodes,” ASME Journal of Electronic Packaging Vol. 136, 041008 (11 pp), 2014.

113. M. J. Rau, E. M. Dede and S. V. Garimella, “Local Single- and Two-Phase Heat Transfer from an Impinging

Cross-Shaped Jet,” International Journal of Heat and Mass Transfer Vol. 79, pp. 432-436, 2014.

114. S. H. Taylor and S. V. Garimella, “Level-Set Shape Reconstruction of Binary Permittivity Distributions

from Near-Field Focusing Capacitance Measurements,” Measurement Science and Technology Vol. 25,

105602 (12 pp), 2014.

115. Z. Pan, J. A. Weibel, and S.V. Garimella, “Influence of Surface Wettability on Transport Mechanisms

Governing Water Droplet Evaporation, Langmuir Vol. 30, pp. 9726-9730, 2014.

116. M. J. Rau and S. V. Garimella, “Confined Jet Impingement with Boiling on a Variety of Enhanced

Surfaces,” ASME Journal of Heat Transfer Vol. 136, 101503, 2014.

117. J. L. Plawsky, A. G. Fedorov, S. V. Garimella, H. B. Ma, S. C. Maroo, C. Li, and Y. Nam, “Nano- and Micro-

structures for Thin Film Evaporation – A Review,” Nano and Microscale Thermophysical Engineering Vol.

18:3, pp. 251-269, 2014.

118. S. Dash, A. Chandramohan, and S. V. Garimella, “Flow Visualization During Droplet Evaporation on

Hydrophobic and Superhydrophobic Surfaces,” ASME Journal of Heat Transfer Vol. 136, 080917, 2014.

119. P. Valiorgue, S. N. Ritchey, J. A. Weibel and S. V. Garimella, “Design of a Non-intrusive Electrical

Impedance-Based Void Fraction Sensor for Microchannel Two-Phase Flows,” Measurement Science and

Technology Vol. 25, 095301, 2014.

120. M. Dicuangco, S. Dash, J. A. Weibel, and S. V. Garimella, “Effect of Superhydrophobic Surface

Morphology on Evaporative Deposition Patterns,” Applied Physics Letters Vol. 104, 201604, 2014.

121. K. K. Bodla and S. V. Garimella, “Simulated Microstructural Evolution and Design of Porous Sintered

Wicks,” Journal of Heat Transfer Vol. 135, 072601 (10 pp.), 2014.

122. S. Dash and S. V. Garimella, “Droplet Evaporation on Heated Hydrophobic and Superhydrophobic

Surfaces,” Physics Review E Vol. 89, 042402 (8 pp.), 2014.

123. D. R. McKinnis, M. A. Sloan, L. D. Snow, and S. V. Garimella, “A University Engagement Model for

Achieving Technology Adoption and Performance Improvement Impacts in Healthcare, Manufacturing,

and Government,” Journal of Higher Education Outreach and Engagement Vol. 18, pp. 187-213, 2014.

124. R. S. Patel and S. V. Garimella, “Technique for Quantitative Mapping of Three-Dimensional Liquid-Gas

Phase Boundaries in Microchannel Flows,” International Journal of Multiphase Flow Vol. 62C, pp. 45-51,

2014.

125. K. K. Bodla, S. V. Garimella, and J. Y. Murthy, “3D Reconstruction and Design of Porous Media from Thin

Sections,” International Journal of Heat and Mass Transfer Vol. 73, pp. 25-264, 2014.

126. T. Y. Kim, J. A. Weibel and S. V. Garimella, “A Free-Particles-Based Technique for Boiling Heat Transfer

Enhancement in a Wetting Liquid,” International Journal of Heat and Mass Transfer Vol. 71 pp. 808-817,

2014.

127. T. Y. Kim and S. V. Garimella, “Investigation of Boiling Heat Transfer in Water using a Free-Particles-

Based Enhancement Technique,” International Journal of Heat and Mass Transfer Vol. 71, pp. 818-828,

2014.

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128. S. Sarangi, K. K. Bodla, S. V. Garimella, and J. Y. Murthy, “Manifold Microchannel Heat Sink Design Using

Optimization Under Uncertainty,” International Journal of Heat and Mass Transfer Vol. 6, pp 92-105,

2014.

129. S. N. Ritchey, J. A. Weibel and S. V. Garimella, “Local Measurement of Flow Boiling Heat Transfer in an

Array of Non-Uniformly Heated Microchannels,” International Journal of Heat and Mass Transfer Vol.

71, pp. 206-216, 2014.

130. S. M. Flueckiger and S. V. Garimella, “Latent-Heat Augmentation of Thermocline Energy Storage for

Concentrating Solar Power – A System-Level Assessment,” Applied Energy Vol. 116, pp. 278-287, 2014.

131. S. M. Flueckiger, B. D. Iverson, S. V. Garimella, and J. E. Pacheco, “System-Level Simulation of a Solar

Power Tower Plant with Thermocline Thermal Energy Storage,” Applied Energy Vol. 113, pp. 86-96,

2014.

132. Z. Pan, S. Dash, J. A. Weibel and S. V Garimella, “Assessment of Water Droplet Evaporation Mechanisms

on Hydrophobic and Superhydrophobic Substrates,” Langmuir

Vol. 29, pp. 15831-15841, 2013.

133. C. R. Bradshaw, E. A. Groll, and S. V. Garimella, “Linear Compressors for Electronics Cooling: Energy

Recovery and its Benefits,” International Journal of Refrigeration Vol. 36, pp. 2007-2013, 2013.

134. C. R. Bradshaw, E. A. Groll and S. V. Garimella, “Sensitivity Analysis of a Comprehensive Model for a

Miniature-Scale Linear Compressor for Electronics Cooling,” International Journal of Refrigeration Vol.

36, pp. 1998-2006, 2013.

135. B. J. Woodland, A. Krishna, E. A. Groll, J. E. Braun, W. T. Horton, and S. V. Garimella, “Thermodynamic

Comparison of Organic Rankine Cycles Employing Liquid-Flooded Expansion or a Solution Circuit,”

Applied Thermal Engineering Vol. 61, pp. 859-865, 2013.

136. S. M. Flueckiger, B. D. Iverson, and S. V. Garimella, “Economic Optimization of a Concentrating Solar

Power Plant with Molten-salt Thermocline Storage,” ASME Journal of Solar Energy Engineering Vol. 136,

01101, 2013.

137. J. A. Weibel and S. V. Garimella, “Recent Advances in Vapor Chamber Transport Characterization for

High Heat Flux Applications,” Advances in Heat Transfer Vol. 45, pp. 209-301, 2013.

138. A. Ebrahimi, P. Dak, E. Salm, S Dash, S. V. Garimella, R. Bashir, and M. A. Alam, “Nanotextured

Superhydrophobic Electrodes Enable Detection of Attomolar-Scale DNA Concentration within a Droplet

by Non-Faradaic Impedance Spectroscopy,” Lab on a Chip Vol. 13, pp. 4248-4256, 2013.

139. M. J. Rau and S. V. Garimella, “Local Two-Phase Heat Transfer from Arrays of Confined and Submerged

Impinging Jets,” International Journal of Heat and Mass Transfer Vol. 67, pp. 487-498, 2013.

140. S. Dash and S. V. Garimella, “Droplet Evaporation Dynamics on a Superhydrophobic Surface with

Negligible Hysteresis,” Langmuir Vol. 29, pp. 10785-10795, 2013.

141. M. Dicuangco, S. Dash, and S. V. Garimella, “Evaporative Deposition on Superhydrophobic Surfaces,”

ASME Journal of Heat Transfer Vol. 135 080904, 2013.

142. J. A. Weibel, S. Sarangi, and S. V. Garimella, “Pool Boiling Heat Transfer from Deformable Particulate

Beds,” ASME Journal of Heat Transfer Vol. 135 080908, 2013.

143. K. K. Bodla, J. A. Weibel and S. V. Garimella, “Advances in Fluid and Thermal Transport Property Analysis

and Design of Sintered Porous Wick Microstructures,” ASME Journal of Heat Transfer Vol. 135, 061202

(13 pp), 2013.

144. S. M. Flueckiger, Z. Yang, and S. V. Garimella, “Review of Molten-Salt Thermocline Tank Modeling for

Solar Thermal Energy Storage,” Heat Transfer Engineering Vol. 34(10), pp. 787-800, 2013.

145. K. K. Bodla, J. Y. Murthy and S. V. Garimella, “Evaporation Analysis in Sintered Wick Microstructures,”

International Journal of Heat and Mass Transfer Vol. 61, pp. 729-741, 2013.

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146. S. V. Garimella, T. Persoons, J. A. Weibel, and L. T. Yeh, “Technological Drivers in Data Centers and

Telecom Systems: Multiscale Thermal, Electrical and Energy Management,” Applied Energy Vol. 107, pp.

66-80, 2013.

147. A. S. Kousalya, J. A. Weibel, S. V. Garimella and T. S. Fisher, “Metal Functionalization of Carbon

Nanotubes for Enhanced Sintered Powder Wicks,” International Journal of Heat and Mass Transfer Vol.

59, pp. 372-383, 2013.

148. J. A. Weibel, S. S. Kim, T. S. Fisher, and S. V. Garimella, “Experimental Characterization of Capillary-Fed

Carbon Nanotube Vapor Chamber Wicks,” ASME Journal of Heat Transfer Vol. 135, 021501 (7 pp), 2013.

149. K. K. Bodla, J. Y. Murthy and S. V. Garimella, “Optimization Under Uncertainty Applied to Heat Sink

Design,” ASME Journal of Heat Transfer Vol. 135, 011012 (13 pp), 2013.

150. Z. Yang and S. V. Garimella, “Cyclic Operation of Molten-Salt Thermal Energy Storage in Thermoclines for

Solar Power Plants,” Applied Energy Vol. 103, pp. 256-265, 2013.

151. J. P. McHale and S. V. Garimella, “Nucleate Boiling from Smooth and Rough Surfaces--Part 1: Fabrication

and Characterization of an Optically Transparent Heater-Sensor Substrate with Controlled Surface

Roughness,” Experimental Thermal and Fluid Science Vol. 44, pp. 456-467, 2013.

152. J. P. McHale and S. V. Garimella, “Nucleate Boiling from Smooth and Rough Surfaces--Part 2: Analysis of

Surface Roughness Effects on Nucleate Boiling,” Experimental Thermal and Fluid Science Vol. 44, 439-

455, 2013.

153. C. P. Migliaccio and S. V. Garimella, “Evaporative Heat Transfer from an Electrowetted Liquid Ribbon on

a Heated Substrate,” International Journal of Heat and Mass Transfer Vol. 57, pp. 73-81, 2013.

154. R. Ranjan, J. Y. Murthy, S. V. Garimella, D. H. Altman, and M. T. North, “Modeling and Design

Optimization of Ultra-Thin Vapor Chambers for High Heat Flux Applications,” IEEE Transactions on

Components, Packaging and Manufacturing Technology Vol. 2(9), pp. 1465-1479, 2012.

155. S. Flueckiger, Z. Yang and S. V. Garimella, “Thermomechanical Simulation of the Solar One Thermocline

Storage Tank,” ASME Journal of Solar Energy Engineering Vol. 134, 041014 (6 pp), 2012.

156. S. Flueckiger, F. Volle, S. V. Garimella, and R. K. Mongia, “Thermodynamic and Kinetic Investigation of a

Chemical Reaction-Based Miniature Heat Pump,” Energy Conversion and Management Vol. 64, pp. 222-

231, 2012.

157. C. P. Migliaccio and S. V. Garimella, “Dissipative Forces in the Electrowetted Cassie-Wenzel Transition on

Hydrophobic Rough Surfaces,” Nanoscale and Microscale Thermophysical Engineering Vol. 16(3), pp.

154-164, 2012.

158. S. V. Garimella, T. Persoons and L. T. Yeh, “Thermal Management Challenges in Telecommunications

Systems and Data Centers,” IEEE Transactions on Components, Packaging and Manufacturing

Technology Vol. 2(8), pp. 1307-1316, 2012.

159. S. Dash, M. T. Alt and S. V. Garimella, “Hybrid Surface Design for Robust Superhydrophobicity,”

Langmuir Vol. 28(25), pp. 9606-9615, 2012.

160. S. Dash, N. Kumari and S. V. Garimella, “Frequency-dependent Transient Response of an Oscillating

Electrically Actuated Droplet,” Journal of Micromechanics and Microengineering Vol. 22, 075004 (11 pp),

2012.

161. B. Gebreslassie, E. A. Groll and S. V. Garimella, “Multi-objective Optimization of Sustainable Single-Effect

Water/Lithium Bromide Absorption Cycle,” Renewable Energy Vol. 46, pp. 100-110, 2012.

162. N. Bajaj, G. Subbarayan and S. V. Garimella, “Topological Design of Channels for Squeeze Flow

Optimization of Thermal Interface Materials,” International Journal of Heat and Mass Transfer Vol. 55,

pp. 3560-3575, 2012.

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163. J. A. Weibel and S. V. Garimella, “Visualization of Vapor Formation Regimes during Capillary-Fed Boiling

in Sintered-Powder Heat Pipe Wicks,” International Journal of Heat and Mass Transfer Vol. 55(13-14),

pp. 3498-3510, 2012.

164. E. da Riva, D. Del Col, S. V. Garimella and A. Cavallini, “The Importance of Turbulence during

Condensation in a Horizontal Circular Minichannel,” International Journal of Heat and Mass Transfer Vol.

55, pp. 3470-3481, 2012.

165. S. R. Annapragada, T. Salamon, P. Kolodner, M. Hodes and S. V. Garimella, “Determination of Electrical

Contact Resistivity in Thermoelectric Modules (TEMS) from Module-Level Measurements,” IEEE

Transactions on Components, Packaging and Manufacturing Technology Vol. 2(4), pp. 668-676, 2012.

166. S. M. Flueckiger and S. V. Garimella, “Second-Law Analysis of Molten-Salt Thermal Energy Storage in

Thermoclines,” Solar Energy Vol. 86(5), pp. 1621-1631, 2012.

167. J. A. Weibel, S. S. Kim, T. S. Fisher, and S. V. Garimella, “Carbon Nanotube Coatings for Enhanced

Capillary-Fed Boiling from Porous Microstructures,” Nanoscale and Microscale Thermophysical

Engineering Vol. 16 (1) pp. 1-17, 2012 (highlighted as high-impact paper by the journal).

168. S. Paranjape, S. N. Ritchey and S. V. Garimella, “Electrical Impedance-Based Void Fraction Measurement

and Flow Regime Identification in Microchannel Flows under Adiabatic Conditions,” International

Journal of Multiphase Flow Vol. 42, pp. 175-183, 2012.

169. S. R. Annapragada, J. Y. Murthy and S. V. Garimella, “Droplet Retention on an Incline,” International

Journal of Heat and Mass Transfer Vol. 55, pp. 1457-1465, 2012.

170. S. R. Annapragada, J. Y. Murthy and S. V. Garimella, “Prediction of Droplet Dynamics on an Incline,”

International Journal of Heat and Mass Transfer Vol. 55, pp. 1466-1474, 2012.

171. K. K. Bodla, J. Y. Murthy, and S. V. Garimella, “Direct Simulation of Thermal Transport through Sintered

Wick Microstructures,” ASME Journal of Heat Transfer Vol. 134, 012602 (pp. 10), 2012.

172. T. Harirchian and S. V. Garimella, “Flow Regime-Based Modeling of Heat Transfer and Pressure Drop in

Microchannel Flow Boiling,” International Journal of Heat and Mass Transfer Vol. 55, pp. 1246–1260,

2012.

173. R. Ranjan, A. Patel, S. V. Garimella and J. Y. Murthy, “Wicking and Thermal Characteristics of

Micropillared Structures for use in Passive Heat Spreaders," International Journal of Heat and Mass

Transfer Vol. 55, pp. 586–596, 2012.

174. H. K. Dhavaleswarapu, J. Y. Murthy and S. V. Garimella, “Numerical Investigation of an Evaporating

Meniscus in a Channel,” International Journal of Heat and Mass Transfer Vol. 55, pp. 915–924, 2012.

175. R. A. Leffler, C. R. Bradshaw, E. A. Groll and S. V. Garimella, “Alternative Heat Rejection Methods for

Power Plants,” Applied Energy Vol. 92, pp. 17-25, 2012.

176. T. Chen and S. V. Garimella, “A Study of Critical Heat Flux during Flow Boiling in Microchannel Heat

Sinks,” ASME Journal of Heat Transfer Vol. 134, 011504 (9 pp), 2012.

177. N. Kumari and S. V. Garimella, “Electrowetting-Induced Dewetting Transitions on Superhydrophobic

Surfaces,” Langmuir Vol. 27 (17), pp 10342-10346, 2011.

178. S. Dash, N. Kumari and S. V. Garimella, “Characterization of Ultrahydrophobic Hierarchical Surfaces

Fabricated using a Single-Step Fabrication Methodology,” Journal of Micromechanics and

Microengineering Vol. 21, 105012 (12 pp), 2011.

179. R. Ranjan, S. V. Garimella, J. Y. Murthy and K. Yazawa, “Assessment of Nanostructured Capillary Wicks

for Passive Two-Phase Heat Transport,” Nanoscale and Microscale Thermophysical Engineering Vol. 15

(3), pp. 179-194, 2011.

180. J. P. McHale, S. V. Garimella, T. S. Fisher and G. A. Powell, “Pool Boiling Performance Comparison of

Smooth and Sintered Copper Surfaces with and without Carbon Nanotubes,” Nanoscale and Microscale

Thermophysical Engineering Vol. 15 (3), pp. 133-150, 2011 (Image from paper featured on issue cover).

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181. S. R. Annapragada, S. Dash, S. V. Garimella and J. Y. Murthy, “Dynamics of Droplet Motion under

Electrowetting Actuation,” Langmuir Vol. 27 (13), pp. 8198-8204, 2011.

182. R. Ranjan, S. V. Garimella and J. Y. Murthy, “Transport in Passive, High Thermal Conductivity Heat

Spreaders,” ASME Journal of Heat Transfer Vol. 133, 080911, 2011.

183. J. A. Weibel, S. V. Garimella, J. Y. Murthy and D. H. Altman, “Design of Integrated Nanostructured Wicks

for High-Performance Vapor Chambers,” IEEE Transactions on Components, Packaging and

Manufacturing Technology Vol. 1 (6), pp. 859-867, 2011.

184. N. Kumari and S. V. Garimella, “Characterization of the Heat Transfer Accompanying Electrowetting or

Gravity-Induced Droplet Motion,” International Journal of Heat and Mass Transfer Vol. 54, pp. 4037-

4050, 2011.

185. C. Migliaccio and S. V. Garimella, “Evaporative Heat and Mass Transfer from the Free Surface of a Liquid

Wicked into a Bed of Spheres,” International Journal of Heat and Mass Transfer Vol. 54, pp. 3440-3447,

2011.

186. T. Chen and S. V. Garimella, “Local Heat Transfer Distribution and Effect of Instabilities during Flow

Boiling in a Silicon Microchannel Heat Sink,” International Journal of Heat and Mass Transfer Vol. 54, pp.

3179-3190, 2011.

187. H. Wang, Z. Pan and S. V. Garimella, “Numerical Investigation of Heat and Mass Transfer from an

Evaporating Meniscus in a Heated Open Groove,” International Journal of Heat and Mass Transfer Vol.

54, pp. 3015-3023, 2011.

188. C. T. Merrill and S. V. Garimella, “Measurements and Prediction of Thermal Contact Resistance across

Coated Joints,” Experimental Heat Transfer Vol. 24, pp. 179-200, 2011.

189. T. Harirchian and S. V. Garimella, “Boiling Heat Transfer and Flow Regimes in Microchannels – a

Comprehensive Understanding,” ASME Journal of Electronic Packaging Vol. 133, 011001 (1-10), 2011.

190. S. Flueckiger, Z. Yang and S. V. Garimella, “An Integrated Thermal and Mechanical Investigation of

Molten-Salt Thermocline Energy Storage,” Applied Energy Vol. 88, pp. 2098–2105, 2011.

191. C. P. Migliaccio, H. K. Dhavaleswarapu and S. V. Garimella, “Temperature Measurements near the

Contact Line of an Evaporating Meniscus V-Groove,” International Journal of Heat and Mass Transfer

Vol. 54, pp. 1520-1526, 2011.

192. C. Bradshaw, E. A. Groll, and S. V. Garimella, “A Comprehensive Model of a Miniature-Scale Linear

Compressor for Electronics Cooling,” International Journal of Refrigeration Vol. 34(1), pp. 63-73, 2011.

193. R. Ranjan, J. Y. Murthy, S. V. Garimella and U. Vadakkan, “A Numerical Model for Transport in Flat Heat

Pipes Considering Wick Microstructure Effects,” International Journal of Heat and Mass Transfer Vol. 54,

pp. 143-168, 2011.

194. R. Ranjan, J. Y. Murthy, and S. V. Garimella, “A Microscale Model for Thin-Film Evaporation in Capillary

Wick Structures,” International Journal of Heat and Mass Transfer Vol. 54, pp. 169-179, 2011.

195. K. K. Bodla, J. Y. Murthy, and S. V. Garimella, “Resistance Network-Based Thermal Conductivity Model

for Metal Foams,” Computational Materials Science Vol. 50, pp. 622-632, 2010.

196. K. K. Bodla, J. Y. Murthy, and S. V. Garimella,

“Microtomography-Based Simulation of Transport through

Open-Cell Metal Foams,” Numerical Heat Transfer Part A Vol. 58, pp. 1-18, 2010.

197. Z. Yang and S. V. Garimella, “Molten-Salt Thermal Energy Storage in Thermoclines under Different

Environmental Boundary Conditions,” Applied Energy Vol. 87, pp. 3322-3329, 2010.

198. J. A. Weibel, S. V. Garimella and M. T. North, “Characterization of Evaporation and Boiling from Sintered-

Powder Wicks Fed by Capillary Action,” International Journal of Heat and Mass Transfer Vol. 53, pp.

4204-4215, 2010; recognized among Most Cited Articles since 2010.

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199. A. A. Sathe, E. A. Groll and S. V. Garimella, “Dynamic Analysis of an Electrostatically Actuated Pumping

Device,” International Journal of Refrigeration Vol. 33, pp. 889-896, 2010.

200. F. Volle, S. V. Garimella and M. A. Juds, “Thermal Management of a Soft Starter: Transient Thermal

Impedance Model and Performance Enhancements using Phase Change Materials,” IEEE Transactions on

Power Electronics Vol. 25(6), pp. 1395-1405, 2010.

201. P. Chamarthy, S. T. Wereley and S. V. Garimella, “Measurement of the Temperature Non-uniformity in a

Microchannel Heat Sink Using Microscale Laser-Induced Fluorescence,” International Journal of Heat

and Mass Transfer Vol. 53, pp. 3275-3283, 2010.

202. N. Kumari, V. Bahadur, M. Hodes, T. Salamon, P. Kolodner, A. Lyons and S. V. Garimella, “Analysis of

Evaporating Mist Flow for Enhanced Convective Heat Transfer,” International Journal of Heat and Mass

Transfer Vol. 53, pp. 3346-3356, 2010.

203. Z. Yang and S. V. Garimella, “Thermal Analysis of Solar Thermal Energy Storage in a Molten-Salt

Thermocline,” Solar Energy Vol. 84, pp. 974-985, 2010. (Listed as one of the 10 Most Downloaded

Papers for this journal, as of October 2010.)

204. T. Harirchian and S. V. Garimella, “A Comprehensive Flow Regime Map for Microchannel Flow Boiling

with Quantitative Transition Criteria,” International Journal of Heat and Mass Transfer Vol. 53, pp. 2694-

2702, 2010.

205. B. D. Iverson, J. E. Blendell, and S. V. Garimella, “Thermal Analog to Atomic Force Microscopy Force-

Displacement Measurements for Nanoscale Interfacial Contact Resistance,” Review of Scientific

Instruments Vol. 81, 036111, 2010.

206. Z. Yang and S. V. Garimella, “Melting of Phase Change Materials with Volume Change in Metal Foams,”

ASME Journal of Heat Transfer Vol. 132, 062301(1-11), 2010.

207. J. P. McHale and S. V. Garimella, “Bubble Nucleation Characteristics in Pool Boiling of a Wetting Liquid

on Smooth and Rough Surfaces,” International Journal of Multiphase Flow Vol. 36, pp. 249-260, 2010.

208. H. K. Dhavaleswarapu, C. P. Migliaccio, S. V. Garimella and J. Y. Murthy, “Experimental Investigation of

Evaporation from Low-Contact-Angle Sessile Droplets,” Langmuir Vol. 26(2), pp. 880-888, 2010.

209. V. Bahadur and S. V. Garimella, “Electrical Actuation-Induced Droplet Transport on Smooth and

Superhydrophobic Surfaces,” International Journal of Micro-Nano Scale Transport Vol. 1(1), pp. 1-26,

2010.

210. B. J. Jones and S. V. Garimella, “Surface Roughness Effects on Flow Boiling in Microchannels,” Journal of

Thermal Science and Engineering Applications Vol. 1, 041007(1-9), 2009.

211. M. L. Kimber, K. Suzuki, N. Kitsunai, K. Seki and S. V. Garimella, “Pressure and Flow Rate Performance of

Piezoelectric Fans,” IEEE Transactions on Components and Packaging Technologies Vol. 32(4), pp. 766-

775, 2009.

212. M. L. Kimber, R. Lonergan and S. V. Garimella, “Experimental Study of Aerodynamic Damping in Arrays

of Vibrating Cantilevers,” Journal of Fluids and Structures Vol. 25(8), pp. 1334-1347, 2009.

213. J. P. McHale and S. V. Garimella, “Heat Transfer in Trapezoidal Microchannels of Various Aspect Ratios,”

International Journal of Heat and Mass Transfer Vol. 53, pp. 365-375, 2010.

214. R. Ranjan, J. Y. Murthy and S. V. Garimella, “Marangoni Convection and Thin-film Evaporation in

Microstructured Wicks for Heat Pipes,” ASME Journal of Heat Transfer Vol 132, No. 8, 080902, 2010.

215. B. J. Jones, J. P. McHale and S. V. Garimella, “The Influence of Surface Roughness on Nucleate Pool

Boiling Heat Transfer,” ASME Journal of Heat Transfer Vol. 131(12), 121009, 2009.

216. A. A. Sathe, E. A. Groll and S. V. Garimella, “Optimization of Electrostatically Actuated Miniature

Compressors for Electronics Cooling,” International Journal of Refrigeration Vol. 32, pp. 1517-1525,

2009.

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217. H. K. Dhavaleswarapu, C. P. Migliaccio, S. V. Garimella and J. Y. Murthy, “Thin-Film Evaporation in an

Evaporating Droplet,” ASME Journal of Heat Transfer Vol. 131, 080906, 2009.

218. R. A. Bidkar, M. L. Kimber, A. Raman, A. K. Bajaj and S. V. Garimella, “Nonlinear Aerodynamic Damping of

Sharp-Edged Flexible Beams Oscillating at Low Keulegan–Carpenter Numbers,” Journal of Fluid

Mechanics Vol. 634, pp. 269-289, 2009.

219. T. Harirchian and S. V. Garimella, “The Critical Role of Channel Cross-Sectional Area in Microchannel

Flow Boiling Heat Transfer,” International Journal of Multiphase Flow Vol. 35, pp. 904-913, 2009.

220. R. Ranjan, J. Y. Murthy and S. V. Garimella, “Analysis of the Wicking and Thin-film Evaporation

Characteristics of Microstructures,” ASME Journal of Heat Transfer Vol. 131, 101001, 2009.

221. M. L. Kimber and S. V. Garimella, “Cooling Performance of Arrays of Vibrating Cantilevers,” ASME

Journal of Heat Transfer Vol. 131, 111401, 2009.

222. S. V. Garimella and D. Liu, “Microscale Thermal Transport and Electromechanical Microfluidic

Actuation,” Journal of Enhanced Heat Transfer Vol. 16(3), pp. 237-266, 2009.

223. P. Chamarthy, S. T. Wereley and S. V. Garimella, “Non-Intrusive Temperature Measurements Using

Microscale Visualization Techniques,” Experiments in Fluids Vol. 47, pp. 159-170, 2009.

224. M. L. Kimber and S. V. Garimella, “Measurement and Prediction of the Cooling Characteristics of a

Generalized Vibrating Piezoelectric Fan,” International Journal of Heat and Mass Transfer Vol. 52, pp.

4470-4478, 2009.

225. Z. Yang and S. V. Garimella, “Rarefied Gas Flow in Microtubes at Different Inlet-Outlet Pressure Ratios,”

Physics of Fluids Vol. 21, 052005 (15 pp), 2009.

226. D. B. Go, T. S. Fisher, S. V. Garimella and V. Bahadur, “Planar Microscale Ionization Devices in

Atmospheric Air with Diamond-Based Electrodes,” Plasma Sources Science and Technology Vol. 18,

035004 (10 pp), 2009.

227. D. Liu and S. V. Garimella, “Microfluidic Pumping based on Traveling-Wave Dielectrophoresis,”

Nanoscale and Microscale Thermophysical Engineering Vol. 13, pp. 109-133, 2009.

228. B. D. Iverson and S. V. Garimella, “Experimental Characterization of Induction Electrohydrodynamics for

Integrated Microchannel Pumping,” Journal of Micromechanics and Microengineering Vol. 19, 055015

(12 pp), 2009.

229. D. Sun, S. R. Annapragada and S. V. Garimella, “Experimental and Numerical Study of Melting of Particle-

Laden Materials in a Cylinder,” International Journal of Heat and Mass Transfer Vol. 52, pp. 2966-2978,

2009.

230. V. Bahadur and S. V. Garimella, “Preventing the Cassie-Wenzel Transition using Surfaces with

Noncommunicating Roughness Elements,” Langmuir Vol. 25(8), pp. 4815-4820, 2009.

231. H. K. Dhavalewsarapu, S. V. Garimella and J. Y. Murthy, “Microscale Temperature Measurements near

the Triple Line of an Evaporating Thin Liquid Film,” ASME Journal of Heat Transfer Vol. 131, 061501,

2009.

232. T. Harirchian and S. V. Garimella, “Effects of Channel Dimension, Heat Flux, and Mass Flux on Flow

Boiling Regimes in Microchannels,” International Journal of Multiphase Flow Vol. 35, pp. 349-362, 2009.

233. D. B. Go, T. S. Fisher and S. V. Garimella, “Direct Simulation of Ionization and Ion Transport for Planar

Microscale Ion Generation Devices,” Journal of Physics D: Applied Physics Vol. 42, 055203, 2009.

234. S. S. Bertsch, E. A. Groll and S. V. Garimella, “A Composite Heat Transfer Correlation for Saturated Flow

Boiling in Small Channels,” International Journal of Heat and Mass Transfer Vol. 52, pp. 2110-2118,

2009.

235. B. D. Iverson, L. Cremaschi and S. V. Garimella, “Effects of Discrete-Electrode Configuration on Traveling-

Wave Electrohydrodynamic Pumping,” Microfluidics and Nanofluidics Vol. 6, pp. 221-230, 2009.

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236. S. S. Bertsch, E. A. Groll and S. V. Garimella, “Effects of Heat Flux, Mass Flux, Vapor Quality, and

Saturation Temperature on Flow Boiling Heat Transfer in Microchannels,” International Journal of

Multiphase Flow Vol. 35, pp. 142-154, 2009.

237. T. Açıkalın and S. V. Garimella, “Analysis and Prediction of the Thermal Performance of Piezoelectrically

Actuated Fans,” Heat Transfer Engineering Vol. 30(6), pp. 487-498, 2009.

238. V. Bahadur and S. V. Garimella, “Electrowetting-Based Control of Droplet Transition and Morphology on

Artificially Microstructured Surfaces,” Langmuir Vol. 24, pp. 8338-8345, 2008.

239. S. V. Garimella, A. S. Fleischer, J. Y. Murthy, A. Keshavarzi, R. Prasher, C. Patel, S. Bhavnani, R.

Venkatasubramanian, R. Mahajan, Y. Joshi, B. Sammakia, B. A. Myers, L. Chorosinski, M. Baelmans, P.

Sathyamurthy and P. Raad, “Thermal Challenges in Next-Generation Electronic Systems,” IEEE

Transactions on Components and Packaging Technologies Vol. 31(4), pp. 801-815, 2008.

240. H. Wang, S. V. Garimella and J. Y. Murthy, “An Analytical Solution for the Total Heat Transfer in the Thin-

Film Region of an Evaporating Meniscus,” International Journal of Heat and Mass Transfer Vol. 51, pp.

6317-6322, 2008.

241. D. Go, R. A. Maturana, T. S. Fisher and S. V. Garimella, “Enhancement of External Forced Convection by

Ionic Wind,” International Journal of Heat and Mass Transfer Vol. 51, pp. 6047-6053, 2008.

242. N. Kumari, V. Bahadur and S. V. Garimella, “Electrical Actuation of Electrically Conducting and Insulating

Droplets using AC and DC Voltages,” Journal of Micromechanics and Microengineering Vol. 18, 105015,

2008.

243. S. V. Aradhya, S. V. Garimella and T. S. Fisher, “Electrothermal Bonding of Carbon Nanotubes to Glass,”

Journal of the Electrochemical Society Vol. 155(9), K161-K165, 2008.

244. S. S. Bertsch, E. A. Groll and S. V. Garimella, “Review and Comparative Analysis of Studies on Saturated

Flow Boiling in Small Channels,” Nanoscale and Microscale Thermophysical Engineering Vol. 12 (3), pp.

187-227, 2008. (One of 10 Most Cited Papers for this journal for the last three years, June 2011.)

245. K. H. Do, S. J. Kim and S. V. Garimella, “A Mathematical Model for Analyzing the Thermal Characteristics

of a Flat Micro Heat Pipe with a Grooved Wick,” International Journal of Heat and Mass Transfer Vol. 51,

pp. 4637-4650, 2008.

246. S. S. Bertsch, E. A. Groll and S. V. Garimella, “Refrigerant Flow Boiling Heat Transfer in Parallel

Microchannels as a Function of Local Vapor Quality,” International Journal of Heat and Mass Transfer

Vol. 51, pp. 4775-4787, 2008.

247. B. D. Iverson and S. V. Garimella, “Recent Advances in Microscale Pumping Technologies: A Review and

Evaluation,” Microfluidics and Nanofluidics Vol. 5, pp. 145-174, 2008 (One of 5 Most Cited Papers for

this journal from 2008 and 2009).

248. N. Kumari, V. Bahadur and S. V. Garimella, “Electrical Actuation of Dielectric Droplets,” Journal of

Micromechanics and Microengineering Vol. 18, 085018, 2008 (selected for inclusion in Highlights of

2008, a selection of articles chosen by the Editorial Board that best represent the high quality and

breadth of the contributions published in the journal for the year).

249. T. Harirchian and S. V. Garimella, “Flow Patterns During Convective Boiling in Microchannels,” ASME

Journal of Heat Transfer Vol. 130, 080909, 2008.

250. T. Harirchian and S. V. Garimella, “Microchannel Size Effects on Local Flow Boiling Heat Transfer to a

Dielectric Fluid,” International Journal of Heat and Mass Transfer Vol. 51(15-16), pp. 3724-3735, 2008.

251. V. Bahadur and S. V. Garimella, “Energy Minimization-Based Analysis of Electrowetting for

Microelectronics Cooling Applications,” Microelectronics Journal Vol. 39(7), pp. 957-965, 2008.

252. P. Chamarthy, H. Dhavaleswarapu, S. V. Garimella, J. Y. Murthy and S. T. Wereley, “Visualization of

Convection Patterns Near an Evaporating Meniscus using µPIV,”

Experiments in Fluids Vol. 44, pp. 431-

438, 2008.

Suresh V. Garimella, July 2024

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253. S. R. Annapragada, S. V. Garimella and J. Y. Murthy, “Permeability and Thermal Transport in Compressed

Open-Celled Foams,” Numerical Heat Transfer, Part B: Fundamentals Vol. 54, pp, 1-22, 2008.

254. H. Wang, J. Y. Murthy and S. V. Garimella, “Transport from a Volatile Meniscus Inside an Open

Microtube,” International Journal of Heat and Mass Transfer Vol. 51, pp. 3007-3017, 2008.

255. F. Wang, H. Wang, J. Wang, H.-Y. Wang, P. L. Rummel, S. V. Garimella and C. Lu, “Microfluidic Delivery of

Small Molecules into Mammalian Cells Based on Hydrodynamic Focusing,” Biotechnology and

Bioengineering Vol. 100(1), pp. 150-158, 2008 (featured on journal issue cover).

256. T. W. Davis and S. V. Garimella, “Thermal Resistance Measurement across a Wick Structure using a

Novel Thermosyphon Test Chamber,” Experimental Heat Transfer Vol. 21(2), pp. 143-154, 2008.

257. S. Krishnan, S. V. Garimella and J. Y. Murthy, “Simulation of Thermal Transport in Open-Cell Metal

Foams: Effect of Periodic Unit Cell Structure,” ASME Journal of Heat Transfer Vol. 130, 024503: 1-5,

2008.

258. B. J. Jones, P. S. Lee and S. V. Garimella, “Infrared Micro-Particle Image Velocimetry Measurements and

Predictions of Flow Distribution in a Microchannel Heat Sink,” International Journal of Heat and Mass

Transfer Vol. 51, pp. 1877-1887, 2008.

259. S. R. Annapragada, D. Sun and S. V. Garimella,

“Analysis and Suppression of Base Separation in the

Casting of a Cylindrical Ingot,” Heat Transfer Engineering Vol. 29(4), pp. 385-394, 2008.

260. A. A. Sathe, E. A. Groll and S. V. Garimella, “Analytical Model for an Electrostatically Actuated Miniature

Diaphragm Compressor,” Journal of Micromechanics and Microengineering Vol. 18, 035010, 2008.

261. P.-S. Lee and S. V. Garimella, “Saturated Flow Boiling Heat Transfer and Pressure Drop in Silicon

Microchannel Arrays,” International Journal of Heat and Mass Transfer Vol. 51, pp. 780-806, 2008.

262. D. Liu and S. V. Garimella, “Flow Boiling Heat Transfer in Microchannels,” ASME Journal of Heat Transfer

Vol. 129, pp. 1321-1332, 2007.

263. M. Kimber, S. V. Garimella and A. Raman, “Local Heat Transfer Coefficients Induced by Piezoelectrically

Actuated Vibrating Cantilevers,” ASME Journal of Heat Transfer Vol. 129, pp. 1168-1176, 2007.

264. D. Go, S. V. Garimella, T. S. Fisher and R. K. Mongia “Ionic Winds for Locally Enhanced Cooling,” Journal

of Applied Physics Vol. 102, 053302, 2007; also published in

October 1, 2007 issue of Virtual Journal of

Nanoscale Science & Technology.

265. H. K. Dhavaleswarapu, P. Chamarthy, S. V. Garimella and J. Y. Murthy, “Experimental Investigation of

Steady Buoyant-Thermocapillary Convection Near an Evaporating Meniscus,” Physics of Fluids Vol. 19,

082103, 2007.

266. D. Sun and S. V. Garimella, “Numerical and Experimental Investigation of Solidification Shrinkage,”

Numerical Heat Transfer Vol. 52, pp. 145-162, 2007.

267. H. K. Dhavaleswarapu, P. Chamarthy, S. V. Garimella, J. Y. Murthy and S. T. Wereley, “Thermocapillary

Convection Near an Evaporating Meniscus,” ASME Journal of Heat Transfer Vol. 129, p. 938, 2007.

268. M. Kimber and S. V. Garimella, “Local Heat Transfer Coefficients Under Flows Induced by Vibrating

Cantilevers,” ASME Journal of Heat Transfer Vol. 129, p. 933, 2007.

269. S. Krishnan, S. V. Garimella, G. Chrysler and R. Mahajan, “Towards a Thermal Moore’s Law,” IEEE

Transactions on Advanced Packaging Vol. 30 (3), pp. 462-474, 2007.

270. S. Krishnan, J. Y. Murthy and S. V. Garimella, “Analysis of Solid-Liquid Phase Change under Pulsed

Heating,” ASME Journal of Heat Transfer Vol. 129, pp. 395-400, 2007.

271. T. Acikalin, S. V. Garimella, A. Raman and J. Petroski, “Characterization and Optimization of the Thermal

Performance of Miniature Piezoelectric Fans,” International Journal of Heat and Fluid Flow Vol. 28(4),

pp. 806-820, 2007.

Suresh V. Garimella, July 2024

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272. V. Bahadur and S. V. Garimella, “Electrowetting-Based Control of Static Droplet States on Rough

Surfaces,” Langmuir Vol. 23(9), pp. 4918-4924, 2007.

273. S. M. Wait, S. Basak, S. V. Garimella and A. Raman, “Piezoelectric Fans using Higher Flexural Modes for

Electronics Cooling Applications,” IEEE Transactions on Components and Packaging Technologies Vol.

30(1), pp. 119-128, 2007.

274. H. Wang, S. V. Garimella and J. Y. Murthy, “Characteristics of an Evaporating Thin Film in a

Microchannel,” International Journal of Heat and Mass Transfer Vol. 50, pp. 3933-3942, 2007.

275. B. D. Iverson, T. W. Davis, S. V. Garimella, M. T. North and S. Kang, “Heat and Mass Transport in Heat

Pipe Wick Structures,” AIAA Journal of Thermophysics and Heat Transfer Vol. 21(2), pp. 392-404, 2007.

276. T. Chen and S. V. Garimella, “Flow Boiling Heat Transfer to a Dielectric Coolant in a Microchannel Heat

Sink,” IEEE Transactions on Components and Packaging Technologies Vol. 30, pp. 24-31, 2007.

277. S. R. Annapragada, D. Sun and S. V. Garimella, “Prediction of Effective Thermo-Mechanical Properties of

Particulate Composites,” Computational Materials Science Vol. 40(2), pp. 255-256, 2007.

278. V. Singhal and S. V. Garimella, “Induction Electrohydrodynamics Micropump for High Heat Flux Cooling,”

Sensors and Actuators A Vol. 134, pp. 650-659, 2007.

279. D. Sun, S.R. Annapragada, S.V. Garimella and S.K. Singh, “Analysis of Gap Formation in the Casting of

Energetic Materials,” Numerical Heat Transfer, Part A Vol. 51, pp. 415-444, 2007.

280. H. Wang, X. F. Peng, S. V. Garimella and D. Christopher, “Microbubble Return Phenomena During

Subcooled Boiling on Small Wires,” International Journal of Heat and Mass Transfer Vol. 50, Nos. 1-2, pp.

163-172, 2007.

281. T. Chen and S. V. Garimella, “Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in

a Microchannel Heat Sink,” ASME Journal of Electronic Packaging Vol. 128(4). pp. 398-404, 2006.

282. A. F. Black and S. V. Garimella, “Characterization of Rough Engineering Surfaces for Use in Thermal

Contact Conductance Modeling,” AIAA Journal of Thermophysics and Heat Transfer Vol. 20(4), pp. 817-

824, 2006.

283. S. V. Garimella, “Advances in Mesoscale Thermal Management Technologies for Microelectronics,”

Microelectronics Journal Vol. 37(11), pp. 1165-1185, 2006.

284. S. V. Garimella, V. Singhal and D. Liu, “On-Chip Thermal Management with Microchannel Heat Sinks and

Integrated Micropumps,” Proceedings of the IEEE Vol. 94(8), pp. 1534-1548, 2006.

285. P. S. Lee and S. V. Garimella, “Thermally Developing Flow and Heat Transfer in Rectangular

Microchannels of Different Aspect Ratios,” International Journal of Heat and Mass Transfer Vol. 49, pp.

3060-3067, 2006.

286. S. Trutassanawin, E. A. Groll, S. V. Garimella and L. Cremaschi, “Experimental Investigation of a

Miniature-Scale Refrigeration Systems for Electronics Cooling,” IEEE Transactions on Components and

Packaging Technologies Vol. 29, pp. 678-687, 2006.

287. T. Chen, J. F. Klausner, S. V. Garimella and J. N. Chung, “Subcooled Boiling Incipience on a Highly Smooth

Microheater,” International Journal of Heat and Mass Transfer Vol. 49, Nos. 23-24, pp. 4399-4406, 2006.

288. T. Chen and S. V. Garimella, “Measurements and High-Speed Visualizations of Flow Boiling of a Dielectric

Fluid in a Silicon Microchannel Heat Sink,” International Journal of Multiphase Flow Vol. 32, pp. 957-971,

2006.

289. S. Basak, A. Raman and S. V. Garimella, “Hydrodynamic Loading of Microcantilevers Vibrating in Viscous

Fluids,” Journal of Applied Physics Vol. 99, 114906, 2006.

290. S. Krishnan, J. Y. Murthy and S. V. Garimella, “Direct Simulation of Transport in Open-Cell Metal Foams,”

ASME Journal of Heat Transer Vol. 128, pp. 793-799, 2006.

Suresh V. Garimella, July 2024

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291. V. Bahadur and S. V. Garimella, “Energy-Based Model for Electrowetting-Induced Droplet Actuation,”

Journal of Micromechanics and Microengineering Vol. 16, pp. 1494-1503, 2006.

292. B. Jones, D. Sun, S. Krishnan and S. V. Garimella, “Experimental and Numerical Investigation of Melting

in a Cylinder,” International Journal of Heat and Mass Transfer Vol. 49, pp. 2724-2738, 2006.

293. C. T. Merrill and S. V. Garimella, “Analysis and Prediction of Constriction Resistance between Coated

Surfaces,” AIAA Journal of Thermophysics and Heat Transfer Vol. 20, pp. 346-348, 2006.

294. D. Sun, S. V. Garimella and A. Mukhopadhyay, “Analysis of Shrinkage in the Solidification of Particle-

Laden Melts,” TMS Letters Vol. 2(4), pp. 111-112, 2005.

295. D. Liu, P.S. Lee and S. V. Garimella, “Prediction of the Onset of Nucleate Boiling in Microchannel Flow,”

International Journal of Heat and Mass Transfer Vol. 48, pp. 5134-5149, 2005.

296. V. Singhal, P. J. Litke, A. F. Black and S. V. Garimella, “An Experimentally Validated Thermo-mechanical

Model for the Prediction of Thermal Contact Conductance,” International Journal of Heat and Mass

Transfer Vol. 48, pp. 5446-5459, 2005.

297. S. Krishnan, J. Y. Murthy and S. V. Garimella, “A Two-Temperature Model for Solid/Liquid Phase Change

in Metal Foams,” ASME Journal of Heat Transfer Vol. 127, pp. 995-1004, 2005.

298. D. Sun, S. V. Garimella, S. Singh and N. Naik, “Numerical and Experimental Investigation of the Melt

Casting of Explosives,” Propellants, Explosives and Pyrotechnics Vol. 30(5), pp. 369-380, 2005.

299. M. S. Peterson, W. Zhang, T. S. Fisher and S. V. Garimella, “Low-Voltage Ionization of Air with Carbon-

Based Materials,” Plasma Sources Science and Technology Vol. 14, pp. 654-660, 2005.

300. H. Wang, X. F. Peng, D. M. Christopher and S. V. Garimella, Closure to Discussion: “Dynamics of Bubble

Motion and Bubble Top Jet Flows from Moving Vapor Bubbles on Microwires” (D. M. Christopher, H.

Wang and X. F. Peng, Journal of Heat Transfer Vol. 127, pp. 1260-1268, 2005), ASME Journal of Heat

Transfer Vol. 128, pp. 1345-1346, 2006.

301. H. Wang, X. F. Peng, D. M. Christopher and S. V. Garimella, “Jet Flows around Microbubbles in Subcooled

Boiling,” ASME Journal of Heat Transfer Vol. 127, p. 802, 2005.

302. D. Liu, P. S. Lee and S. V. Garimella, “Nucleate Boiling in Microchannels,” ASME Journal of Heat Transfer

Vol. 127, p. 803, 2005.

303. V. Singhal and S. V. Garimella, “A Novel Valveless Micropump with Electrohydrodynamic Enhancement

for High Heat Flux Cooling,” IEEE Transactions on Advanced Packaging Vol. 28(2), pp. 216-230, 2005.

304. S. Krishnan, S. V. Garimella and S. S. Kang, “A Novel Hybrid Heat Sink using Phase Change Materials for

Transient Thermal Management of Electronics,” IEEE Transactions on Components and Packaging

Technologies Vol. 28(2), pp. 281-289, 2005.

305. V. Singhal and S. V. Garimella, “Influence of Bulk Fluid Velocity on the Efficiency of Electrohydrodynamic

Pumping,” ASME Journal of Fluids Engineering Vol. 127, pp. 484-494, 2005.

306. D. Liu, S. V. Garimella and S. T. Wereley, “Infrared Micro-Particle Image Velocimetry Measurement in

Silicon-Based Microdevices,” Experiments in Fluids Vol. 38, pp. 385-392, 2005.

307. P.S. Lee, S. V. Garimella and D. Liu, “Investigation of Heat Transfer in Rectangular Microchannels,”

International Journal of Heat and Mass Transfer

Vol. 48(9), pp. 1688-1704, 2005; recognized among

Most Cited Articles (2005-2008).

308. D. Liu and S. V. Garimella, “Analysis and Optimization of the Thermal Performance of Microchannel Heat

Sinks,” International Journal of Numerical Methods for Heat and Fluid Flow Vol. 15(1), pp. 7-26, 2005.

309. S. Basak, A. Raman and S. V. Garimella, “Dynamic Response Optimization of Piezoelectrically Excited

Thin Resonant Beams,” ASME Journal of Vibration and Acoustics Vol. 127, pp. 18-27, 2005.

310. V. Singhal, S. V. Garimella and A. Raman, “Microscale Pumping Technologies for Microchannel Cooling

Systems,” Applied Mechanics Reviews Vol. 57(3), pp. 191-221, 2004.

Suresh V. Garimella, July 2024

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311. W. Zhang, T. S. Fisher and S. V. Garimella, “Simulation of Ion Generation and Breakdown in Atmospheric

Air,” Journal of Applied Physics Vol. 96(11), pp. 6066-6072, 2004.

312. S. Krishnan and S. V. Garimella, “Thermal Management of Transient Power Spikes in Electronics - Phase

Change Energy Storage or Copper Heat Sinks?” ASME Journal of Electronic Packaging Vol. 126, pp. 308-

316, 2004.

313. U. Vadakkan, S. V. Garimella and J. Y. Murthy, “Transport in Flat Heat Pipes at High Heat Fluxes from

Multiple Discrete Sources,” ASME Journal of Heat Transfer Vol. 126, pp. 347-354, 2004.

314. V. Singhal, S. V. Garimella and J. Y. Murthy, “Low Reynolds Number Flow Through Nozzle-Diffuser

Elements in Valveless Micropumps,” Sensors and Actuators A Vol. 113, pp. 226-235, 2004.

315. S. Krishnan, J. Y. Murthy and S. V. Garimella, “A Two-Temperature Model for the Analysis of Passive

Thermal Control Systems,” ASME Journal of Heat Transfer Vol. 126, pp. 628-637, 2004.

316. S. Krishnan and S. V. Garimella, “Analysis of a Phase Change Energy Storage System for Pulsed Power

Dissipation,” IEEE Transactions on Components and Packaging Technologies Vol. 27(1), pp 191-199,

2004.

317. V. Singhal, T. Siegmund and S. V. Garimella, “Optimization of Thermal Interface Materials for Electronics

Cooling Applications,” IEEE Transactions on Components and Packaging Technologies Vol. 27(2), pp. 244-

252, 2004.

318. D. Liu and S. V. Garimella, “Investigation of Liquid Flow in Microchannels,” AIAA Journal of

Thermophysics and Heat Transfer Vol. 18(1), pp. 65-72, 2004.

319. A. F. Black, V. Singhal and S. V. Garimella, “Analysis and Prediction of Constriction Resistance for Contact

Between Rough Engineering Surfaces,” AIAA Journal of Thermophysics and Heat Transfer Vol. 18(1), pp.

30-36, 2004.

320. T. Açıkalın, S. M. Wait, S. V. Garimella and A. Raman, “Experimental Investigation of the Thermal

Performance of Piezoelectric Fans,” Heat Transfer Engineering Vol. 25(1), pp. 4-14, 2004. Recognized as

one of the Top 10 Most Cited Articles (2003-2008).

321. S. V. Garimella and V. Singhal, “Single-Phase Flow and Heat Transport and Pumping Considerations in

Microchannel Heat Sinks,” Heat Transfer Engineering Vol. 25(1), pp. 15-25, 2004. Recognized as one of

the Top 10 Most Cited Articles (2003-2008).

322. S. V. Garimella and C. B. Sobhan, “Transport in Microchannels - A Critical Review,” Annual Review of

Heat Transfer Vol. 13, pp. 1-50, 2003.

323. T. Açıkalın, A. Raman and S. V. Garimella, “Two-dimensional Streaming Flows Induced by Resonating

Thin Beams,” Journal of the Acoustical Society of America Vol. 114(4-1), pp. 1785-1795, 2003.

324. C. Y. Li, S. V. Garimella and J.E. Simpson, “A Fixed-Grid Front-Tracking Algorithm for Solidification

Problems. Part I - Method and Validation,” Numerical Heat Transfer - Part B Vol. 43, pp. 117-141, 2003.

325. C. Y. Li, S. V. Garimella and J.E. Simpson, “A Fixed-Grid Front-Tracking Algorithm for Solidification

Problems. Part II - Directional Solidification with Melt Convection,” Numerical Heat Transfer - Part B Vol.

43, pp. 143-166, 2003.

326. P. Buermann, A. Raman and S. V. Garimella, “Dynamics and Topology Optimization of Piezoelectric

Fans,” IEEE Transactions on Components and Packaging Technologies Vol. 25(4), pp. 592-600, 2003.

327. J. E. Simpson, S. V. Garimella and H. C. de Groh III, “Experimental and Numerical Investigation of the

Bridgman Growth of a Transparent Material,” AIAA Journal of Thermophysics and Heat Transfer Vol.

16(3), pp. 324-335, 2002.

328. B. Moussa, J. E. Simpson and S. V. Garimella, “Concentration Fields in the Solidification Processing of

Metal Matrix Composites,” International Journal of Heat and Mass Transfer Vol. 45(21), pp. 4251-4266,

2002.

Suresh V. Garimella, July 2024

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329. E. L. Olsen, S. V. Garimella and C. V. Madhusudana, “Modeling of Constriction Resistance in Coated

Joints,” AIAA Journal of Thermophysics and Heat Transfer Vol. 16(2), pp. 207-216, 2002.

330. S. V. Garimella, Y. K. Joshi, A. Bar-Cohen, R. Mahajan, K. C. Toh, V. P. Carey, M. Baelmans, J. Lohan, B.

Sammakia and F. Andros, “Thermal Challenges in Next Generation Electronic Systems - Summary of

Panel Presentations and Discussions,” IEEE Transactions on Components and Packaging Technologies

Vol. 25(4), pp. 569-575, 2002.

331. S. V. Garimella and C. B. Sobhan, “Recent Advances in the Modeling and Applications of

Nonconventional Heat Pipes,” Advances in Heat Transfer Vol. 35, pp. 249-308, 2001.

332. J. E. Simpson, S. V. Garimella, H. C. de Groh III and R. Abbaschian, “Bridgman Crystal Growth of an Alloy

with Thermosolutal Convection under Microgravity Conditions,” ASME Journal of Heat Transfer Vol.

123(5), pp. 990-998, 2001.

333. C.-Y. Li and S. V. Garimella, “Prandtl-Number Effects and Generalized Correlations for Confined and

Submerged Jet Impingement,” International Journal of Heat and Mass Transfer Vol. 44(18), pp. 3471-

3480, 2001.

334. C. B. Sobhan and S. V. Garimella, “A Comparative Analysis of Studies on Heat Transfer and Fluid Flow in

Microchannels,” Microscale Thermophysical Engineering Vol. 5(4), pp. 293-311, 2001.

335. S. V. Garimella and J. E. Simpson, “Effect of Thermosolutal Convection on Directional Solidification,”

Sadhana (Academy Proceedings in Engineering Sciences), Indian Academy of Sciences, Vol. 26, pp. 121-

138, 2001.

336. S. V. Garimella and V. P. Schroeder, “Local Heat Transfer Distributions in Confined Multiple Air Jet

Impingement,” ASME Journal of Electronic Packaging Vol. 123(3), pp. 165-172, 2001.

337. S. V. Garimella, “Heat Transfer and Flow Fields in Confined Jet Impingement,” Annual Review of Heat

Transfer Vol. XI, pp. 413-494, 2000.

338. L. A. Brignoni and S. V. Garimella, “Heat Transfer from a Finned Surface in Ducted Air Jet Suction and

Impingement,” ASME Journal of Electronic Packaging Vol. 122(3), pp. 282-285, 2000.

339. H. A. El-Sheikh and S. V. Garimella, “Enhancement of Air Jet Impingement Heat Transfer using Pin-Fin

Heat Sinks,” IEEE Transactions on Components and Packaging Technologies Vol. 23(2), pp. 300-308,

2000.

340. J. E. Simpson and S. V. Garimella, “The Influence of Gravity Levels on the Horizontal Bridgman Crystal

Growth of an Alloy,” International Journal of Heat and Mass Transfer Vol. 43(11), pp. 1905-1923, 2000.

341. H. A. El-Sheikh and S. V. Garimella, “Heat Transfer from Pin-Fin Heat Sinks under Multiple Impinging

Jets,” IEEE Transactions on Advanced Packaging Vol. 23(1), pp. 113-121, 2000.

342. L. A. Brignoni and S. V. Garimella, “Effects of Nozzle-Inlet Chamfering on Pressure Drop and Heat

Transfer in Confined Air Jet Impingement,” International Journal of Heat and Mass Transfer Vol. 43(7),

pp. 1133-1139, 2000.

343. L. Chen, S. V. Garimella, J. A. Reizes and E. Leonardi, “The Development of a Bubble Rising in a Viscous

Liquid,” Journal of Fluid Mechanics Vol. 387, pp. 61-96, 1999.

344. M. M. Guslick, J. E. Simpson and S. V. Garimella, “Fiber-Spacing Effects in the Solidification Processing of

Metal Matrix Composites,” Numerical Heat Transfer A Vol. 35(6), pp. 587-607, 1999.

345. L. Z. Schlitz, S. V. Garimella and S. H. Chan, “Gas Dynamics and Electromagnetic Processes in High-

Current Arc Plasmas - Part I: Model Formulation and Steady-State Solutions,” Journal of Applied Physics

Vol. 85(5), pp. 2540-2546, 1999.

346. L. Z. Schlitz, S. V. Garimella and S. H. Chan, “Gas Dynamics and Electromagnetic Processes in High-

Current Arc Plasmas - Part II: Effects of External Magnetic Fields and Gassing Materials,” Journal of

Applied Physics Vol. 85(5), pp. 2547-2555, 1999.

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347. G. K. Morris, S. V. Garimella and J. A. Fitzgerald, “Flow-Field Prediction in Submerged and Confined Jet

Impingement Using the Reynolds Stress Model,” ASME Journal of Electronic Packaging Vol. 121(4), pp.

255-262, 1999.

348. L. A. Brignoni and S. V. Garimella, “Experimental Optimization of Confined Air Jet Impingement on a Pin

Fin Heat Sink,” IEEE Transactions on Components and Packaging Technologies Vol. 22(3), pp. 399-404,

1999.

349. S. V. Garimella and J. E. Simpson, “Interface Propagation in the Processing of Metal Matrix Composites,”

Microscale Thermophysical Engineering Vol. 2(3), pp. 173-188, 1998.

350. G. Labonia, V. Timchenko, J. E. Simpson, S. V. Garimella, E. Leonardi and G. de Vahl Davis,

“Reconstruction and Advection of a Moving Interface in Three Dimensions on a Fixed Grid,” Numerical

Heat Transfer Vol. 34(2), pp. 121-138, 1998.

351. J. E. Simpson and S. V. Garimella, “An Investigation of the Solutal, Thermal and Flow Fields in

Unidirectional Alloy Solidification,” International Journal of Heat and Mass Transfer Vol. 41(16), pp.

2485-2502, 1998.

352. J. A. Fitzgerald and S. V. Garimella, “A Study of the Flow Field of a Confined and Submerged Impinging

Jet,” International Journal of Heat and Mass Transfer Vol. 41(8-9), pp. 1025-1034, 1998.

353. G. K. Morris and S. V. Garimella, “Orifice and Impingement Flow Fields in Confined Jet Impingement,”

ASME Journal of Electronic Packaging Vol. 120(1), pp. 68-72, 1998.

354. L. Chen, S. V. Garimella, J. A. Reizes and E. Leonardi, “Motion of Interacting Gas Bubbles in a Viscous

Liquid Including Wall-Effects and Evaporation,” Numerical Heat Transfer, Part A: Applications Vol. 31(6),

pp. 629-654, 1997.

355. J. A. Fitzgerald and S. V. Garimella, “Flow Field Effects on Heat Transfer in Confined Jet Impingement,”

ASME Journal of Heat Transfer Vol. 119(3), pp. 630-632, 1997.

356. G. K. Morris and S. V. Garimella, “Composite Correlations for Convective Heat Transfer from Arrays of

Three-Dimensional Obstacles,” International Journal of Heat and Mass Transfer Vol. 40(2), pp. 493-498,

1997.

357. G. K. Morris, S. V. Garimella and R. S. Amano, “Prediction of Jet Impingement Heat Transfer using a

Hybrid Wall Treatment with Different Turbulent Prandtl Number Functions,” ASME Journal of Heat

Transfer Vol. 118(3), pp. 562-569, 1996.

358. S. V. Garimella and B. Nenaydykh, “Nozzle-Geometry Effects in Liquid Jet Impingement Heat Transfer,”

International Journal of Heat and Mass Transfer Vol. 39(14), pp. 2915-2923, 1996.

359. G. K. Morris and S. V. Garimella, “Thermal Wake Downstream of a Three-Dimensional Obstacle,”

Experimental Thermal and Fluid Science Vol. 12(1), pp. 65-74, 1996.

360. S. V. Garimella and R. A. Rice, “Confined and Submerged Liquid Jet Impingement Heat Transfer,” ASME

Journal of Heat Transfer Vol. 117(4), pp. 871-877, 1995.

361. S. V. Garimella and D. J. Schlitz, “Heat Transfer Enhancement in Narrow Channels using Two and Three-

Dimensional Mixing Devices,” ASME Journal of Heat Transfer Vol. 117(3), pp. 590-596, 1995.

362. S. V. Garimella, J. P. McNulty and L. Z. Schlitz, “Formation and Suppression of Channels During Upward

Solidification of a Binary Mixture,” Metallurgical and Materials Transactions A Vol. 26A, pp. 971-981,

1995.

363. L. Z. Schlitz and S. V. Garimella, “Nonlinear Interface Stability Analysis of Alloy Solidification Including

Effects of Surface Energy,” Journal of Applied Physics Vol. 76(8), pp. 4863-4871, 1994.

364. S. V. Garimella and D. J. Schlitz, “Reducing Inter-Chip Temperature Differences in Computers Using

Vortex Generators in Forced Convection,” ASME Journal of Electronic Packaging Vol. 115(4), pp. 410-

415, 1993.

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365. S. V. Garimella, K. A. Shollenberger, P. A. Eibeck and S. White, “Flow and Heat Transfer in Simulated Re-

Entry Vehicle Tile Gaps,” AIAA Journal of Thermophysics and Heat Transfe, Vol. 7(4), pp. 644-650, 1993.

366. L. Zhang and S. V. Garimella, “A Modified Mullins-Sekerka Stability Analysis Including Surface Energy

Effects,” Journal of Applied Physics Vol. 74(4), pp. 2494-2500, 1993.

367. S. V. Garimella and P. A. Eibeck, “Onset of Transition in the Flow over a Three-Dimensional Array of

Rectangular Obstacles,” ASME Journal of Electronic Packaging Vol. 114(2), pp. 251-255, 1992.

368. S. V. Garimella and D. J. Schlitz, “Influence of Fin Aspect Ratio on Heat Transfer Enhancement,” SAE

Transactions, Journal of Materials and Manufacturing Vol. 101(5), pp. 467-472, 1992.

369. S. V. Garimella and P. A. Eibeck, “Fluid Dynamic Characteristics of the Flow over an Array of Large

Roughness Elements,” ASME Journal of Electronic Packaging Vol. 113(4), pp. 367-373, 1991.

370. S. V. Garimella, “Physical Mechanisms for the Local Heat Transfer Enhancement Caused by Fin-Like

Obstacles in Heat Exchanger Flow Passages,” SAE Transactions, Journal of Materials and Manufacturing

Vol. 100(5), pp. 208-217, 1991.

371. S. V. Garimella and P. A. Eibeck, “Effect of Spanwise Spacing on the Heat Transfer from an Array of

Protruding Elements in Forced Convection,” International Journal of Heat and Mass Transfer Vol. 34(9),

pp. 2431-2433, 1991.

372. S. V. Garimella and P. A. Eibeck, “Enhancement of Single Phase Convective Heat Transfer from

Protruding Elements using Vortex Generators,” International Journal of Heat and Mass Transfer Vol.

34(9), pp. 2427-2430, 1991.

373. S. V. Garimella and P. A. Eibeck, “Heat Transfer Characteristics of an Array of Protruding Elements in

Single Phase Forced Convection,” International Journal of Heat and Mass Transfer Vol. 33(12),

pp. 2659-2669, 1990.

374. S. V. Garimella and R. N. Christensen, “Transient Condensation in the Presence of Noncondensables at a

Flat, Vertical Wall,” Nuclear Technology Vol. 89, pp. 388-398, 1990.

Refereed Conference Publications

(Based on Review of the Full Paper)

1. K. Baraya, J. A. Weibel, and S. V. Garimella, “Experimental Demonstration of Heat Pipe Operation

Beyond the Capillary Limit during Brief Transient Heat Loads,” IEEE Intersociety Conference on Thermal

and Thermomechanical Phenomena in Electronic Systems (ITherm), Las Vegas, NV, May 28-31, 2019.

2. T. P. Allred, J. A. Weibel, and S. V. Garimella, “Control of Pool Boiling Hydrodynamics Through Surface

Wettability Patterning,” 16

International Heat Transfer Conference, Beijing, China, August 10-15, 2018.

3. M. D. Clark, J. A. Weibel, and S. V. Garimella, “Identification of the Dominant Heat Transfer Mechanisms

During Confined Two-Phase Jet Impingement,” IEEE Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm), San Diego, CA, May 29- Jun 1, 2018 (Best

Student Poster, Component-Level).

4. I. L. Collins, J. A. Weibel, L. Pan, and S. V. Garimella, “Experimental Characterization of Microchannel

Heat Sinks made by Additive Manufacturing,” IEEE Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm), San Diego, CA, May 29- Jun 1, 2018 (Best

Student Poster, Emerging Technologies).

5. K. N. Son, J. A. Weibel, S. V. Garimella, J. C. Knox, and R. F. Coker, “Calibration and Sensitivity of a Fixed-

bed Adsorption Model for Atmosphere Revitalization in Space,” 47

International Conference on

Environmental Systems (ICES), Charleston, SC, July 16-20, 2017.

6. S. Sudhakar, J. A. Weibel, and S. V. Garimella, “An Area-Scalable Two-Layer Evaporator Wick Concept for

High-Heat-Flux Vapor Chambers,” Procs. ITHERM17, Orlando, FL, May 30 - Jun 2, 2017 (Best Student

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Poster, Component-Level).

7. G. Patankar, J. A. Weibel, and S. V. Garimella, “A Time-Stepping Analytical Model for 3D Transient Vapor

Chamber Transport,” Procs. ITHERM17, Orlando, FL, May 30 - Jun 2, 2017 (Best Student Poster, System-

Level).

8. C. Mira-Hernández, M. D. Clark, J. A. Weibel, and S. V. Garimella, “A Semi-Empirical Model for Two-

Phase Heat Transfer from Arrays of Confined Impinging Jets,” Procs. ITHERM17, Orlando, FL, May 30 -

Jun 2, 2017.

9. T. A. Kingston, J. A. Weibel, and S. V. Garimella, “Rapid-Bubble-Growth Instability at the Onset of

Microchannel Flow Boiling,” Procs. ITHERM17, Orlando, FL, May 30 - Jun 2, 2017 (Best Student Poster,

Emerging Technologies and Fundamentals).

10. K. P. Drummond, J. A. Weibel, and S. V. Garimella, “Experimental Study on Flow Boiling in a Compact

Hierarchical Manifold Microchannel Heat Sink Array,” SEMI-THERM 33

Annual Symposium and Exhibit,

San Jose, CA, March 13-17, 2017 (Best Student Paper).

11. A. Jain, Y. Huang, J. A. Weibel, and S. V. Garimella, “Visualization of Ice Formation Modes and Flow

Blockage during Freezing of Water Flowing in a Microchannel,” ASME Summer Heat Transfer

Conference, HT2016-7243, Washington, DC, July 10-14, 2016.

12. A. Chandramohan, J. A. Weibel, and S. V. Garimella, “The Role of Condensation from Humid Air on

Melting of Ice,” Procs. ITHERM16, Las Vegas, NV, May 31- June 3, 2016.

13. K. P. Drummond, J. A. Weibel, S. V. Garimella, D. Back, D. B. Janes, M. D. Sinanis, and D. Peroulis,

“Evaporative Intrachip Hotspot Cooling with a Hierarchical Manifold Microchannel Heat Sink Array,”

Procs. ITHERM16, Las Vegas, NV, May 31- June 3, 2016 (Best Paper Award, Emerging Technologies).

14. S. Sarangi, J. A. Weibel, and S. V. Garimella, “Effect of Particle Morphology on Pool Boiling from Surfaces

Coated with Sintered Particles,” ASME International Mechanical Engineering Congress and Exposition,

Houston, TX, November 13-19, IMECE2012-50238, 2015.

15. R. A. Simmons, H. Wang, S. V. Garimella, and E. A. Groll, “Hybrid, Plug-in Hybrid, and Electric Vehicle

Energy Consumption Sensitivity to the Combined Effects of Driving Cycle and Ambient Temperature-

Induced Thermal Loads,” Procs. 3

Sustainable Thermal Energy Management International Conference

(SUSTEM 2015), Newcastle upon Tyne, UK, July 7-8, pp. 271-283, 2015.

16. Z. Pan, J. A. Weibel, and S. V. Garimella, “A Cost-Effective Modeling Approach for Simulating Phase

Change and Flow Boiling in Microchannels,” International Technical Conference and Exhibition on

Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) and International

Conference on Nanochannels, Microchannels and Minichannels (ICNMM), San Francisco, CA, July 6-9,

2015.

17. G. Patankar, S. Mancin, J. A. Weibel, M. A. MacDonald, and S. V. Garimella, “A Method for Thermal

Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection,” InterPACK

and ICNMM, San Francisco, CA, July 6-9, 2015 (Outstanding Paper Award).

18. T. A. Kingston, J. A. Weibel, and S. V. Garimella, “Quantitative Visualization of Vapor Bubble Growth in

Diabatic Vapor-Liquid Microchannel Slug Flow,” InterPACK and ICNMM, San Francisco, CA, July 6-9, 2015

(Best Poster Award).

19. M. J. Rau, T. Guo, P. P. Vlachos, and S. V. Garimella, “Visualization of Confined Jet Impingement with

Boiling using Time-Resolved Stereo-PIV,” InterPACK and ICNMM, San Francisco, CA, July 6-9, 2015.

20. K. P. Drummond, J. A. Weibel, S. V. Garimella, D. Back, D. B. Janes, M. D. Sinanis, and D. Peroulis,

“Fabrication and Characterization of a Hierarchical Manifold Microchannel Array for Evaporative

Intrachip Cooling,” 40

Annual Government Microcircuit Applications & Critical Technology

(GOMACTech) Conference, St. Louis, MO, March 23-26, 2015.

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21. S. G. Krishnan, K. K. Bodla, J. A. Weibel and S. V. Garimella, “Numerical Investigation of Fluid Flow and

Heat Transfer in Periodic Porous Lattice-Frame Materials,” Procs. 15

International Heat Transfer

Conference (IHTC-15), Kyoto, Japan, August 10-15, 2014.

22. Y. Yadavalli, J. A. Weibel and S. V. Garimella, “Flat Heat Pipe Performance Thresholds at Ultra-Thin Form

Factors,” Paper No. 45, Procs. ITHERM14, Orlando, FL, May 27-30, 2014.

23. M. Dicuangco, S. Dash, J. A. Weibel and S. V. Garimella, “Evaporative Particle Deposition on

Superhydrophobic Surfaces,” ASME International Mechanical Engineering Congress & Exposition,

IMECE2013-63928, San Diego, CA, November 15-21, 2013.

24. C. Mira-Hernández, S. M. Flueckiger and S. V. Garimella, “Numerical Simulation of Single- and Dual-

Media Thermocline Tanks for Energy Storage in Concentrating Solar Power Plants,” Solar Power and

Chemical Energy Systems (SolarPACES), Las Vegas, NV, September 17-20, 2013; also published as Energy

Procedia Vol. 49, pp. 916-926, 2014.

25. S. M. Flueckiger, B. D. Iverson and S. V. Garimella, “Simulation of a Concentrating Solar Power Plant with

Molten-Salt Thermocline Storage for Optimized Annual Performance,” ASME International Conference

on Energy Sustainability, ES2013-19297, Minneapolis, MN, July 14-19, 2013.

26. K. K. Bodla and S. V. Garimella, “Microstructural Evolution and Transport Properties of Sintered Porous

Media,” ASME Summer Heat Transfer Conference, HT2013-17241, Minneapolis, MN, July 14-19, 2013.

27. Z. Pan, S. Dash, J. A. Weibel and S. V. Garimella, “Numerical Study of Water Droplet Evaporation on a

Superhydrophobic Surface,” ASME Summer Heat Transfer Conference, HT2013-17697, Minneapolis, MN,

July 14-19, 2013.

28. S. N. Joshi, M. J. Rau, E. M. Dede and S. V. Garimella, “An Experimental Study of a Multi-Device Jet

Impingement Cooler with Phase Change Using HFE-7100,” ASME Summer Heat Transfer Conference,

HT2013-17241, Minneapolis, MN, July 14-19, 2013.

29. R. S. Patel and S. V. Garimella, “Diagnostic Technique for Quantitative Resolution of Three-Dimensional

Liquid-Gas Phase Boundaries in Microchannel Flows,” ASME International Technical Conference and

Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2013-73057,

Burlingame, CA, July 16-18, 2013.

30. S. H. Taylor and S. V. Garimella, “A Capacitance-Based Technique for Characterization of Dielectric

Interfaces Using a Grid of Electrode Junctions,” ASME International Technical Conference and Exhibition

on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2013-73283,

Burlingame, CA, July 16-18, 2013.

31. S. N. Ritchey, J. A. Weibel and S. V. Garimella, “Effects of Non-Uniform Heating on Two-Phase Flow

through Microchannels,” ASME International Technical Conference and Exhibition on Packaging and

Integration of Electronic and Photonic Microsystems, InterPACK2013-73058, Burlingame, CA, July 16-18,

2013 (Outstanding Paper Award, Thermal).

32. S. Sarangi, K. K. Bodla, S. V. Garimella and J.Y. Murthy, “Optimization Under Uncertainty of Manifold

Microchannel Heat Sinks,” ASME International Mechanical Engineering Congress and Exposition,

Houston, TX, November 9-15, IMECE2012-89261, 2012.

33. B. J. Woodland, A. Krishna, E. A. Groll, J. E. Braun, W. T. Horton and S. V. Garimella, “Thermodynamic

Comparison of Organic Rankine Cycle with Liquid Flooded Expansion and with Solution Circuit,” Heat

Powered Cycles Conference 2012, Elkmaar, Netherlands, Sept 10-12, 2012.

34. S. M. Flueckiger, S. V. Garimella and E. A. Groll, “Numerical Study of Supercritical CO2 Convective Heat

Transfer in Advanced Brayton Cycles for Concentrated Solar Power,” ES2012-91396, Procs. 6

International Conference on Energy Sustainability, ASME, San Diego, CA, July 23-26, 2012.

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35. K. K. Bodla, J. Y. Murthy and S. V. Garimella, “Analysis of Thin-Film Evaporation through Sintered Wick

Microstructures”, HT2012-58598, Procs. Summer Heat Transfer Conference, Rio Grande, Puerto Rico,

July 8-12, 2012.

36. J. A. Weibel, A. S. Kousalya, T. S. Fisher and S. V. Garimella, “Characterization and Nanostructured

Enhancement of Boiling Incipience in Capillary-Fed, Ultra-Thin Sintered Powder Wicks,” Procs.

ITHERM12, San Diego, CA, May 30-June 1, 2012.

37. K. K. Bodla, J. Y. Murthy and S. V. Garimella, “Optimization Under Uncertainty for Electronics Cooling

Design Applications,” Procs. ITHERM12, San Diego, CA, May 30-June 1, 2012.

38. R. Ranjan, J. Y. Murthy and S. V. Garimella, “Bubble Dynamics during Capillary-Fed Nucleate Boiling in

Porous Media,” Procs. ITHERM12, San Diego, CA, May 30-June 1, 2012.

39. R. S. Patel and S. V. Garimella, “Development of a Particle Tracking-Based Measurement Technique to

Map Three-Dimensional Interfaces Between Transparent, Immiscible Fluids,” Procs. ITHERM12, San

Diego, CA, May 30-June 1, 2012.

40. S. Chavali, Y. Singh, G. Subbarayan, and S. V. Garimella, “Mechanical and Thermal Response of

Compliant Thermal Interface Materials under Cyclic Loading,” Procs. ITHERM12, San Diego, CA, May 30-

June 1, 2012.

41. S. R. Annapragada, J. Y. Murthy and S. V. Garimella, “Droplet Shapes on Superhydrophobic Surfaces

under Electrowetting Actuation,” IMECE2011-65370, Proceedings of ASME 2011 International

Mechanical Engineering Congress & Exposition, Denver, CO, November 11-17, 2011.

42. B. Gebreslassie, E. A. Groll and S. V. Garimella, “Optimization of Solar-Assisted Single-Effect

Water/Lithium Bromide Absorption Chiller,” IMECE2011-63211, Proceedings of ASME 2011 International

Mechanical Engineering Congress & Exposition, Denver, CO, November 11-17, 2011.

43. S. Flueckiger, Z. Yang and S. V. Garimella, “Thermocline Energy Storage in the Solar One Power Plant: An

Experimentally Validated Thermomechanical Investigation,” ASME Energy Sustainability Conference,

Washington DC, August 7-10, 2011.

44. R. Ranjan, A. Patel, S. V. Garimella and J. Y. Murthy, “Wicking and Thermal Characteristics of

Micropillared Structures for use in Passive Heat Spreaders,” InterPACK2011-52041, Procs. ASME 2011

Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic

Systems, Portland, OR, July 6-8, 2011.

45. S. Dash, N. Kumari, M. Dicuangco and S. V. Garimella, “Single-Step Fabrication and Characterization of

Ultrahydrophobic Surfaces with Hierarchical Roughness,” InterPACK2011-52046, Procs. ASME 2011

Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic

Systems, Portland, OR, July 6-8, 2011 (First Prize for Best Poster in Advanced Packaging and Materials).

46. R. Ranjan, J. Y. Murthy, S. V. Garimella and D. H. Altman, “An Experimentally Validated Model for

Transport in Thin, High Thermal Conductivity, Low CTE Heat Spreaders,”

InterPACK2011-56039, Procs.

ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic

and Photonic Systems, Portland, OR, July 6-8, 2011 (First Prize for Best Poster in Thermal Management).

47. S. R. Annapragada, S. Dash, S. V. Garimella and J. Y. Murthy, “Dynamics of Droplet Motion under

Electrowetting Actuation,” InterPACK2011-52061, Procs. ASME 2011 Pacific Rim Technical Conference &

Exposition on Packaging and Integration of Electronic and Photonic System, Portland, OR, July 6-8, 2011.

48. R. S. Patel, T. Harirchian and S. V. Garimella, “Dependence of Flow Boiling Heat Transfer Coefficient on

Location and Vapor Quality in a Microchannel Heat Sink,” InterPACK2011-52089, Procs. ASME 2011

Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic

System, Portland, OR, July 6-8, 2011.

49. S. Paranjape, S. N. Ritchey and S. V. Garimella, “Impedance-Based Void Fraction Measurement and Flow

Regime Identification in Microchannel Flows,” InterPACK2011-52116, Procs. ASME 2011 Pacific Rim

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Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic System,

Portland, OR, July 6-8, 2011.

50. A. Krishna, E. A. Groll and S. V. Garimella, “Organic Rankine Cycle with Solution Circuit for Ultra Low-

Grade Waste Heat Recovery,” International Sorption Heat Pump Conference, Padua, Italy, April 6-8,

2011.

51. T. Chen and S. V. Garimella, “A Study of Critical Heat Flux during Flow Boiling in Microchannel Heat

Sinks,” ASME/JSME 2011 8

Thermal Engineering Joint Conference (AJTEC2011), Honolulu, Hawaii,

March 13-17, 2011.

52. N. Bajaj, G. Subbarayan and S. V. Garimella, “Topological Design Optimization of Nested Channels for

Squeeze Flow of Thermal Interface Materials,” International Mechanical Engineering Congress and

Exposition, ASME, Vancouver, British Columbia, Canada, November 12-18, 2010.

53. M. Hashimoto, H. Kasai, K. Usami, H. Ryoson, K. Yazawa, J. A. Weibel and S. V. Garimella, “Nano-

Structured Two-Phase Heat Spreader for Cooling Ultra- High Heat Flux Sources,” 14

International Heat

Transfer Conference, Washington, D.C., August 8-13, 2010.

54. S. Kim, J. A. Weibel, T. S. Fisher and S. V. Garimella, “Thermal Performance of Carbon Nanotube

Enhanced Vapor Chamber Wicks,” 14

International Heat Transfer Conference, Washington, D.C.,

August 8-13, 2010.

55. X. Nie, X. Hu, S. V. Garimella and D. Tang, “Heat and Mass Transfer in the Corner Flow Region of Vertical

Microgrooves,” Proceedings of ASME 2010 3rd Joint US-European Fluids Engineering Summer Meeting

and 8th International Conference on Nanochannels, Microchannels, and Minichannels FEDSM2010,

Montreal, Canada, August 2-4, 2010.

56. J. A. Weibel, S. V. Garimella, J. Y. Murthy and D. H. Altman, “Optimization of Mass Transport in

Integrated Nanostructured Wicking Surfaces for the Reduction of Evaporative Thermal Resistance,”

Procs. ITHERM10, Reno, NV, June 2-5, 2010.

57. M. Hashimoto, H. Kasai, Y. Ishida, H. Ryoson, K. Yazawa, J. A. Weibel and S. V. Garimella, “A Two-Phase

Heat Spreader for Cooling High Heat Flux Sources,” Procs. ITHERM10, Reno, NV, June 2-5, 2010.

58. K. K. Bodla, J. Y. Murthy and S. V. Garimella “XMT-Based Direct Simulation of Flow and Heat Transfer

through Open-cell Aluminum Foams,” Procs. ITHERM10, Reno, NV, June 2-5, 2010.

59. R. Ranjan, J. Y. Murthy, S. V. Garimella and U. Vadakkan, “A Numerical Model for Transport in Heat Pipes

Considering Wick Microstructure Effects,” Procs. ITHERM10, Reno, NV, June 2-5, 2010.

60. S. R. Annapragada, T. Salamon, P. Kolodner, M. Hodes and S. V. Garimella, “Prediction of Electrical

Contact Resistivity in Thermoelectric Modules (TEMS) from Module-Level Measurements,” Procs.

ITHERM10, Reno, NV, June 2-5, 2010.

61. N. Bajaj, G. Subbarayan and S. V. Garimella, “Squeeze Flow Characterization of Particle-Filled Polymeric

Materials through Image Correlation,” Procs. ITHERM10, Reno, NV, June 2-5, 2010.

62. A. Dalal, R. Ranjan, J. Y. Murthy and S. V. Garimella,

“Heat Transfer during Evaporation of Binary Liquids

from Wick Microstructures,” ASME/ISHMT Heat and Mass Transfer Conference, Mumbai, India, January

4-6, 2010.

63. S. R. Annapragada, S. V. Garimella, and J. Y. Murthy, “Experimental Characterization of Droplet Motion

on Inclined Hydrophobic Surfaces,” ASME/ISHMT Heat and Mass Transfer Conference, Mumbai, India,

January 4-6, 2010.

64. R. Ranjan, J. Y. Murthy and S. V. Garimella, “Numerical Study of Evaporation Heat Transfer from the

Liquid-Vapor Interface in Wick Microstructures,” IMECE2009-11326, ASME International Mechanical

Engineering Congress and Exposition, Lake Buena Vista, FL, November 13-19, 2009 (Best Poster Award).

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65. S. R. Annapragada, J. Y. Murthy and S. V. Garimella, “Forces Acting on Sessile Droplets on Inclined

Surfaces,” HT2009-88365, ASME Summer Heat Transfer Conference, San Francisco, CA, July 19-23, 2009

(Best Poster Award).

66. T. Harirchian and S. V. Garimella, “A Systematic Investigation of the Effects of Microchannel Width,

Depth, and Aspect Ratio on Convective Boiling Heat Transfer and Flow Regimes in Parallel

Microchannels,” HT2009-88331, ASME Summer Heat Transfer Conference, San Francisco, CA, July 19-23,

2009.

67. B. T. Holcomb, T. Harirchian and S. V. Garimella, “An Experimental Investigation of Microchannel Size

Effects on Flow Boiling with De-Ionized Water,” HT2009-88329, ASME Summer Heat Transfer

Conference, San Francisco, CA, July 19-23, 2009.

68. N. Kumari, V. Bahadur, M. Hodes, T. Salamon, A. Lyons, P. Kolodner and S. V. Garimella, “Numerical

Analysis of Mist-Cooled High Power Components in Cabinets,” IPACK2009-89269, The ASME/Pacific Rim

Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic

Systems (InterPACK ’09), San Francisco, CA, July 19-23, 2009 (Best Poster Award).

69. C. P. Migliaccio, H. K. Dhavaleswarapu and S. V. Garimella, “Microscale Temperature Measurements

near the Contact Line of an Evaporating Thin Film in a V-Groove,” IPACK2009-89134, The ASME/Pacific

Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic

Systems (InterPACK ’09), San Francisco, CA, July 19-23, 2009.

70. B. J. Jones and S. V. Garimella, “Surface Roughness Effects on Flow Boiling in Microchannels,”

IPACK2009-89168, The ASME/Pacific Rim Technical Conference and Exhibition on Integration and

Packaging of Micro, Nano, and Electronic Systems (InterPACK ’09), San Francisco, CA, July 19-23, 2009.

71. R. Lonergan, M. L. Kimber and S. V. Garimella, “Vibration Coupling in Arrays of Oscillating Piezoelectric

Fans,” Second International Conference on Thermal Issues in Emerging Technologies Theory and

Applications (TheTA) Conference, Cairo, Egypt, December 17-20, 2008.

72. D. B. Go, R. A. Maturana, R. K. Mongia, S. V. Garimella and T. S. Fisher, “Ionic Winds for Enhanced

Cooling in Portable Platforms,” 10

Electronics Packaging Technology Conference, December 9-12, 2008,

Singapore.

73. F. Volle, S. V. Garimella and M. A. Juds, “A Thermal Quadrupole-Based Model for Heat Diffusion in a

Multilayered System: Application to Determination of Transient Performance of a Medium-Voltage Soft

Starter,” IMECE2008-67470, ASME International Mechanical Engineering Congress and Exposition,

Boston, MA, October 31-November 6, 2008.

74. R. Ranjan, J. Y. Murthy and S. V. Garimella, “Characterization of Microstructures for Heat Transfer

Performance in Passive Cooling Devices,” HT2008-56170, ASME Summer Heat Transfer Conference,

Jacksonville, FL, August 10-14, 2008.

75. S. R. Annapragada, J. Y. Murthy and S. V. Garimella, “Permeability and Thermal Transport in Compressed

Open-Celled Foams,” HT2008-56375, ASME Summer Heat Transfer Conference, Jacksonville, FL, August

10-14, 2008 (Best Paper Award).

76. J. P. McHale and S. V. Garimella, “Measurements of Bubble Nucleation Characteristics in Pool Boiling of

a Wetting Liquid on Smooth and Roughened Surfaces,” HT2008-56179, ASME Summer Heat Transfer

Conference, Jacksonville, FL, August 10-14, 2008.

77. R. A. Bidkar, M. Kimber, A. Raman, A. K. Bajaj and S. V. Garimella, “Nonlinear Aerodynamic Damping of

Beams at High Oscillatory Reynolds Numbers,” 9th International Conference on Flow-Induced Vibrations

– FIV2008, Prague, Czech Republic, June 30-July 2, 2008.

78. S. Aradhya, S. V. Garimella and T. S. Fisher, “Electrochemically Bonded Carbon Nanotube Interfaces,”

Procs. ITHERM08, Orlando, FL, May 28-31, 2008.

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79. M. Kimber, K. Suzuki, N. Kitsunai, K. Seki and S. V. Garimella, “Quantification of Piezoelectric Fan Flow

Rate Performance and Experimental Identification of Installation Effects,” Procs. ITHERM08, Orlando, FL,

May 28-31, 2008.

80. D. Liu and S. V. Garimella, “Microfluidic Pumping based on Dielectrophoresis for Thermal Management

of Microelectronics,” Procs. ITHERM08, Orlando, FL, May 28-31, 2008.

81. V. Bahadur, M. Hodes, A. Lyons, S. Krishnan and S. V. Garimella, “Enhanced Cooling in a Sealed Cabinet

using an Evaporating-Condensing Dielectric Mist,” Procs. ITHERM08, Orlando, FL, May 28-31, 2008.

82. T. Harirchian and S. V. Garimella, “An Investigation of Flow Boiling Regimes in Microchannels of

Diffferent Dimensions by Means of High-Speed Visualization,” Procs. ITHERM08, Orlando, FL, May 28-31,

2008.

83. H. Wang, S. V. Garimella and J. Y. Murthy, “Analysis of the Total Heat Transfer in an Evaporating Thin

Film,” MNHT2008-52386, ASME Micro/Nanoscale Heat Transfer International Conference (MNHT08),

Tainan, Taiwan, January 6-9, 2008.

84. S. V. Garimella and D. Liu, “Microscale Thermal Transport and Electromechanical Microfluidic

Actuation,” Keynote Lecture at ASME/ISHMT Heat and Mass Transfer Conference, Hyderabad, India,

January 3-5, 2008.

85. T. Harirchian and S. V. Garimella, “Microchannel Size Effects on Two-Phase Local Heat Transfer and

Pressure Drop in Silicon Microchannel Heat Sinks with a Dielectric Fluid,” IMECE2007-42458, ASME

International Mechanical Engineering Congress and Exposition, Seattle, WA, November 2007.

86. H. Dhavaleswarapu, S. V. Garimella and J. Y. Murthy, “Microscale Temperature Measurements at the

Triple Line of an Evaporating Thin Film,” IMECE2007-42398, ASME International Mechanical Engineering

Congress and Exposition, Seattle, WA, November 2007.

87. S. Bertsch, E. A. Groll and S. V. Garimella, “Experimental Investigation of Local Heat Transfer Coefficient

for Refrigerant Flow Boiling in Microchannel Cold Plate Evaporators,” 22

International Congress on

Refrigeration, Beijing, August 21-26, 2007.

88. S. Krishnan, J. Y. Murthy and S. V. Garimella, “Thermal and Fluid Transport through Open Cell Metal

Foams,” 3rd International Conference on Diffusion in Solids and Liquids - DSL-2007, Algarve, Portugal,

July 4-6, 2007.

89. N. Kumari, S. Krishnan and S. V. Garimella, “Analysis and Performance Comparison of Competing Cooling

Technologies for a Desktop Application,” The ASME/Pacific Rim Technical Conference and Exhibition on

Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK ’07), IPACK2007-33407,

Vancouver, Canada, July 8-12, 2007.

90. M. Kimber and S. V. Garimella, “Local Heat Transfer Characteristics of Flows Induced by Multiple

Piezoelectrically Actuated Vibrating Cantilevers,” ASME-JSME Thermal Engineering Summer Heat

Transfer Conference, HT2007-32394, Vancouver, Canada, July 8-12, 2007.

91. D. B. Go, R. A. Maturana, T. S. Fisher and S. V. Garimella, “External Forced Convection Enhancement

using a Corona Discharge,” ASME-JSME Thermal Engineering Summer Heat Transfer Conference,

HT2007-32379, Vancouver, Canada, July 8-12, 2007.

92. B. J. Jones and S. V. Garimella, “Effects of Surface Roughness on the Pool Boiling of Water,” ASME-JSME

Thermal Engineering Summer Heat Transfer Conference, HT2007-32230, Vancouver, Canada, July 8-12,

2007.

93. H. Wang, J. Y. Murthy and S. V. Garimella, “Characteristics of an Evaporating Thin Film in a

Microchannel,” ASME International Mechanical Engineering Congress and Exposition, IMECE2006-

13899, Chicago, IL, November 2006.

Suresh V. Garimella, July 2024

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94. S. Krishnan, S. V. Garimella and J. Y. Murthy, “Simulation of Thermal Transport in Open-Cell Metal

Foams: Effect of Periodic Unit Cell Structure,” ASME International Mechanical Engineering Congress and

Exposition, IMECE2006-14044, Chicago, IL, November 2006.

95. S. R. Annapragada, D. Sun and S. V. Garimella, “Prediction of Effective Thermo-Mechanical Properties of

Particulate Composites,” ASME International Mechanical Engineering Congress and Exposition,

IMECE2006-14087, Chicago, IL, November 2006.

96. P.S. Lee and S. V. Garimella, “Flow Boiling in Silicon Microchannel Arrays,” ASME International

Mechanical Engineering Congress and Exposition, IMECE2006-14577, Chicago, IL, November 2006.

97. M. Kimber, S. V. Garimella and A. Raman, “Experimental Mapping of Local Heat Transfer Coefficients

under Multiple Piezoelectric Fans,” ASME International Mechanical Engineering Congress and

Exposition, IMECE2006-13922, Chicago, IL, November 2006.

98. P. Chamarthy, H. Dhavalewsarapu, S. V. Garimella, J. Y. Murthy and S. T. Wereley, “Visualization of

Thermocapillary Convection Near an Evaporating Meniscus,”

International Symposium on Flow

Visualization, Gottingen, Germany, Paper No. ISFV12- 74.2 (253), September 10-14, 2006.

99. B. J. Jones and S. V. Garimella, “Infrared Micro-Particle Image Velocimetry in a Silicon Microchannel Heat

Sink,” International Heat Transfer Conference, Sydney, Australia, August 13-18, 2006 (Best Poster Prize).

100. D. B. Go, S. V. Garimella and T. S. Fisher, “Numerical Simulation of Microscale Ionic Wind for Local

Cooling Enhancement,” Procs. ITHERM06, San Diego, CA, pp. 45-53, May 30 - June 2, 2006.

101. M. Kimber, S. V. Garimella and A. Raman, “An Experimental Study of Fluidic Coupling Between Multiple

Piezoelectric Fans,” Procs. ITHERM06, San Diego, CA, pp. 333-340, May 30 - June 2, 2006.

102. M. Iyengar and S. V. Garimella, “Design and Optimization of Microchannel Cooling Systems,” Procs.

ITHERM06, San Diego, CA, pp. 54-62, May 30 - June 2, 2006.

103. R. S. Annapragada, D. Sun and S. V. Garimella,

“Analysis and Suppression of Base Separation in the

Casting of a Cylindrical Ingot,” ASME/ISHMT Heat and Mass Transfer Conference, Guwahati, India,

January 4-6, 2006.

104. S. Basak, A. Raman and S. V. Garimella, “Hydrodynamic Loading of Vibrating Micro-Cantilevers,” ASME

International Mechanical Engineering Congress and Exposition, IMECE2005-80007, Orlando, FL,

November 2005.

105. P. S. Lee and S. V. Garimella, “Hot-Spot Thermal Management with Flow Modulation in a Microchannel

Heat Sink,” ASME International Mechanical Engineering Congress and Exposition, IMECE2005-79562,

Orlando, FL, November 2005.

106. D. Liu and S. V. Garimella, “Flow Boiling in a Microchannel Heat Sink,” ASME International Mechanical

Engineering Congress and Exposition, IMECE2005-79555, Orlando, FL, November 2005.

107. D. Sun, R. S. Annapragada, S. V. Garimella and S. Singh, “Solidification Heat Transfer and Base Separation

Analysis in the Casting of an Energetic Material in a Projectile,” ASME International Mechanical

Engineering Congress and Exposition, IMECE2005-80432, Orlando, FL, November 2005.

108. S. Krishnan, J. Y. Murthy and S. V. Garimella, “Direct Simulation of Transport in Open-Cell Metal Foams,”

ASME International Mechanical Engineering Congress and Exposition, IMECE2005-81309, Orlando, FL,

November 2005.

109. S. Krishnan, J. Y. Murthy and S. V. Garimella, “Analysis of Solid-Liquid Phase Change under Pulsed

Heating,” ASME International Mechanical Engineering Congress and Exposition, IMECE2005-82553,

Orlando, FL, November 2005.

110. S. Krishnan, S. V. Garimella, G. M. Chrysler and R. V. Mahajan, “Towards a Thermal Moore’s Law,” The

ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano,

and Electronic Systems (InterPACK ’05), IPACK2005-73409, San Francisco, July 17-22, 2005.

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111. T. Chen and S. V. Garimella, “Flow Boiling Heat Transfer to a Dielectric Coolant in a Microchannel Heat

Sink,” The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro,

Nano, and Electronic Systems (InterPACK ’05), IPACK2005-73438, San Francisco, July 17-22, 2005.

112. T. Acikalin, I. Sauciuc and S. V. Garimella, “Piezoelectric Actuators for Low-Form-Factor Electronics

Cooling,” The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of

Micro, Nano, and Electronic Systems (InterPACK ’05), IPACK2005-73288, San Francisco, July 17-22, 2005.

113. S. V. Garimella, “Transport in Mesoscale Cooling Systems,” Keynote Lecture, Symposium on

Fundamental Issues and Perspectives in Fluid Mechanics, FEDSM2005-77325, ASME Fluids Engineering

Summer Conference, Houston, TX, June 19-23, 2005.

114. T. Chen and S. V. Garimella, “Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in

a Microchannel Heat Sink,” 3rd International Conference on Microchannels and Minichannels, Toronto,

Canada, June 13-15, 2005.

115. D. Sun, S. V. Garimella and A. Mukhopadhyay, “Analysis of the Solidification of Particle-Laden Melts,”

Symposium on Frontiers in Solidification Science, TMS Annual Meeting and Exhibition, San Francisco, CA,

February 13-17, 2005.

116. D. Sun, S. V. Garimella, S. Singh and N. Naik, “Numerical and Experimental Investigation of the Melt

Casting of Explosives,” ASME International Mechanical Engineering Congress and Exposition,

IMECE2004-59338, Anaheim, CA, November 2004.

117. V. Singhal and S. V. Garimella, “A Novel Micropump for Electronics Cooling,” ASME International

Mechanical Engineering Congress and Exposition, IMECE2004-61147, Anaheim, CA, November 2004.

118. T. Acikalin, B. D. Iverson, S. V. Garimella, A. Raman and J. Petroski, “Numerical Investigation of the Flow

and Heat Transfer Due to a Miniature Piezoelectric Fan,” ASME International Mechanical Engineering

Congress and Exposition, IMECE204-61145, Anaheim, CA, November 2004.

119. S. V. Garimella, “Advances in Mesoscale Thermal Management Technologies for Microelectronics,”

Keynote Lecture, 10

International Workshop on Thermal Investigations of ICs and Systems

(THERMINIC), September 29 to October 1, 2004, Sophia Antipolis, France, pp. 185-206.

120. S. Krishnan, J. Y. Murthy and S. V. Garimella, “A Two-Temperature Model for Solid/Liquid Phase Change

in Metal Foams,” Procs. HT-FED04, 2004 ASME Heat Transfer/Fluids Engineering Summer Conference,

HT-FED04-56337, July 11-15, 2004, Charlotte, NC.

121. B. D. Iverson and S. V. Garimella, “Experimental Measurements of Heat and Mass Transport in Heat Pipe

Wicks,” Procs. HT-FED04, 2004 ASME Heat Transfer/Fluids Engineering Summer Conference, HT-FED04-

56230, July 11-15, 2004, Charlotte, NC.

122. D. Liu, S. V. Garimella and S. T. Wereley, “Infrared Micro-Particle Image Velocimetry of Fluid Flow in

Silicon-Based Microdevices,” Procs. HT-FED04, 2004 ASME Heat Transfer/Fluids Engineering Summer

Conference, HT-FED04-56385, July 11-15, 2004, Charlotte, NC.

123. D. J. Schlitz, S. V. Garimella and T. S. Fisher, “Microscale Ion-Driven Air Flow over a Flat Plate,” Procs. HT-

FED04, 2004 ASME Heat Transfer/Fluids Engineering Summer Conference, HT-FED04-56470, July 11-15,

2004, Charlotte, NC.

124. S. V. Garimella, “Advances in Mesoscale Thermal Management Technologies for Microelectronics,”

Keynote Lecture, Sixth International Symposium on Heat Transfer, pp. 2-21, Beijing, China, June 15-19,

2004.

125. D. Liu, S. V. Garimella and S. T. Wereley, “Non-Intrusive Optical Measurement of Fluid Flow in Silicon-

Based Micro-Devices,” Sixth International Symposium on Heat Transfer, pp. 716-722, Beijing, China, June

15-19, 2004.

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126. S. Krishnan, S. V. Garimella and S. S. Kang, “A Novel Hybrid Heat Sink using Phase Change Materials for

Transient Thermal Management of Electronics,” Procs. ITHERM04, pp. 310-318, Las Vegas, NV, June

2004.

127. T. Acikalin, S. V. Garimella, J. Petroski and A. Raman, “Optimal Design of Miniature Piezoelectric Fans for

Cooling Light Emitting Diodes,” Procs. ITHERM04, pp. 663-671, Las Vegas, NV, June 2004.

128. S. M. Wait, T. Açıkalın, S. V. Garimella and A. Raman, “Piezoelectric Fans for the Thermal Management of

Electronics,” Procs. Sixth ISHMT/ASME Heat and Mass Transfer Conference, Kalpakkam, India, Paper No.

HMT-2004-C76, pp. 447-452, January 5-7, 2004 (Best Paper Award).

129. M. S. Peterson, T. S. Fisher, S. V. Garimella and D. J. Schlitz, “Experimental Characterization of Low-

Voltage Field Emission from Carbon-Based Cathodes in Atmospheric Air,” ASME International

Mechanical Engineering Congress and Exposition, IMECE2003-41775, Washington, D.C., November 2003.

130. D. J. Schlitz, S. V. Garimella and T. S. Fisher, “Numerical Simulation of Microscale Ion Driven Air Flow,”

ASME International Mechanical Engineering Congress and Exposition, IMECE2003-41316, Washington,

D.C., November 2003.

131. W. Zhang, T. S. Fisher, D. J. Schlitz and S. V. Garimella, “DSMC Simulation of Ion Generation in

Atmospheric Air,” ASME International Mechanical Engineering Congress and Exposition, IMECE2003-

41803, Washington, D.C., November 2003.

132. U. Vadakkan, S. V. Garimella and J. Y. Murthy, “Prediction of Dryout in Flat Heat Pipes at High Heat

Fluxes from Multiple Discrete Sources,” ASME International Mechanical Engineering Congress and

Exposition, IMECE2003-42444, Washington, D.C., November 2003.

133. S. Basak, A. Raman and S. V. Garimella, “Dynamic Response Optimization of Asymmetrically Configured

Piezoelectric Fans,” Symposium on Piezoelectric and Magnetostrictive Actuators Including MEMs

Devices at the ASME 19th Biennial Conference on Mechanical Vibration and Noise, Chicago, IL,

DETC2003/VIB-48529, September 2-6, 2003.

134. P.-S. Lee and S. V. Garimella, “Experimental Investigation of Heat Transfer in Microchannels,” ASME

Summer Heat Transfer Conference, HT2003-47293, Las Vegas, NV, July 21-23, 2003.

135. U. Vadakkan, J. Y. Murthy and S. V. Garimella, “Transient Analysis of Flat Heat Pipes,” ASME Summer

Heat Transfer Conference, HT2003-47349, Las Vegas, NV, July 21-23, 2003.

136. D. Liu and S. V. Garimella, “Analysis and Optimization of the Thermal Performance of Microchannel Heat

Sinks,” Procs. IPACK03, International Electronic Packaging Technical Conference and Exhibition,

IPACK2003-35260, Maui, Hawaii, July 6-11, 2003.

137. V. Singhal, D. Liu and S. V. Garimella, “Analysis of Pumping Requirements for Microchannel Cooling

Systems,” Procs. IPACK03, International Electronic Packaging Technical Conference and Exhibition,

IPACK2003-35237, Maui, Hawaii, July 6-11, 2003.

138. S. Krishnan and S. V. Garimella, “Thermal Management of Transient Power Spikes in Electronics - Phase

Change Energy Storage or Copper Heat Sinks?” Procs. IPACK03, International Electronic Packaging

Technical Conference and Exhibition, IPACK2003-35169, Maui, Hawaii, July 6-11, 2003.

139. S. V. Garimella and V. Singhal, “Single-Phase Flow and Heat Transport in Microchannel Heat Sinks,”

Keynote Lecture, First International Conference on Microchannels and Minichannels (Eds. S.G Kandlikar

et al.), ICMM2003-1018, pp. 159-169, ASME, 2003.

140. C. V. Madhusudana and S. V. Garimella, “Measurement of Thermal Contact Conductance – Steady-State

or Transient?” Paper Number TED-AJ03-179, Procs. 6th ASME-JSME Thermal Engineering Joint

Conference, Kohala Coast, Hawaii, March 16-20, 2003.

141. V. Singhal, S. V. Garimella and J. Y. Murthy, “Numerical Characterization of Low Reynolds Number Flow

Through the Nozzle-Diffuser Element in a Valveless Micropump,” Paper Number TED-AJ03-567, Procs.

6th ASME-JSME Thermal Engineering Joint Conference, Kohala Coast, Hawaii, March 16-20, 2003.

Suresh V. Garimella, July 2024

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142. S. Krishnan, J. Y. Murthy and S. V. Garimella, “A Two-Temperature Model for the Analysis of Passive

Thermal Control Systems for Electronics,” Procs. ASME International Mechanical Engineering Congress

and Exposition, IMECE2002-3335, pp. 1-11, New Orleans, LA, November 2002.

143. V. Singhal, S. V. Garimella and T. Siegmund, “Determination of Optimal Filler Volume Fraction for

Thermal Interface Materials in Electronics Cooling Applications,” Heat Transfer 2002 (Procs.

International Heat Transfer Conference, Grenoble, France), Vol. 3, pp. 9-14, 2002.

144. S. Krishnan and S. V. Garimella, “Performance Analysis of a Phase Change Energy Storage System for

Pulsed Power Dissipation,” Procs. Inter Society Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems - ITHERM 2002, San Diego, CA, pp. 476-484, May 29-June 1, 2002.

145. V. Singhal and S. V. Garimella, “Prediction of Thermal Contact Conductance by Surface Deformation

Analysis,” Procs. International Mechanical Engineering Congress and Exposition, New York, HTD-Vol.

369-7, IMECE2001/HTD-24376, pp. 43-50, 2001.

146. E. L. Olsen, S. V. Garimella and C. V. Madhusudana, “Modeling of Constriction Resistance at Coated

Joints with Radiation Heat Transfer,” Procs. 35

ASME National Heat Transfer Conference, Anaheim, CA,

NHTC 2001-20183, pp. 1-9, June 2001.

147. E. L. Olsen, S. V. Garimella and C. V. Madhusudana, “Modeling of Constriction Resistance in Coated

Joints in a Gas Environment,” Advances in Computational Heat Transfer II, G. de Vahl Davis and E.

Leonardi (Eds.), Begell House, New York, pp. 543-550, 2001.

148. C. B. Sobhan and S. V. Garimella, “A Comparative Analysis of Studies on Heat Transfer and Fluid Flow in

Microchannels,” Heat Transfer and Transport Phenomena in Microsystems, G. P. Celata et al. (Eds.),

Begell House, New York, pp. 80-92, 2000.

149. U. Vadakkan, S. V. Garimella and C. B. Sobhan, “Characterization of the Performance of Flat Heat Pipes

for Electronics Cooling,” in Packaging of Electronic and Photonic Devices, IMECE 2000, Orlando, FL, EEP-

Vol. 28, pp. 261-268, November 5-10, 2000.

150. J. E. Simpson, S. V. Garimella and H. C. de Groh III, “An Experimental and Computational Study of the

Bridgman Growth of an Alloy,” Modelling of Casting, Welding and Advanced Solidification Processes IX,

Sahm, Hansen and Conley (Eds.), Shaker-Verlag, Aachen, pp. 672-679, August 2000.

151. W. F. Mohs, C. V. Madhusudana and S. V. Garimella, “Constriction Resistance in Coated Joints,” Procs.

National Heat Transfer Conference, Pittsburgh, PA, NHTC2000-12033, pp. 1-7, August 2000.

152. C. B. Sobhan, S. V. Garimella and V. V. Unnikrishnan, “A Computational Model for the Transient Analysis

of Flat Heat Pipes,” Procs. Inter Society Conference on Thermal and Thermomechanical Phenomena in

Electronic Systems - ITHERM 2000, Las Vegas, NV, pp. 106-113, May 23-26, 2000.

153. S. V. Garimella and J. E. Simpson, “Numerical Investigations of Alloy Solidification in Space,” Procs. 4

ISHMT/ASME Heat and Mass Transfer Conference, Pune, India, (Tata McGraw Hill), pp. 243-249, 2000.

154. J. E. Simpson, S. V. Garimella, H. C. de Groh III and R. Abbaschian, “Numerical Simulations of Crystal

Growth of an Alloy under Microgravity Conditions,” Procs. 33

National Heat Transfer Conference,

ASME, Albuquerque, NM, NHTC 99-204, pp. 1-9, 1999.

155. L. A. Brignoni and S. V. Garimella, “Performance Characteristics of Confined Impinging Air Jets with

Surface Enhancement,” Advances in Electronic Packaging, EEP-Vol 26-2, pp. 2009-2014, 1999.

156. J. E. Simpson, H. C. de Groh III and S. V. Garimella, “An Experimental and Computational Study of

Directional Solidification in Transparent Materials,” invited paper 1999 TMS Annual Meeting, Fluid-Flow

Phenomena in Metals Processing, (El-Kaddah et al. Eds.), San Diego, CA, pp. 449-458, 1999.

157. V. P. Schroeder and S. V. Garimella, “Heat Transfer in the Confined Impingement of Multiple Air Jets,”

Procs. ASME Heat Transfer Division (IMECE, Anaheim, California), HTD-Vol. 361-1, pp. 183-190, 1998.

Suresh V. Garimella, July 2024

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158. J. E. Simpson, S. V. Garimella and M. M. Guslick, “Interface Propagation in the Presence of a Fibrous

Phase in Alloy Solidification,” Heat Transfer 1998 (Procs. International Heat Transfer Conference), Vol. 7,

pp. 235-240, 1998.

159. V. P. Schroeder and S. V. Garimella, “Heat Transfer from a Discrete Heat Source in Confined Air Jet

Impingement,” Heat Transfer 1998 (Procs. International Heat Transfer Conference), Vol. 5, pp. 451-456,

1998.

160. J. E. Simpson, S. V. Garimella, H. C. de Groh III and R. Abbaschian, “Melt Convection Effects in the

Bridgman Crystal Growth of an Alloy under Microgravity Conditions,” Procs. 7th AIAA/ASME Joint

Thermophysics and Heat Transfer Conference, ASME HTD-Vol. 357-4, pp. 123-132, 1998.

161. G. K. Morris, S. V. Garimella and J. A. Fitzgerald, “Improved Predictions of the Flow Field in Submerged

and Confined Impinging Jets Using the Reynolds Stress Model,” Procs. Sixth InterSociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM’98), Seattle, WA, pp. 362-

370, 1998.

162. S. V. Garimella, “Recent Developments in High-Performance Cooling Techniques for Electronic Systems,”

Keynote lecture, Proceedings of the Eurotherm Seminar No. 58, Nantes, France, Thermal Management

of Electronic Systems III, J.P Bardon et al. (Eds.), Elsevier, Paris, pp. 3-15, 1997.

163. J. E. Simpson and S. V. Garimella, “Interface Propagation and Free Convection in Alloy Solidification,”

Procs. ASME Heat Transfer Division (IMECE, Dallas), Transport Phenomena in Manufacturing and

Materials Processing, HTD-Vol. 351, Volume 1, pp. 25-34, 1997.

164. J. A. Fitzgerald and S. V. Garimella, “Visualization of the Flow Field in a Confined and Submerged

Impinging Jet,” Procs. ASME National Heat Transfer Conference, Baltimore, MD, ASME HTD-Vol. 346(8),

pp. 93-99, 1997.

165. J. E. Simpson and S. V. Garimella, “Free Convection Flow Patterns and Front Propagation in the

Unidirectional Solidification of a Pure Material,” Procs. 4

Decennial Intnl. Conf. Solidif. Proc. –

Solidification Proc. 1997, Eds. J. Beech and H. Jones, Sheffield, UK, July 1997, pp. 130-134.

166. L. Z. Schlitz and S. V. Garimella, “An Investigation of the Thermal Performance of a Medium-Voltage

Vacuum Circuit-Breaker,” Procs. Pacific Rim/ASME International Intersociety Electronic and Photonic

Packaging Conference (INTERpack ‘97), Advances in Electronic Packaging, EEP-Vol. 19-2, ASME, Eds. E.

Suhir, M. Shiratori, Y.C. Lee and G. Subbarayan, pp. 1875-1882, 1997.

167. J. A. Fitzgerald and S. V. Garimella, “Flow Field Measurements in Confined and Submerged Jet

Impingement,” Procs. International Mechanical Engineering Congress and Exposition, Atlanta, GA, HTD-

Vol. 333 (2) (Fundamentals of Convection Heat Transfer), pp. 121-129, 1996.

168. L. Chen, S. V. Garimella, J. A. Reizes and E. Leonardi, “Analysis of Bubble Rise Using the VOF Method: I.

Isolated Bubbles,” Procs. 31st National Heat Transfer Conference, Houston, TX, ASME HTD-Vol. 326, pp.

161-173, 1996.

169. L. Chen, S. V. Garimella, J. A. Reizes and E. Leonardi, “Analysis of Bubble Rise Using the VOF Method: II.

Bubble Interactions, Wall Effects, and Evaporation,” Procs. 31st National Heat Transfer Conference,

Houston, TX, ASME HTD-Vol. 326, pp. 175-181, 1996.

170. G. K. Morris and S. V. Garimella, “Orifice and Impingement Flow Fields in Confined Jet Impingement,”

Procs. 31st National Heat Transfer Conference, Houston, TX, ASME HTD-Vol. 324, pp. 101-106, 1996.

171. G. K. Morris and S. V. Garimella, “Correlations for Single-Phase Convective Heat Transfer from an Array

of Three-Dimensional Obstacles in a Channel,” Procs. Fifth InterSociety Conference on Thermal

Phenomena in Electronic Systems, Orlando, FL, pp. 292-298, 1996.

172. S. V. Garimella and B. Nenaydykh, “Influence of Nozzle Geometry on Heat Transfer in Submerged and

Confined Liquid Jet Impingement,” Cooling and Thermal Design of Electronic Systems, ASME HTD-Vol.

319 (also EEP-Vol. 15), pp. 49-57, 1995.

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173. G. K. Morris, S. V. Garimella and R. S. Amano, “Prediction of Jet Impingement Heat Transfer using a

Hybrid Wall Treatment with Different Turbulent Prandtl Number Functions,” Heat Transfer in Turbulent

Flows, ASME HTD-Vol. 318, pp. 1-10, 1995.

174. G. K. Morris, S. V. Garimella and D. L. Hlavac, “Wakes From Heated Obstacles in Forced Convection,”

Heat Transfer in High Heat-Flux Systems, ASME HTD-Vol. 304-2, pp. 121-130, 1995.

175. R. A. Rice and S. V. Garimella, “Heat Transfer from Discrete Heat Sources Using an Axisymmetric,

Submerged and Confined Liquid Jet,” Heat Transfer '94 (Procs. International Heat Transfer Conference),

Vol. 3, pp. 89-94, 1994.

176. S. V. Garimella and R. A. Rice, “Heat Transfer in Submerged and Confined Jet Impingement,” Heat

Transfer in High Heat Flux Systems, ASME HTD-Vol. 301, pp. 59-68, 1994.

177. J. P. McNulty, S. V. Garimella and L. Z. Schlitz, “Formation and Suppression of Channels During

Unidirectional Solidification of Aqueous Ammonium Chloride,” Transport Phenomena in Solidification,

ASME HTD-Vol. 284 (also AMD-Vol. 182), pp. 1-11, 1994.

178. S. V. Garimella and D. J. Schlitz, “Internal Cooling of Turbine Blades Using Large Roughness Elements,”

Fundamental and Applied Heat Transfer Research for Gas Turbine Engines, ASME HTD-Vol. 226, pp. 9-15,

1992.

179. S. V. Garimella and D. J. Schlitz, “Local Heat Transfer Enhancement Using Vortex Generators in Duct

Flows with Obstacle Arrays,” Topics in Heat Transfer - Volume 2, ASME HTD-Vol. 206-2, pp. 95-101,

1992.

180. S. V. Garimella, K. A. Shollenberger, P. A. Eibeck and S. White, “Flow and Heat Transfer in Space Shuttle

Tile Gaps,” AIAA Paper No. 92-4061, ASME National Heat Transfer Conference, San Diego, CA, August 9-

12, 1992.

181. S. V. Garimella and D. J. Schlitz, “Effect of Fin Aspect Ratio on Heat Transfer Enhancement,” SAE Paper

No. 920547, SAE International Congress and Exposition, Detroit, MI, 1992.

182. S. V. Garimella and P. A. Eibeck, “Fluid Dynamic Characteristics of the Flow over an Array of Large

Roughness Elements,” Procs. InterSociety Conference on Thermal Phenomena in Electronic Systems,

Austin, TX, pp. 102-109, 1992.

183. S. V. Garimella, “Physical Mechanisms for the Local Heat Transfer Enhancement Caused by Fin-Like

Obstacles in Heat Exchanger Flow Passages,” SAE Paper No. 910196, SAE International Congress and

Exposition, Detroit, MI, 1991.

184. S. V. Garimella and P. A. Eibeck, “Onset of Transition in the Flow over a Three-Dimensional Array of

Rectangular Obstacles,” Thermal Modeling and Design of Electronic Systems and Devices, ASME HTD -

Vol. 153, pp. 1-6, 1990.

Conference Publications

(Full Paper Based on Review of an Extended Abstract)

185. C. R. Bradshaw, E. A. Groll and S. V. Garimella, “A Sensitivity Analysis of a Miniature-Scale Linear

Compressor for Electronics Cooling using a Comprehensive Model,” International Compressor

Engineering Conference at Purdue, West Lafayette, IN, Paper 1133, July 16-19, 2012.

186. C. R. Bradshaw, E. A. Groll and S. V. Garimella, “Linear Compressors for Electronics Cooling: Energy

Recovery and Useful Benefits,” International Compressor Engineering Conference at Purdue, West

Lafayette, IN, Paper 1134, July 16-19, 2012.

187. C. R. Bradshaw, E. A. Groll, and S. V. Garimella, “A Miniature-Scale Linear Compressor for Electronics

Cooling,” Proceedings of the Deutscher Klte- und Klimatechnischer Verein (DKV), Aachen, Germany, No.

AA11.2.03, November 17, 2011.

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188. S. V. Garimella, “Small-Scale Solutions to Grand Challenges in Thermal Management,” Invited Lecture at

the 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy

Conversion Applications (PowerMEMS 2010), Leuven, Belgium, November 30-December 3, 2010.

189. E. Da Riva, D. Del Col, A. Cavallini and S. V. Garimella, “Simulation of Condensation in a Circular

Minichannel: Application of VOF Method and Turbulence Model,”

International Refrigeration and Air

Conditioning Conference, West Lafayette, IN, July 12-15, 2010.

190. C. Bradshaw, E. A. Groll, and S. V. Garimella, “A Comprehensive Model of a Miniature-Scale Linear

Compressor for Electronics Cooling,” International Refrigeration and Air Conditioning Conference, West

Lafayette, IN, July 12-15, 2010 (Best Paper Award).

191. S. V. Garimella and T. Harirchian, “Boiling Heat Transfer and Flow Regimes in Microchannels – a

Comprehensive Understanding,” Keynote Lecture at the 15th International Workshop on Thermal

Investigations of ICs and Systems (THERMINIC), Leuven, Belgium, pp. 101-112, October 7-9, 2009.

192. B. J. Jones and S. V. Garimella, “Surface Roughness Effects on Boiling Heat Transfer,” International

Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Thermal

Management, Palo Alto, CA, October 6-8, 2009.

193. S. Bertsch, E. A. Groll and S. V. Garimella, “Flow Boiling Heat Transfer in Microchannel Heat Exchangers

for Electronics Cooling,” Deutsche Kältetechnische Tagung (DKV) 2008Conference, Ulm, Germany,

November 20-21, 2008.

194. B. D. Iverson and S. V. Garimella, “Performance Characterization of a Traveling-Wave

Electrohydrodynamic Micropump,” IMECE2008-67790, ASME International Mechanical Engineering

Congress and Exposition, Boston, MA, October 31-November 6, 2008.

195. A. A. Sathe, E. A. Groll and S. V. Garimella, “Experimental Evaluation of a Miniature Rotary Compressor

for Application in Electronics Cooling,” International Compressor Engineering Conference, West

Lafayette, IN, July 2008.

196. S. S. Bertsch, E. A. Groll and S. V. Garimella, “Flow Boiling Heat Transfer in Microchannel Cold Plate

Evaporators for Electronics Cooling,” International Refrigeration and Air Conditioning Conference, West

Lafayette, IN, July 2008.

197. A. A. Sathe, E. A. Groll and S. V. Garimella, “Design Optimization of Electrostatically Actuated Miniature

Compressors for Electronics Cooling,” International Compressor Engineering Conference, West Lafayette,

IN, July 2008.

198. T. Harirchian and S. V. Garimella, “Flow Boiling in Silicon Microchannel Heat Sinks,” ST-24, 24

IEEE

SemiTHERM Symposium, San Jose, CA, March 16-20, 2008.

199. P. Chamarthy, S. Wereley and S. V. Garimella, “Microscale Laser-Induced Fluorescence Method for Non-

Intrusive Temperature Measurement,” IMECE2007-41935, ASME International Mechanical Engineering

Congress and Exposition, Seattle, WA, November 2007.

200. S. V. Garimella and V. Bahadur, “Electrically Actuated Microscale Flows for Microelectronics Cooling,”

Keynote Lecture, The Eighteenth International Symposium on Transport Phenomena, Daejeon, Korea,

pp. 281-294, 27-30 August, 2007.

201. L. Cremaschi, E. A. Groll and S. V. Garimella, “Performance Potential and Challenges of Future

Refrigeration Systems for Electronics Cooling,” Thermal Challenges in Next-Generation Electronic

Systems – THERMES II, Santa Fe, NM, January 7-10, 2007.

202. V. Bahadur and S. V. Garimella, “Electrowetting-Induced Droplet Motion for Heat Transfer Applications,”

Thermal Challenges in Next-Generation Electronic Systems – THERMES II, Santa Fe, NM, January 7-10,

2007.

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203. P. Chamarthy, S. Wereley and S. V. Garimella, “Simultaneous Measurement of Velocity and Temperature

using µPIV,” ASME International Mechanical Engineering Congress and Exposition, IMECE2006-14079,

Chicago, IL, November 2006.

204. L. Cremaschi, B. D. Iverson and S. V. Garimella, “Enhanced Electrohydrodynamic Pumping at the

Microscale,” ASME International Mechanical Engineering Congress and Exposition, IMECE2006-13264,

Chicago, IL, November 2006.

205. H. Wang, J. Y. Murthy and S. V. Garimella, “Transport from a Volatile Meniscus in a Microtube,” ASME

International Mechanical Engineering Congress and Exposition, IMECE2006-13898, Chicago, IL,

November 2006.

206. D. Go, T. S. Fisher and S. V. Garimella, “Direct Simulation Monte Carlo Analysis of Microscale Field

Emission and Ionization of Atmospheric Air,” ASME International Mechanical Engineering Congress and

Exposition, IMECE2006-14476, Chicago, IL, November 2006.

207. S. Trutassanawin, L. Cremaschi, E. A. Groll and S. V. Garimella, “Performance Analysis of a Miniature-

Scale Vapor Compression System for Electronics Cooling: Bread Board Setup,” Paper No. R167,

International Refrigeration and Air Conditioning Conference, West Lafayette, IN, July 17-20, 2006.

208. A. A. Sathe, L. Cremaschi, E. A. Groll and S. V. Garimella, “A New Model for an Electrostatically Actuated

Miniature-Scale Diaphragm Compressor for Electronics Cooling,” Paper No. C152, International

Compressor Engineering Conference, West Lafayette, IN, July 17-20, 2006.

209. P. Chamarthy, S. T. Wereley and S. V. Garimella, “Simultaneous Measurement of Velocity and

Temperature using Cross- Correlation PIV,”

International Symposium on Applications of Laser

Techniques to Fluid Mechanics, Lisbon, Portugal, June 26-29, 2006.

210. P. Chamarthy, S. T. Wereley and S. V. Garimella, “Assessment of Alternate Approaches for Temperature

Measurement using Brownian Motion,”

International Symposium on Particle Image Velocimetry,

Pasadena, CA, September 21-23, 2005.

211. T. Açıkalın, A. Raman and S. V. Garimella, “Two-dimensional Streaming Flows Induced by A Baffled

Piezoelectric Fan,” Flow Induced Vibrations Conference, Paper No. 164, Paris, France, July 6-9, 2004.

212. D. Liu and S. V. Garimella, “Investigation of Liquid Flow in Microchannels,” 8

AIAA/ASME Joint

Thermophysics and Heat Transfer Conference, Paper No. AIAA 2002-2776, pp. 1-10, St. Louis, MO, June

24-26, 2002.

213. P. Buermann, A. Raman and S. V. Garimella, “Dynamics and Topology Optimization of Piezoelectric

Fans,” Thermal Challenges in Next Generation Electronic Systems: THERMES 2002, pp. 113-121, January

2002 (Millpress, Netherlands).

214. S. V. Garimella, “Considerations in the Design of Impingement-Cooled Systems,” Proceedings of the

SMTA International 2001, Chicago, IL, pp. 144-150, September 30 – October 4, 2001.

215. S. V. Garimella, “CFD in Electronics Packaging and Electronic Materials Processing,” Invited lecture

published in Proceedings of the International Symposium on Challenges and New Directions in

Computation of Internal Flows, IIT Madras, India, (Editors V. Ganesan, T. S. Sundararajan, and E. G.

Tulapurkara), pp. 217-240, January 2000.

Conference Publications

(Presentation Based on Review of an Extended Abstract)

216. M. Bongarala, J.A. Weibel, and S.V. Garimella, “The Mechanism for Boiling Crisis using Through-

Substrate Visual and Infrared Measurements,” ASME Summer Heat Transfer Conference (SHTC),

Anaheim, CA, Jul 15-17, 2024.

217. M. Bongarala, J.A. Weibel, and S.V. Garimella, “Simultaneous High-Speed Visual and Infrared

Suresh V. Garimella, July 2024

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Measurements for Tracking Dryspots during Boiling Crisis,” ASME International Technical Conference

and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK),

Garden Grove, CA, Oct 25-27, 2022.

218. M. Bongarala, H. Hu, J.A. Weibel, and S.V. Garimella, “Microlayer Evaporation Enhancement during Pool

Boiling on Structured Surfaces,” ASME International Technical Conference and Exhibition on Packaging

and Integration of Electronic and Photonic Microsystems (InterPACK), Virtual Conference, Oct 26-28,

2021.

219. K. Baraya, J.A. Weibel, and S.V. Garimella, “Experimental Characterization of Heat Pipe Recovery from a

Power-Burst-Induced Dryout,” ASME International Technical Conference and Exhibition on Packaging

and Integration of Electronic and Photonic Microsystems (InterPACK), Virtual Conference, Oct 26-28,

2021.

220. T.A. Kingston, J.A. Weibel, and S.V. Garimella, “Time-Resolved Characterization of Microchannel Flow

Boiling during Transient Heating,” ASME International Technical Conference and Exhibition on Packaging

and Integration of Electronic and Photonic Microsystems (InterPACK), Virtual Conference, Oct 27-29,

2020.

221. M. Bongarala, H. Hu, J.A. Weibel, and S.V. Garimella, “An Evaporative Figure of Merit towards Predicting

Critical Heat Flux on Structured Surfaces,” ASME International Technical Conference and Exhibition on

Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Virtual Conference, Oct

27-29, 2020.

222. M. Clark, J.A. Weibel, and S.V. Garimella, “Impact of Flow Boiling Instabilities on Heat Transfer

Coefficient and Critical Heat Flux in a Microchannel,” ASME International Technical Conference and

Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Virtual

Conference, Oct 27-29, 2020.

223. K. Baraya, J.A. Weibel, and S.V. Garimella, “Compact Modeling of Vapor Chambers using Effective

Anisotropic Properties,” ASME International Technical Conference and Exhibition on Packaging and

Integration of Electronic and Photonic Microsystems (InterPACK), Virtual Conference, Oct 27-29, 2020.

224. A. Miglani, A. Jain, J. A. Weibel, and S. V. Garimella, “Visualization of Ice Valve Formation in a

Microfluidic Chip,” Photogallery at the ASME Summer Heat Transfer Conference, Virtual Conference, July

13-15, 2020.

225. T.P. Allred, J.A. Weibel, and S.V. Garimella, “The Critical Role of Dynamic Surface Wettability on Bubble

Dynamics and Boiling Performance,” ASME International Technical Conference and Exhibition on

Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA, USA, Oct

7-9, 2019,

226. S. Sudhakar, J.A. Weibel, F. Zhou, E.M. Dede, and S.V. Garimella, “Demonstration of Two-Layer Wicks for

High-Heat-Flux Dissipation in Vapor Chambers,” ASME International Technical Conference and Exhibition

on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA, USA,

Oct 7-9, 2019.

227. H. Hu, J. A. Weibel, and S. V. Garimella, “Competition Between Wicking and Evaporation in Structure-

Enhanced Pool Boiling Critical Heat Flux,” 6

International Conference on Micro and Nano Flows

(MNF2018), Atlanta, GA, September 9-12, 2018.

228. K. P. Drummond, J. A. Weibel, and S. V. Garimella, “Effects of Flow Channel Length in a Two-Phase

Hierarchical Manifold Microchannel Heat Sink Array,” 42

Annual Government Microcircuit Applications

& Critical Technology (GOMACTech) Conference, Reno, NV, March 20-23, 2017.

229. T. Guo, M. J. Rau, P. P. Vlachos and S. V. Garimella, “The Effect of Confinement on the Development of

an Axisymmetric Wall-Jet in Confined Jet Impingement,” 68th Annual Meeting of American Physical

Society's Division of Fluid Dynamics, Boston, MA, November 22-24, 2015.

230. T. Guo, M. J. Rau, P. P. Vlachos and S. V. Garimella, “Experimental Investigation of a Confined Developing

Axisymmetric Wall Jet,” 67

Annual Meeting of American Physical Society's Division of Fluid Dynamics,

San Francisco, CA, November 23-25, 2014.

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231. S. Dash, A. Chandramohan, J. A. Weibel and S. V. Garimella, “Buoyant convection in droplets on

superhydrophobic surfaces,” 67

Annual Meeting of American Physical Society's Division of Fluid

Dynamics, San Francisco, CA, November 23-25, 2014.

232. X. Chen, J. A. Weibel and S. V. Garimella, “Hierarchical Superhydrophobic Copper for Sustained Dropwise

Condensation,” Photogallery at the ASME International Mechanical Engineering Congress and

Exposition, Montreal, Canada, November 14-20, 2014.

233. C. Mira-Hernandez, V. Patel, P. Deepu, S. Dawande, J. A. Weibel, S. Basu and S. V. Garimella, “Simulation

of Thermocline Formation in an Experimental Molten-Salt Energy Storage System for Concentrating

Solar Power Applications,” ASME 8

International Conference on Energy Sustainability, Boston, MA, June

30- July 2, 2014.

234. K. Nielson, H.-C. Su, J. A. Weibel and S. V. Garimella, “Comparison of Simulated and Measured Pressure

Drop for Flow Through Periodic Lattice-Frame Heat Exchange Surfaces,” 6

International Conference on

Porous Media (InterPore), Milwaukee, WI, May 27-30, 2014.

235. S. Dash, A. Chandramohan, and S. V. Garimella, “Flow Visualization During Droplet Evaporation on

Hydrophobic and Superhydrophobic Surfaces,” Photogallery at the ASME International Mechanical

Engineering Congress and Exposition, San Diego, CA, November 15-21, 2013.

236. M. J. Rau and S. V. Garimella, “Local Heat Transfer Distribution under an Impinging Round Jet with

Boiling,” Photogallery at the ASME Summer Heat Transfer Conference, Minneapolis, MN, July 14-19,

2013.

237. J. A. Weibel, S. Sarangi and S. V. Garimella, “Pool Boiling Heat Transfer from Deformable Particulate

Beds,” Photogallery at the ASME International Mechanical Engineering Congress and Exposition,

Houston, TX, November 9-15, 2012.

238. M. Dicuangco, S. Dash and S. V. Garimella, “Evaporative Deposition on Superhydrophobic Surfaces,”

Photogallery at the ASME International Mechanical Engineering Congress and Exposition, Houston, TX,

November 9-15, 2012.

239. S. V. Garimella and J. A. Weibel, “Pushing the Limits of Passive Cooling with Engineering Surfaces –

Strategies and Challenges,” Keynote Lecture, Procs. ASME Summer Heat Transfer Conference, Rio

Grande, PR, July 8-12, 2012.

240. R. Ranjan, S. V. Garimella and J. Y. Murthy, “Transport in Passive, High k Thermal Spreaders,”

Photogallery at the ASME International Mechanical Engineering Congress and Exposition, Vancouver,

British Columbia, Canada, November 12-18, 2010.

241. R. Ranjan, J. Y. Murthy and S. V. Garimella, “Marangoni Convection and Thin-film Evaporation in

Microstructured Wicks for Heat Pipes,” Photogallery at the ASME International Mechanical Engineering

Congress and Exposition, Lake Buena Vista, FL, November 13-19, 2009.

242. D. Altman, J. Weibel, S. Garimella, J. Murthy, T. Fisher, S. Kim, Y. Habib, J. Nadler, T. Cui, and R. Ranjan,

“Development of nanostructured wick-based passive heat spreader for thermal management of radio

frequency electronic devices,” International Conference and Exhibition on Device Packaging,

Scottsdale/Fountain Hills, AZ, March 9-12, 2009.

243. S. V. Garimella, “Micro/Nano-scale Thermal Management,” Keynote Lecture at the Second International

Conference on Thermal Issues in Emerging Technologies Theory and Applications (TheTA) Conference,

Cairo, Egypt, December 17-20, 2008.

244. M. L. Kimber, B. Sullivan and S. V. Garimella, “Heat Transfer Patterns with Arrays of Vibrating

Piezoelectric Fans,” Photogallery at the ASME International Mechanical Engineering Congress and

Exposition, Boston, MA, October 31-November 6, 2008.

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245. H. K. Dhavaleswarapu, C. P. Migliaccio, S. V. Garimella and J. Y. Murthy, “Thin-Film Evaporation in a

Droplet,” Photogallery at the ASME International Mechanical Engineering Congress and Exposition,

Boston, MA, October 31-November 6, 2008.

246. N. Kumari, V. Bahadur and S. V. Garimella, “Electrical Actuation of Liquid Droplets on Smooth and

Artificially Structured Surfaces,” 7

International Meeting on Electrowetting, Los Angeles, CA, August

2008.

247. T. Harirchian and S. V. Garimella, “Flow Patterns During Convective Boiling in Microchannels,”

Photogallery at the ASME International Mechanical Engineering Congress and Exposition, Seattle, WA,

November 2007.

248. H. Dhavalewsarapu, S. V. Garimella and J. Y. Murthy, “Temperature Measurements in the Thin-Film

Region of an Evaporating Meniscus,” Photogallery at the ASME Summer Heat Transfer Conference,

Vancouver, Canada, July 2007.

249. D. Liu and S. V. Garimella, “Microfluidic Actuation using Dielectrophoresis,” Photogallery at the ASME

Summer Heat Transfer Conference, Vancouver, Canada, July 2007.

250. H. Dhavalewsarapu, P. Chamarthy, S. V. Garimella, J. Y. Murthy and S. T. Wereley, “Thermocapillary

Convection near an Evaporating Meniscus,” Photogallery at the ASME International Mechanical

Engineering Congress and Exposition, Chicago, IL, November 2006.

251. T. Chen and S. V. Garimella, “Two-Phase Flow Patterns for Convective Boiling in Microchannels,”

Photogallery at the ASME International Mechanical Engineering Congress and Exposition, Chicago, IL,

November 2006.

252. M. Kimber and S. V. Garimella, “Local Heat Transfer Coefficients under Flows Induced by Vibrating

Cantilevers,” Photogallery at the ASME International Mechanical Engineering Congress and Exposition,

IMECE2006-13922, Chicago, IL, November 2006.

253. H. Dhavalewsarapu, P. Chamarthy, S. V. Garimella, J. Y. Murthy and S. T. Wereley, “Experimental

Investigation of Thermocapillary Convection near an Evaporating Meniscus,” ASME International

Mechanical Engineering Congress and Exposition, IMECE2006-13901, Chicago, IL, November 2006.

254. V. Bahadur and S. V. Garimella, “Electrowetting Based Microelectronics Cooling,” 5

International

Meeting on Electrowetting, Rochester, NY, May 31 to June 2, 2006.

255. P. Chamarthy, S. T. Wereley and S. V. Garimella, “Temperature Measurement using Brownian Motion in

the Presence of a Velocity Gradient,”

APS Meeting, Chicago, IL, November 20-22, 2005.

256. H. Wang, X. F. Peng, D. M. Christopher and S. V. Garimella, “Jet Flows around Microbubbles in Subcooled

Boiling,” Photogallery at the ASME International Mechanical Engineering Congress and Exposition,

Anaheim, CA, November 13-19, 2004.

257. H. Wang, X. F. Peng, S. V. Garimella and D. M. Christopher, “Microbubble Return Phenomena during

Subcooled Boling,” Photogallery at the ASME International Mechanical Engineering Congress and

Exposition, Anaheim, CA, November 13-19, 2004.

258. D. Liu, P. S. Lee and S. V. Garimella, “Nucleate Boiling in Microchannels,” Photogallery at the ASME

International Mechanical Engineering Congress and Exposition, Anaheim, CA, November 13-19, 2004.

259. D. Sun, S. V. Garimella, S. Singh and N. Naik, “Process Modeling of Explosives Melt Casting,”

Defence

Manufacturing Conference, November 29-December 2, Las Vegas, NV, 2004.

260. S. V. Garimella and J. E. Simpson, “The Effect of Thermosolutal Convection on Directional Solidification,”

Invited lecture at International Workshop on Solidification Processing, Pune, India, January 10-11, 2000.

261. S. V. Garimella and J. E. Simpson, “Interface Tracking in the Solidification of Alloys and Composites,”

Chia-Shun Yih Memorial Symposium, 13

National U.S. Congress of Applied Mechanics, Gainesville, FL,

June 1998.

Suresh V. Garimella, July 2024

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262. S. V. Garimella and J. E. Simpson, “Interface Propagation in the Processing of Metal Matrix Composites,”

presented at the NSF/DOE Workshop on Thermophysical Phenomena in Microscale Sensors, Devices, and

Structures, Baltimore, MD, August 9, 1997.

Special Publications / Volumes Edited

1. K. Baraya, J. A. Weibel and S. V. Garimella, “Guide to Simulation of Vapor Chambers as Anisotropic

Conduction Heat Spreaders,” Electronics Cooling, pp. 17-21, Spring 2023.

2. “Expanding the Global Reach of the Twenty-First-Century Research University

,” Science & Diplomacy

Vol. 7, No. 1 (March 2018).

3. D. H. Altman, J. A. Weibel, S. V. Garimella, T. S. Fisher, J. H. Nadler and M. North, “Thermal Ground

Plane, Vapor Chamber Heat Spreaders for High Power Packaging Density Electronic Systems,” Electronics

Cooling Vol. 18, pp. 20-27, March 2012.

4. S. V. Garimella, “Academic’s Year: Science fellow looks back on time with the Department,” State, Issue

No. 561, pp. 16-17, November 2011.

5. C. Bradshaw, E. A. Groll and S. V. Garimella,

“Miniature Refrigeration Systems: A Maturing Technology

for Electronics Cooling,” Cooling India Vol. 4(5), pp. 100-106, November-December 2008.

6. M. Iyengar and S. V. Garimella, “Thermal Optimization and Design for Manufacturability of Liquid-Air

Hybrid Cooling Systems,” Electronics Cooling Vol. 14(3), pp. 14-21, August 2008.

7. Editorial, Selected Papers from the 18

National and 7

ISHMT-ASME Heat and Mass Transfer

Conference, Heat Transfer Engineering Vol. 24(4), p. 341-342, 2008.

8. S. V. Garimella and A. S. Fleischer, “Thermal Challenges in Next Generation Electronic Systems

(THERMES II) – Foreword,” Microelectronics Journal Vol. 39, p. 929, 2008.

9. Thermal Challenges in Next Generation Electronic Systems, Proceedings of the International Conference

THERMES 2007, Santa Fe, New Mexico, S.V. Garimella and A. S. Fleischer, Eds., Millpress, Netherlands,

2007.

10. B. D. Iverson, S. V. Garimella and V. Singhal, “Micropumping Technologies for Electronics Cooling,”

Electronics Cooling Vol. 12(2), pp. 28-32, May 2006.

11. V. Singhal and S. V. Garimella, “Active Liquid Cooling of Microprocessors,” Fluent News Vol. 13(2), p. 36,

2004.

12. S. V. Garimella and A. F. Black, “Prediction of Thermal Contact Resistance,” Electronics Cooling Vol 9(4),

pp. 38-39, November 2003.

13. Y. K. Joshi and S. V. Garimella, “Thermal Challenges in Next Generation Electronic Systems,”

Microelectronics Journal Vol. 34(3), p. 169, 2003.

14. S. V. Garimella and Y. K. Joshi, “Contributions from Thermal Challenges in Next Generation Electronic

Systems (THERMES),” IEEE Transactions on Components and Packaging Technologies Vol. 25(4), pp. 567-

568, 2002.

15. Proceedings of the International Mechanical Engineering Congress and Exposition, Associate Editor

(Editor Y. Bayazitoglu), Vol. 1, ASME, New York, 2002.

16. Thermal Challenges in Next Generation Electronic Systems, Proceedings of the International Conference

THERMES 2002, Santa Fe, New Mexico, Y.K. Joshi and S.V. Garimella Eds., Millpress, Netherlands, 2002.

17. J. E. Simpson, H. C. de Groh III and S. V. Garimella, “Directional Solidification of Pure Succinonitrile and a

Succinonitrile-Acetone Alloy,” NASA TM-2000-209381, August 1999.

18. J. E. Simpson, M. Yao, H. C. de Groh III and S. V. Garimella, “Numerical Modeling of Solidification in

Space with MEPHISTO-4 (Part 2),” NASA TM-1998-206630, February 1998.

Suresh V. Garimella, July 2024

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19. Proceedings of the 7

AIAA/ASME Joint Thermophysics and Heat Transfer Conference: Transport

Phenomena in Manufacturing and Materials Processing, M.K. Alam, P. Prescott and S. V. Garimella, eds.,

HTD-Vol.357-4, ASME, New York, 1998.

20. Proceedings of the ASME Heat Transfer Division: Fundamentals of Convection Heat Transfer, S. V.

Garimella, M. Tirumala, et al. eds., HTD-333 (Vol. 2), ASME, New York, 1996.

21. Enhanced Cooling Techniques for Electronics Applications, S. V. Garimella, M. Greiner, M. M. Yovanovich

and V. W. Antonetti eds., HTD-263 (# H00841), ASME, New York, 1993.

22. Book Review: Experimentation and Uncertainty Analysis for Engineers, by H. W. Coleman and W. Glenn

Steele, Experimental Thermal and Fluid Science Vol. 4(2), p. 251, 1991.

23. Book Review: Theory and Practice of Radiation Thermometry, by D. P. DeWitt and G. D. Nutter,

Experimental Thermal and Fluid Science Vol. 4(4), p. 495, 1991.

Suresh V. Garimella, July 2024

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OP-EDS & MEDIA INTERVIEWS

Messages to the University of Vermont community are available here

Changing the Conversation – A special UVM class fosters the ‘almost lost art’ of thoughtful disagreement,

Vermont Magazine, May 2024.

Engineering a Comeback: How Suresh Garimella is Remaking the University of Vermont, Vermont Business

Magazine, April 2024.

Yugaantar – Youth in Transition, keynote address to about 10,000 students at the 13

annual national

conclave of Bharatiya Chhatra Sansad (Indian Students’ Parliament), Pune, India, January 2024.

UVM Successes and Future Plans

, WVMT’s Morning Drive interview, December 2023.

Vermont This Week, PBS Program interview with Stewart Ledbetter, December 2022.

How can we translate basic research into more direct benefits that are showing up in economic

competitiveness and job growth? Next Economy video, Council on Competitiveness, November 7, 2022.

UVM’s Tuition Freeze, WCAX You Can Quote Me interview (starting at 13:33), November 6, 2022.

Teach students to argue. Our democracy depends on it. UVM Magazine, October 24, 2022.

Covid-19 – What Lies Ahead for Universities, The Chronicle of Higher Education panel, April 11, 2022.

The University of Vermont’s view of student success, Commentary in VTDigger, April 1, 2022.

UVM in service to Vermont, Op-ed in Rutland Herald, December 11, 2021.

Updated rules would help UVM ease local housing crisis, Commentary in VTDigger, December 9, 2021.

Companies and Universities: Adjusting to the Changing Funding Landscape, Panelist and Moderator, UIDP

Connect 2021, September 13, 2021.

You Can Quote Me

, WCAX program interview with Darren Perron, May 9, 2021.

Vermont by Degrees: Developing tomorrow’s students, Op-ed in Rutland Herald, February 22, 2021.

Why there’s no excuse needed for transformational change, Op-ed in University Business, February 10, 2021.

Vermont This Week, PBS Program interview with Stewart Ledbetter, January 7, 2020.

Why universities need to reform STEM education, Op-ed in USA Today, December 3, 2020 (with H. Wilson).

Vermont by Degrees: UVM Tuition Freeze, Op-ed in Rutland Herald, November 22, 2020.

A Key Pandemic Defense: Your Values, Op-ed in University Business, November 20, 2020.

The Next Steps for College Covid Testing, The Chronicle of Higher Education panel, October 29, 2020.

How are you Reopening Campus for In-Person Classes amid the Covid-19 Pandemic? Trusteeship Magazine,

September/October 2020.

Land-Grant Mission Tailor-made for Boosting Post-Pandemic Recovery

, Op-ed in New England Journal of

Higher Education, September 11, 2020.

It’s Time for a Safe Return to Campus, Op-ed in Boston Globe, August 15, 2020.

The Secret to a Successful Fall Semester? It’s Testing, Testing, Testing, Op-ed in Inside Higher Ed, August 10,

2020.

We’re Squandering the Potential of Millions of Young People, Op-ed in Scientific American, June 22, 2020.

When Students Succeed, UVM Succeeds, Op-ed in VT Digger, February 27, 2020.

US Share of Global Science and Engineering is Falling, Interview on Federal Drive with Tom Temin, January 24,

2020.

UVM’s Land Grant Mission is Paramount, Op-ed in Rutland Herald and Times Argus, January 14, 2020.

Vermont This Week, PBS Program interview with Stewart Ledbetter, January 7, 2020.

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The University of—and for—Vermont, Op-ed in Rutland Herald and Times Argus, December 7, 2019.

Comcast Newsmakers, Interview with Eric Clemons, November 28, 2019.

Enhancing UVM’s Value My Highest Priority, Op-ed in VT Digger, November 3, 2019.

You Can Quote Me, WCAX Program interview with Darren Perron, November 3, 2019.

A Mind Without Fear, Comments at the Presidential Installation Celebration, October 2019. Comments from

other guests at the Installation Ceremony are available at the link.

Ceding Decisions to Machines, Panel Chair and Moderator, Horasis, Cascais, Portugal, April 2019.

Lifelong Learning for our Digital Times, Panelist, Infosys Confluence 2018, Dana Point, CA, September 2018.

Optimizing Innovation Alliances, Panelist, Global Innovation Summit, Buenos Aires, Argentina, September

2018.

Accelerating Sustainable Transformation in Food Value Chains

, Panelist, Global Innovation Summit, Buenos

Aires, Argentina, September 2018.

Purdue Lands Record Research Funding, TV interview, Inside Indiana Business with Gerry Dick, 13 July, 2018.

Building Capacity for Sustainable Economic Development in the Orinoquía, presentation to leaders from

government, private sector, non-profits and academia, Universidad de Los Andes, Bogotá, Colombia, 26

June, 2018 (press release

University of the Future, Universidad de Los Andes, Bogotá, Colombia, 25 June, 2018.

Transformación de la Orinoquia y la economía colombiana

, full-page op-ed in El Tiempo, Colombia, 25 June,

2018 (in English, Transforming the Orinoquia and the Colombian Economy).

Purdue’s Integrated Data Science Initiative, TV interview, Inside Indiana Business with Gerry Dick, 27 April,

2018.

30-year Master Plan for Purdue’s Discovery Park, WLFI TV, 17 April, 2018.

Purdue and the March for Science's Global Feel, Op-ed on the occasion of the national March for Science,

Journal & Courier, 13 April, 2018.

Expanding the Global Reach of the Twenty-First-Century Research University, Science & Diplomacy, Vol. 7, No.

1 (March 2018).

Excellence in Times of Rapid Change, Chief Guest, Infosys Annual Awards for Excellence, Dallas, 22 March,

2018.

Shaping the Future, Panelist at Elsevier World Sales Conference, Atlanta, 5 February, 2018.

Purdue’s Role in Solving Indiana’s Skills Gaps

, Op-ed in Journal & Courier January 17, 2018; appeared as “How

to Attack Indiana’s Skills Gap,” in IndyStar, January 16, 2018; and as “A Brave New World Without Skills

Gaps,” in Inside Indiana Business, January 23, 2018.

The State of American Science, Panelist, Association of American Universities and The Science Coalition Media

Roundtable, National Press Club, Washington, DC, July 12, 2017.

Make Indiana a Magnet for Jobs

, Op-ed discussing Indiana’s talent gap and brain drain/gain, IndyStar, 28 April,

2017.

Focus at Purdue always on #ScienceForYou, Op-ed on the occasion of the national March for Science, Journal

& Courier and IndyStar, 20 April, 2017.

Expanding Indiana’s Agbiosciences Talent Pipeline, Panelist, 2016 Indiana Agbiosciences Innovation Summit,

Indianapolis, IN, November 2016.

The Future of Life Sciences Startups: The Intersection of Academia and Industry, Plenary remarks and Panel

Moderator, National Centre for Biological Sciences, Bangalore, India, October 2016.

Purdue’s $250M Life Sciences Investment

, TV interview, Inside Indiana Business with Gerry Dick, 14 July, 2016.

Purdue Gains Global Patent Recognition, TV interview, Inside Indiana Business with Gerry Dick, 14 January,

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2016.

Reimagining the Future, Panel Moderator, PHD Chamber, New Delhi, India, October 2015.

Strategic Partnerships to Forge Discovery with Delivery, Hong Kong S&T Park, October 2015.

The University as a Laboratory for Innovation and a Catalyst for Regional Development, Opening Keynote,

Cities for Life Global Meeting, Medellin, Colombia, to an audience of 2000 from 116 cities around the

world, August 2015.

Prosperity and Education: The Challenge of Cooperation in the Americas – The Role of Universities, Panelist,

Foro de Rectores de Las Americas (First Forum of University Presidents) organized by the Government of

Panama at the VII Summit of the Americas, Panama City, April 2015.

Building Strong Partnerships: Case Study of Colombia, NAFSA Latin America Forum, NAFSA 2014 Annual

Conference & Expo, San Diego, CA, May 2014.

Creating the Best Student Experiences: The Purdue-EAFIT Partnership, 100,000 Strong in the Americas

Capacity Building Workshop – Innovating and Scaling-Up U.S.-Western Hemisphere Exchange, San Diego,

CA, May 2014.

Moving Us Forward: Lafayette Roundtable for Immigration Reform, Bibles, Badges and Business Project,

National Immigration Forum, Lafayette, IN, August 2013.

Building Careers for Global Markets, Passage to India Executive Forum, Caterpillar, Peoria, IL, April 2013.

Electricity, Development and Emissions – Competing Policy Choices & Public-Private Partnerships, Seminar on

Renewable Energy and Energy Efficiency, Instituto Tecnologico de Costa Rica, San Carlos, September 2012.

Scientific and Technological Innovation Partnerships for Clean Energy Development, Plenary Lecture,

Workshop on Innovation, Science and Technology for Energy-Efficient Development of Central America,

Universidad Nacional de Costa Rica, Liberia, Costa Rica, September 2012 – to authorities from national

research offices, universities, and research centers of Central America to discuss and identify potential

joint action that promotes and facilitates energy-efficient development of the Region.

Electricity, Development and Emissions, Intel Thermal Technologies Forum, Portland, OR, November 2011.

Competing Policy Choices at the Intersection of Energy and Climate Change – An Engineer’s Role, Purdue

University, November 2011.

Energy Access Versus Emissions: Informing Complex Policy Choices, Honeywell Advanced Technology Lecture

Series, Clearwater, FL, October 2011.

Foundations for Sustainable Partnerships in Teaching and Research, Plenary Session Panelist, U.S.-India Higher

Education Summit hosted by U.S. Secretary of State Hillary Clinton and Indian Minister of Human Resource

Development Kapil Sibal, Washington, D.C., October 2011.

Thermal and Energy Management Technologies for the Next Decade: Challenges and Opportunities,

International Business and Technology Summit on Thermal Management of Electronics, Cambridge, MA,

October 2011.

Electricity, Development, and the Role of Renewables in Africa, Africa Bureau, U.S. Department of State,

Washington, D.C., May 2011.

Renewable and Sustainable Energy Strategies, U.S. Department of Energy, Washington D.C., March 2011.

Electricity, Development and Emissions, White House, Washington, D.C., March 2011.

Nanotechnology, Energy Efficiency, Waste Heat Recovery, Solar Power, U.S.-Russia Bilateral Presidential

Commission Science and Technology Working Group Meeting, Moscow, Russia, March 2011.

Electricity, Development and Emissions

, Jefferson Science Fellows Distinguished Lecture Series on Current

Issues in Science and Technology, U.S. Department of State, Washington, DC, February 2011.

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KEYNOTE AND INVITED LECTURES, SHORT COURSES

2024 Yugaantar – Youth in Transition, keynote address to about 10,000 students at the 13

annual national

conclave of Bharatiya Chhatra Sansad (Indian Students’ Parliament), Pune, India, January 2024.

2023 The Role of Higher Education in Preserving American Values

, panel discussion at the Commonwealth

Club of San Francisco, November 2023.

Accelerating Change: New Frontiers in College & Career Readiness, panel discussion at the CFES Brilliant

Pathways Conference, Burlington, Vermont, November 2023.

Our Commitment to Rural Partnerships, luncheon keynote at the Vermont Economic Development

Authority Annual Meeting, October 2023.

“Urban-Rural Development: Why and How,” RISE Summit

, University of Vermont, June 21, 2023.

“Expanding Place-Based Innovation and Opportunity,” National Commision on Innovation and

Competitiveness, UC Davis, March 27, 2023.

“Planning Workshop for Transforming Indian Higher Education: An Indo-US Partnership Initiative,”

Workshop Chair, MIT-WPU, Pune, India, January 22-23, 2023.

2022 “National Science and Engineering Policy Directions and UVM Opportunities,” College of Engineering

and Mathematical Sciences Seminar, University of Vermont, April 15, 2022.

2021 “The University as a Laboratory for Innovation… and a Catalyst for Regional Development,” Science

Society and Innovation Lecture Series, University of Witswatersrand, South Africa, June 24, 2021

(https://youtu.be/YrA4SLjZ1tk

2020 “Leading a University through a Most Unusual Time – an Engineer’s Perspective,” Virtual Workshop on

COVID-19: Challenges in Research and Education, American Society of Thermal and Fluids Engineers,

August 31, 2020.

2019 “Energy Use in Information and Communications Technologies,” Mechanical Engineering Department

Seminar, University of Vermont, November 15, 2019.

Driving Impact through Multidisciplinary Research, Keynote, Pharmaceutical Industry Process Safety

Conference, West Lafayette, IN, May 2019.

What IF we could actually listen to each other: Improving Impact Through Empathetic Communication,

Keynote at Purdue Ideas Festival – What IF we could Engineer Policy, West Lafayette, IN, April 2019.

2018 “Energy Use in Information and Communications Technologies: The Role of Thermal Management,”

Swiss Federal Institute of Technology (ETH), Zürich, Switzerland, September 4, 2018.

“Validation of Direct Numerical Simulations of Two-Phase Slug Flow Boiling,” IEEE Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), San Diego

CA, May 29-June 1, 2018.

2017 “Energy Use in Information and Communications Technologies: The Role of Thermal Management,”

Keynote Lecture at the International Conference on Applied Energy, Cardiff, England, August 22, 2017.

2016 “The Challenge of Thermal Management,” ITHERM Achievement Award Luncheon Presentation, 15

IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

(ITherm), Las Vegas, NV, June 1, 2016.

2015 “Physics of Thermal Transport and Flow Dynamics during Phase Change at Small Length Scales,” Plenary

Talk, Japan-US Seminar on Two-Phase Flow Dynamics, West Lafayette, IN, May 10-15, 2015.

2013 “Electrical Actuation and Engineered Superhydrophobic Surfaces for Droplet Transport,” Keynote

Lecture, ASME Summer Heat Transfer Conference, Minneapolis, MN, July 14-19, 2013.

“Scientific and Technological Innovation Partnerships for Clean Energy Development,” Purdue-Mexico

Workshop on Sustainability, West Lafayette, IN, April 30, 2013.

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“Energy Storage Options and Opportunities,” Purdue Solar Seminar Series, Purdue University, March 7,

2013.

“Microscale Thermal Transport with Phase Change on Engineered Surfaces,” Mechanical Engineering

Colloquium, MIT, Boston, MA, February 22, 2013.

“Carpe Orbem: Take the Reins of Global Leadership and Public Policy Engagement,” Global Engineering

Professional Seminar, Purdue University, West Lafayette, IN, January 31, 2013.

2012 “Energy Storage Options and Opportunities,” Purdue Energy Forum, West Lafayette, IN, November 7,

2012.

“Pushing the Limits of Passive Cooling with Engineered Surfaces – Strategies and Challenges,” Keynote

Lecture, ASME Summer Heat Transfer Conference, Rio Grande, Puerto Rico, July 8-12, 2012.

“Recent Advances in Passive Two-Phase Cooling - Pushing the Limits with Engineered Surfaces,” Short

Course (with JA Weibel) at ITHERM12, San Diego, CA, May 31, 2012.

“Microscale Thermal Transport with Phase Change – State of the Art and Research Needs,” Keynote

Lecture, 3rd Brazilian Meeting on Two-Phase Flow and Phase Change Heat Transfer (EBECEM2012),

Curitiba, Brazil, May 7, 2012.

“Public Policy Engagement Avenues and Opportunities for Engineers and Scientists,” College of

Engineering, Purdue University, West Lafayette, IN, April 30, 2012.

“Key Drivers and System-Level Solutions for Future Thermal Management Technologies,” Keynote

Lecture, 2

Workshop on Thermal Management in Telecommunication Systems and Data Centers, Santa

Clara, CA, April 25, 2012.

“Automotive Thermal Management Technologies: Challenges and Opportunities,” Delphi Electronics &

Safety, Kokomo, IN, March 29, 2012.

2011 “Policy Engagement Avenues and Opportunities,” Discovery Park Leadership Meeting, Purdue

University, West Lafayette, IN, December 13, 2011.

“Automotive Thermal Management Technologies: Challenges and Opportunities,” Toyota Research

Institute of North America, Ann Arbor, MI, December 9, 2011.

“Carpe Orbem: Take the Reins of Global Leadership in Energy and Climate Change,” President’s

Leadership Class, Purdue University, West Lafayette, IN, December 5, 2011.

“Electricity, Development and Emissions,” Dinner Keynote Talk, Intel Thermal Technologies Forum,

Portland, OR, November 14, 2011.

“Competing Policy Choices at the Intersection of Energy and Climate Change – An Engineer’s Role,”

Mechanical Engineering Graduate Seminar, Purdue University, West Lafayette, IN, November 10, 2011

(http://nanohub.org/resources/13050

Foundations for Sustainable Partnerships in Teaching and Research, Invited Plenary Session Panelist,

U.S.-India Higher Education Summit hosted by U.S. Secretary of State Hillary Clinton and Indian Minister

of Human Resource Development Kapil Sibal, Washington, D.C., October 13, 2011.

“Stranger in a Strange Land: Science and Engineering Impacting Global Policy,” Presentation to the

Engineering Advisory Council, College of Engineering, Purdue University, West Lafayette, IN, April 8,

2011.

“Nanotechnology, Energy Efficiency, Waste Heat Recovery, Solar Power,” Invited Lecture, U.S.-Russia

Bilateral Presidential Commission Science and Technology Working Group Meeting, Moscow, Russia,

March 1, 2011.

2010 “Small-Scale Solutions to Grand Challenges in Thermal Management,” Invited Lecture, 10th

International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion

Applications (PowerMEMS 2010), Leuven, Belgium, December 2, 2010.

Suresh V. Garimella, July 2024

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“Electrically Induced Droplet Transport on Smooth and Superhydrophobic Surfaces,” Distinguished

Speaker Seminar Series, Deparment of Mechanical Engineering, University of Maryland, College Park,

November 19, 2010.

“Perspectives on Challenges and Opportunities in Advanced Thermal Management Technologies,”

Keynote Lecture, Workshop on Thermal Management in Telecommunication Systems and Data Centers,

Dallas, TX, October 25, 2010.

“Microchannel Heat Exchangers for Thermal Management of High-Performance Microelectronics

Systems,” Short Course at ITHERM10, Las Vegas, NV, June 2, 2010.

“Micro/Nano-Scale Thermal Management of Electronics,” Invited Talk, UGIM 2010, West Lafayette, IN,

July 1, 2010.

“Energy Considerations in Computing,” Invited Lecture, Institute Day, Indian Institute of Technology

Madras, Madras, India, April 17, 2010.

“Microchannel Heat Exchangers,” Invited Lecture, International Workshop on Thermal Design and

Management in Electronics, Bombay, India, January 7-8, 2010.

2009 “Advanced Thermal Management Technologies for Avionics Applications,” Raytheon, Indianapolis, IN,

November 16, 2009.

“Small-Scale Heat Transfer,” Invited Lecture at the Heat Exchangers Workshop, United Technologies

Research Corporation, Hartford, CT, October 14, 2009.

“Boiling Heat Transfer and Flow Regimes in Microchannels – a Comprehensive Understanding,” Keynote

Lecture, 15th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009),

Leuven, Belgium, October 8, 2009.

“Microsystems for Energy-Efficient Thermal Management,” Keynote Lecture, InterPACK 09, San

Francisco, CA, July 22, 2009.

“Opportunities in Micro/Nano-Scale Interfacial Transport,” Invited Lecture, Workshop on Near-Wall

Multiphase Flows, CSI Interaktionstag, Seeheim, Germany, July 3, 2009.

“Microscale Examination of Thermal Transport at Interfaces,” Invited Lecture, Center of Smart

Interfaces, Technical University of Darmstadt, Germany, July 2, 2009.

2008 “Micro/Nano-scale Thermal Management,” Keynote Lecture at the Second International Conference on

Thermal Issues in Emerging Technologies Theory and Applications (TheTA) Conference, Cairo, Egypt,

December 18, 2008.

“Advances in Thermal Transport and Materials Research for Electronics Thermal Management,” Saint-

Gobain Northboro Research and Development Center, Northboro, MA, November 3, 2008.

“Microscale Actuation, Transport and Control in Thermal Microsystems,” Department of Mechanical

Engineering, Southern Methodist University, October 3, 2008.

“Microscale Actuation, Transport and Control in Thermal Microsystems,” Catholic University of Leuven,

Belgium, September 11, 2008.

“Energy Considerations in Computing,” Joint Indo-US Workshop on Scalable Nanomaterials for Enhanced

Energy Transport and Conversion, Jawaharlal Nehru Centre for Advanced Scientific Research and GE

John F. Welch Technology Centre, Bangalore, India, August 21, 2008.

“Microscale Actuation, Transport and Control in Thermal Microsystems,” MasterClass on Heat Transfer

Enhancement, Technical University of Darmstadt, Germany, July 30 - August 1, 2008.

“Advanced Cooling Technologies for Next-Generation Microelectronics Systems,” Short Course at

ITHERM08, Orlando, FL, May 28, 2008.

“Advanced Cooling Technologies,” Invited Lecture, International Workshop on Thermal Design and

Management in Electronics, Bangalore, India, January 7-8, 2008.

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“Microscale Thermal Transport and Electromechanical Microfluidic Actuation,” Keynote Lecture,

ASME/ISHMT Heat and Mass Transfer Conference, Hyderabad, India, January 4, 2008.

2007 “Microscale Actuation, Transport, and Control in Thermal Microsystems,” Department of Mechanical

Engineering, University of Iowa, Iowa City, IA, November 29, 2007.

“Recent Advances in Thermal Management Approaches for Military Applications,” Rockwell Collins,

Cedar Rapids, IA, November 28. 2007.

“Recent Advances in Electronics Thermal Management,” Department of Mechanical Engineering,

Nanyang Technological University, Singapore, October 31, 2007.

“Thermal Microsystems for Electronics Thermal Management across Multiple Scales,” IEEE

REL/CPMT/ED Singapore Chapter and Department of Mechanical Engineering, National University of

Singapore, Singapore, October 30, 2007.

“Thermal Microsystems for Electronics Thermal Management across Multiple Scales,” Leaders in

Mechanical Engineering Seminar Series, Department of Mechanical Engineering, University of Maryland,

College Park, October 19, 2007.

“Electrically Actuated Microscale Flows for Microelectronics Cooling,” Keynote Lecture, The Eighteenth

International Symposium on Transport Phenomena, Daejeon, Korea, August 29, 2007.

“Recent Advances in Thermal Management Technologies for Consumer Electronics,” Samsung

Electronics Co. Ltd., Suwon City, Korea, August 28, 2007.

“Thermal Microsystems for Electronics Thermal Management across Multiple Scales,” Invited Lecture,

Cooling Zone Summit, Natick, MA, August 22, 2007.

“Thermal Microsystems for Electronics Thermal Management across Multiple Scales,” Keynote Lecture,

InterPACK 07, Vancouver, Canada, July 10, 2007.

“Advanced Thermal Management Technologies across Multiple Scales,” Short Course at InterPACK 07,

Vancouver, Canada, July 8, 2007.

“Measurements of Flow Boiling Heat Transfer Coefficients in a Mini-Channel Evaporator for Electronics

Cooling,” (with S Bertsch and E Groll) in Seminar 50: Recent Developments in Microchannel Heat

Transfer and Fluid Flow, 2007 ASHRAE Winter Meeting, Dallas, TX, January 30, 2007.

2006 “Thermal Microsystems for Electronics Thermal Management across Multiple Scales,” Department of

Mechanical Engineering, University of Minnesota, MN, December 6, 2006.

“Thermal Microsystems for On-Chip Thermal Engineering,” Plenary Lecture, International Conference on

Micro and Nano Technologies (ICMNT06) organized by the UNESCO/IAEA International Center for

Theoretical Physics, Tizi-Ouzou, Algeria, November 19, 2006.

“Fluid Mechanics at Micro- and Nano-Scales,” Short Course, International Conference on Micro and

Nano Technologies (ICMNT06) organized by the UNESCO/IAEA International Center for Theoretical

Physics, Tizi-Ouzou, Algeria, November 20-22, 2006.

“Advances in Electronics Cooling for Automotive Applications,” Emerging Technologies Seminar, Delphi

Electronics and Safety, Kokomo, IN, October 30, 2006.

“Emerging Mesoscale Thermal Management Technologies,” Invited Lecture at International Electronics

Packaging Symposium, GE Global Research Center, Schenectady, October 24, 2006.

“Thermal Microsystems for Electronics Thermal Management across Multiple Scales,” Department of

Mechanical Engineering, University of Illinois, Urbana-Champaign, September 25, 2006.

“Thermal Microsystems for Thermal Management across Multiple Scales,” Symposium on Thermal

Management of Electronics Components through Direct Fluid Cooling, HP Labs, Palo Alto, CA, September

1, 2006.

“Emerging Meso-Scale Thermal Management Technologies,” RTI, Inc., Raleigh, NC, July 26, 2006.

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“Thermal Microsystems for On-Chip Thermal Engineering,” School of Energy and Power Engineering,

Xi’an Jiaotong University, Xi’an, China, June 21, 2006.

“Advanced Thermal Management Technologies for Next-Generation Microelectronics,” Short Course at

Xi’an Jiaotong University, Xi’an, China, June 21-25, 2006.

“Advanced Thermal Management Technologies for Next-Generation Microelectronics Systems,” Short

Course at ITHERM 06, San Diego, CA, May 30, 2006.

“Thermal Microsystems for On-Chip Thermal Engineering,”Nanotutorial also posted on the nanoHUB as

part of the Nanotechnology 501 Seminar Series (http://www.nanohub.org/resources/?id=1182

), March

21, 2006.

“Forced Convection and Microchannel Transport,” Invited Lecture, International Workshop on Thermal

Design and Management in Electronics, Bangalore, India, January 10-11, 2006.

“Emerging Technologies in Thermal Microsystems,” Purdue University, December 1, 2006.

2005 “Emerging Meso-Scale Thermal Management Technologies for Microelectronics,” Department of

Mechanical Engineering, University of Illinois, Urbana-Champaign, October 4, 2005.

“On-Chip Integration of Novel Cooling Strategies through Electrothermal Co-Design,” Invited Lecture in

Phonon Engineering for Thermal Management of ICs, 6

International Workshop on Future Information

Proessing Technologies (IWFIPT), Asheville, NC, August 29, 2005.

“Emerging Meso-Scale Technologies for High-Heat-Flux Electronics Thermal Management,” Invited

Lecture, Cooling Zone Summit, Natick, MA, August 17, 2005.

“Integration of Novel Microelectronics Cooling Strategies through Electrothermal Co-Design,” Purdue

University Silicon Valley Symposium, Santa Clara, CA, July 26, 2005.

“Microchannel Heat Sinks and Micropumps,” Short Course at InterPACK 05, San Francisco, CA, July 17,

2005.

“Advanced Thermal Management Technologies for Next Generation Microelectronics Systems,” Short

Course at InterPACK 05, San Francisco, CA, July 17, 2005.

“Integration of Novel Localized Cooling Strategies Through Electro-Thermal Co-Design,” DARPA MTO

Workshop on Site-Specific Thermal Management of ICs, MEMS, and Integrated Systems, San Diego, CA,

January 13-14, 2005.

2004 “Advances and Challenges in Mesoscale Thermal Management Technologies for Microelectronics,”

Sematech Topical Research Conference, Austin, TX, October 26, 2004.

“Advances in Mesoscale Thermal Management Technologies for Microelectronics,” Keynote Lecture,

THERMINIC, 10

International Workshop on Thermal Investigations of ICs and Systems, Côte d’Azur,

France, September 30, 2004.

“Advances in Mesoscale Thermal Management Technologies for Microelectronics,” Keynote Lecture,

International Symposium on Heat Transfer, Beijing, China, June 16, 2004.

“Microchannel Heat Sinks and Micropumps,” Short Course at ITHERM 04, Las Vegas, NV, June 1, 2004.

“Advanced Thermal Management Technologies for Next Generation Microelectronics Systems,” Short

Course at ITHERM 04, Las Vegas, NV, June 1, 2004.

“Emerging Meso-Scale Thermal Management Technologies,” Department of Mechanical Engineeirng,

University of Notre Dame, South Bend, IN, April 13, 2004.

“Microchannel Heat Sinks with Integrated Micropumps,” Workshop on Thermal Management of

Electronic Equipment, Bangalore, India, January 2, 2004.

2003 “Novel Meso-scale Cooling Technologies for Thermal Management in Space,” Wright Patterson Air Force

Base, OH, October 24, 2003.

“Microchannel Heat Sinks with Integrated Micropumps,” JSME Workshop Design and Manufacturing of

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High-Performance Heat Sinks for Microelectronic Equipment, Tokyo, Japan, October 15, 2003.

“Enabling Meso-scale Thermal Management Technologies for Naval Cooling Applications,” ONR Thermal

Management Workshop, Arlington, VA, October 7, 2003.

“Enabling Thermal Management Technologies for Next Generation Microelectronics Systems,” Intel

Corporation, Chandler, AZ, September 26, 2003.

“Novel Mesoscale Thermal Management Technologies for Microelectronics,” Department of Mechanical

Engineering, University of Arizona, Tucson, AZ, September 25, 2003.

“Enabling Thermal Management Technologies for Next Generation Microelectronic Systems,” Pohang

Institute of Science and Technology, Pohang, Korea, August 26, 2003.

“Microchannel Heat Sinks with Integrated Micropumps,” The 3rd Colloquium on Micro/Nano Thermal

Engineering, Micro Thermal System Research Center (MTSRC), Seoul National University, Seoul, Korea,

August 25, 2003.

“Recent Advances in Thermal Management Technologies for Microelectronics,” Samsung Electronics,

Suwon, Korea, August 23, 2003.

“Novel Mesoscale Thermal Management Technologies for Microelectronics,” Korea Advanced Institute

of Science and Technology, Taejon, Korea, August 22, 2003.

“Microchannel Cooling Systems with Integrated Fluid Actuation for Micro Cryocoolers,” DARPA

Microsystems Technology Office Cryocooler Workshop, Mystic, CT, July 14, 2003.

“Analysis, Experiments and Computer Modeling of Melt Casting Processes,” US Army ARDEC, Picatinny

Arsenal, NJ, May 8, 2003.

“Novel Mesoscale Thermal Management Technologies for Microelectronics,” Department of Mechanical

Engineering, Louisiana State University, Baton Rouge, LA, February 21, 2003.

“Enabling Thermal Management Technologies for Next Generation Microelectronic Systems,” Bell Labs,

Lucent Technologies, Murray Hill, NJ, January 27, 2003.

2002 “Enabling Thermal Management Technologies for Microelectronic Systems,” BAE Systems, Nashua, NH,

December 9, 2002.

“Microscale Fluid Transport and Pumping Developments for Microchannel Cooling Systems,” Next-

GenerationThermal Management Materials and Systems Conference, Dallas, October 30, 2002.

“Overview of Compact High-Performance Cooling Technologies,” Eaton Corporation, Milwaukee, WI,

July 23, 2002.

“Overview of Compact High-Performance Cooling Technologies,” Rockwell Automation, Milwaukee, WI,

July 22, 2002.

“Single-Phase Flow and Heat Transfer in Microchannel Heat Sinks,” Analysis and Design of Microchannel

Heat Exchangers, Short Course of the International Institute of Refrigeration held at Purdue University,

West Lafayette, July 14, 2002.

“Advances in Thermal Management of Microelectronic Systems,” Honeywell, Los Angeles, CA, May 29,

2002.

“Miniature Piezoelectric Fans for Fuel-Cell Applications,” Motorola Solid State Research Center, Tempe,

AZ, April 1, 2002.

“Tracking Phase Interfaces in Thermal Processing Applications,” PDE Seminar, School of Mathematics,

Purdue University, West Lafayette, IN, February 28, 2002.

2001 and Prior

“Advances in Thermal Management of Microelectronic Systems,” Emerging Technology Symposium,

Delphi Delco Electronic Systems, Kokomo, IN, January 29, 2001.

“Advances in Thermal Management of Microelectronic Systems,” Intel Corporation, Chandler, AZ,

Suresh V. Garimella, July 2024

Page 70 of 71

January 19, 2001.

“Thermal Management in Microelectronic Systems,” Philips Research Center, Eindhoven, The

Netherlands, August 18, 2000.

“Moving Interfaces in Phase-Change Processes,” RWTH, Aachen, Germany, August 22, 2000.

“Transport on Multiple Scales in Materials Processing,” School of Materials Science and Engineering,

Purdue University, West Lafayette, IN, January 24, 2000.

“CFD in Electronics Packaging and Electronic Materials Processing,” International Symposium on

Challenges and New Directions in Computation of Internal Flows, IIT Madras, India, January 8, 2000.

“The Effect of Thermosolutal Convection on Directional Solidification,” International Workshop on

Advances in Solidification Processing, Pune, India, January 10, 2000.

“High-Performance Approaches to Thermal Management of Microelectronics,” Nokia Research Center,

Helsinki, Finland, November 22, 1999.

“Numerical Treatment of Moving Interfaces in Phase-Change Processes,” National Aeronautics and

Space Administration–Lewis Research Center, Cleveland, OH, July 24, 1998.

“Interface Tracking in Crystal Growth, Alloy Solidification and Composites Processing,” University of

Maryland-College Park, MD, February 20, 1998.

“High-Performance Cooling Techniques for Computers and Microelectronics,” Bharat Heavy Electricals

Ltd., Corporate Research and Development, Hyderabad, India, December 16, 1997.

“High-Performance Cooling Techniques for Computers and Microelectronics,” Osmania University,

Hyderabad, India, December 19, 1997.

“Recent Developments in High-Performance Cooling Techniques for Electronic Systems,” Keynote

lecture at the Eurotherm Seminar on Thermal Management of Electronic Systems, Nantes, France,

September 24, 1997.

“High-Performance Techniques for Electronics Cooling,” Workshop Speaker, Yuan-Ze Institute of

Technology, Taiwan, March 25, 1997.

“Interface Tracking in Crystal Growth, Alloy Solidification and Composites Processing,” Pennsylvania

State University, State College, PA, January 20, 1997.

“Thermal Management of Microelectronics,” University of Western Sydney, Australia, October 24, 1995.

“Solidification Heat Transfer and Materials Processing,” Lecture Series delivered in the School of

Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, Australia,

September 13 to October 10, 1995.

“Jet Impingement Heat Transfer - Experiments and Computations,” The University of New South Wales,

Sydney, Australia, September 18, 1995.

“Microelectronics Cooling with Impinging Jets,” Departmental Colloquium, University of Sydney,

Australia, September 6, 1995.

“Solidification of Alloys: Interface Stability and Suppression of Segregation,” Departmental Colloquium,

University of Sydney, Australia, August 30, 1995.

“Reducing Inter-Chip Temperature Differences in Computers Using Coolant Flow Modulation,”

International Electronics Packaging Conference, Binghamton, NY, October 1, 1993.

“Thermal Management of High-Density Microelectronics,” University of Wisconsin-Madison, October

21, 1992.

“Fluid Dynamic Characteristics of the Flow over an Array of Large Roughness Elements,” InterSociety

Conference on Thermal Phenomena in Electronic Systems (ITHERM III), Austin, TX, February 6, 1992

(invited talk).

“Heat Transfer in Electronic and Optical Systems,” Hewlett-Packard Company, Palo Alto, CA, October 25,

Suresh V. Garimella, July 2024

Page 71 of 71

1991.

“Heat Transfer in Electronic and Optical Systems,” Lawrence Livermore National Laboratory, Livermore,

CA, October 24, 1991.

“Thermal Management in Supercomputers,” Cray Research, Inc., Chippewa Falls, WI, August 14, 1991.

“Thermal and Hydrodynamic Characteristics of an Array of Protruding Elements in Forced Convection,”

Stanford University, Stanford, CA, December 19, 1990.